Search Results - "Wenger, G.M."

The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version) by Coyle, R.J., Popps, D.E.H., Mawer, A., Cullen, D.P., Wenger, G.M., Solan, P.P.

“…Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless…”
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Solder metallization interdiffusion in microelectronic interconnects by Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.

“…We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two…”
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Application Model for Organic Solderability Preservatives by Wenger, G.M, Machusak, D.A, Parker, J.L

“…Organic solderability preservative (OSP) coatings are not new. They have been used successfully with aggressive water soluble flux for assembly of through-hole…”
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The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array by Coyle, R.J., Wenger, G.M., Hodges, D.E., Mawer, A., Cullen, D.P., Solan, P.P.

“…Electrolytic and electroless Ni/Au are common pad surface finishes on area array (BGA or CSP) packages and printed wiring boards (PWB). The electroless…”
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Shear testing and failure mode analysis for evaluation of BGA ball attachment by Erich, R., Coyle, R.J., Wenger, G.M., Primavera, A.

“…With increasing focus on BGA technology as a high performance package, there is an urgent need to develop industry-wide standards for package quality and…”
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Advances in Cleaning of Surface Mount Assemblies by Wenger, G.M., Guth, L.A., Dickinson, D.A.

“…Non-corrosive rosin fluxes have historically been used for telephone communications assemblies because they provide a measure of reliability even if the flux…”
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Terpene cleaning of electronic assemblies by Wenger, G.M., Tashjian, G.P.

“…The technology and methods developed to safely spray the semi-aqueous terpene hydrocarbon Bioact EC-7 are described. This technique is used to remove…”
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Technology developments for terpene cleaning of electronic assemblies by Tashjian, G.P., Wenger, G.M.

“…Following extensive process testing and machine development, a spray-cleaning facility utilizing the semiaqueous terpene hydrocarbon Bioact EC-7 was installed…”
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