Search Results - "Watanabe, Naoya"

Clinical outcomes of perforator-based propeller flaps versus free flaps in soft tissue reconstruction for lower leg and foot trauma: a retrospective single-centre comparative study by Ota, Mitsutoshi, Motomiya, Makoto, Watanabe, Naoya, Shimoda, Kohei, Iwasaki, Norimasa

“…The efficacy and safety of perforator-based propeller flaps (PPF) versus free flaps (FF) in traumatic lower leg and foot reconstructions are debated. PPFs are…”
Get full text

Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices by Miki, Takuji, Nagata, Makoto, Sonoda, Hiroki, Miura, Noriyuki, Okidono, Takaaki, Araga, Yuuki, Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya

“…This article presents a cryptographic key protection technique from physical security attacks through Si-backside of IC chip. Flip-chip packaging leads to a…”
Get full text

Efficacy of superficial femoral artery as a recipient in free flap reconstruction around the knee: Four case reports and a literature review by Ota, Mitsutoshi, Motomiya, Makoto, Watanabe, Naoya, Kitaguchi, Kazuya, Iwasaki, Norimasa

“…Reconstructing soft tissue defects around the knee with free flaps presents challenges in recipient vessel selection. Although the superficial femoral artery…”
Get full text

Absolute value of visceral fat area measured on computed tomography scans and obesity-related cardiovascular risk factors in large-scale Japanese general population (the VACATION-J study) by Hiuge-Shimizu, Aki, Kishida, Ken, Funahashi, Tohru, Ishizaka, Yuko, Oka, Rie, Okada, Minoru, Suzuki, Shizu, Takaya, Norihide, Nakagawa, Tohru, Fukui, Toshiki, Fukuda, Hiroshi, Watanabe, Naoya, Yoshizumi, Tohru, Nakamura, Tadashi, Matsuzawa, Yuji, Yamakado, Minoru, Shimomura, Iichiro

“…The management of cardiovascular risk factors is important for prevention of atherosclerotic cardiovascular diseases (ACVD). Visceral fat accumulation plays an…”
Get more information

Lifestyle factors associated with gastroesophageal reflux disease in the Japanese population by Matsuki, Nobuyuki, Fujita, Tsuyoshi, Watanabe, Naoya, Sugahara, Atsushi, Watanabe, Akihiko, Ishida, Tsukasa, Morita, Yoshinori, Yoshida, Masaru, Kutsumi, Hiromu, Hayakumo, Takanobu, Mukai, Hidekazu, Azuma, Takeshi

“…Background We aimed to clarify the lifestyle factors associated with erosive esophagitis and non-erosive reflux disease (NERD) in a Japanese population…”
Get full text

A simple free flap strategy using end-to-side anastomosis to the main vessels in injured extremity by Motomiya, Makoto, Watanabe, Naoya, Ota, Mitsutoshi, Shimoda, Kohei, Kawamura, Daisuke, Iwasaki, Norimasa

“…BackgroundDuring free flap surgery, the surgeon sometimes encounters problems with anastomosis such as intractable arterial spasms or vessel size discrepancy…”
Get full text

Residual stress investigation of via-last through-silicon via by polarized Raman spectroscopy measurement and finite element simulation by Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

“…The residual stresses induced around through-silicon vias (TSVs) by a fabrication process is one of the major concerns of reliability. We proposed a…”
Get full text

Efficacy of the microscopic parachute end-to-side technique for creating large-to-small venous anastomoses in free flaps in the extremities by Motomiya, Makoto, Watanabe, Naoya, Ota, Mitsutoshi, Shimoda, Kohei, Kawamura, Daisuke, Iwasaki, Norimasa

“…The availability of reliable and suitably sized veins is limited for creating free flaps to treat severe trauma and infection, and it is important to manage…”
Get full text

Validation of TSV thermo-mechanical simulation by stress measurement by Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

“…Because of the large mismatch in coefficients of thermal expansion (CTE) between copper vias and the silicon substrate in through-silicon vias (TSVs), thermal…”
Get full text

Fabrication and stress analysis of annular-trench-isolated TSV by Feng, Wei, Bui, Tung Thanh, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

“…The large mismatches among the coefficients of thermal expansion (CTE) of the metal via, insulator liner, and Si substrate of the through-silicon via (TSV)…”
Get full text

Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer by Watanabe, Naoya, Kikuchi, Hidekazu, Yanagisawa, Azusa, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Nakamura, Akio

“…We combined a "via-last through-silicon via (TSV) process consisting of notchless Si etching and wet cleaning of the first metal layer" with the solder bonding…”
Get full text

Simultaneous Bilateral Proximal Humerus Fractures Treated with Single-Stage Bilateral Reverse Shoulder Arthroplasty by Tokuhiro, Taiki, Urita, Atsushi, Kameda, Yusuke, Motomiya, Makoto, Watanabe, Naoya, Iwasaki, Norimasa

“…Introduction. Simultaneous bilateral fractures of the proximal humerus are infrequent, and simultaneous bilateral three- or four-part fractures are even rarer…”
Get full text

Development of a high-yield via-last through silicon via process using notchless silicon etching and wet cleaning of the first metal layer by Watanabe, Naoya, Kikuchi, Hidekazu, Yanagisawa, Azusa, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Nakamura, Akio

“…A high-yield via-last through silicon via (TSV) process has been developed using notchless Si etching and wet cleaning of the first metal layer. In this…”
Get full text

Reduction of Visceral Fat Correlates with the Decrease in the Number of Obesity-Related Cardiovascular Risk Factors in Japanese with Abdominal Obesity (VACATION-J Study) by Hiuge-Shimizu, Aki, Kishida, Ken, Funahashi, Tohru, Ishizaka, Yuko, Oka, Rie, Okada, Minoru, Suzuki, Shizu, Takaya, Norihide, Nakagawa, Tohru, Fukui, Toshiki, Fukuda, Hiroshi, Watanabe, Naoya, Yoshizumi, Tohru, Ohira, Tetsuya, Nakamura, Tadashi, Matsuzawa, Yuji, Yamakado, Minoru, Shimomura, Iichiro

“…Aim: Visceral fat accumulation is associated with obesity-related cardiovascular risk factor accumulation and atherosclerosis. The present study investigated…”
Get full text

Fabrication of Back-Side Illuminated Complementary Metal Oxide Semiconductor Image Sensor Using Compliant Bump by Watanabe, Naoya, Tsunoda, Isao, Takao, Takayuki, Tanaka, Koichiro, Asano, Tanemasa

“…We fabricated a back-side illuminated (BSI) complementary metal oxide semiconductor (CMOS) image sensor in which a very-thin BSI photodiode array chip was…”
Get full text

The inflammation-lipocalin 2 axis may contribute to the development of chronic kidney disease by Hashikata, Atsushi, Yamashita, Akiko, Suzuki, Shigeki, Nagayasu, Shintaro, Shinjo, Takanori, Taniguchi, Ataru, Fukushima, Mitsuo, Nakai, Yoshikatsu, Nin, Kazuko, Watanabe, Naoya, Asano, Tomoichiro, Abiko, Yoshimitsu, Kushiyama, Akifumi, Nagasaka, Shoichiro, Nishimura, Fusanori

“…Chronic kidney disease (CKD) is an important risk factor for coronary heart disease, and previous studies indicated the involvement of low-grade inflammation…”
Get full text

Novel through silicon via exposure process comprising Si/Cu grinding, electroless Ni-B plating, and wet etching of Si by Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Bandoh, Tsubasa, Yamamoto, Eiichi

“…We proposed a novel through silicon via (TSV) exposure process comprising Si/Cu grinding, electroless Ni-B plating, and wet etching of Si. To grind Cu and Si…”
Get full text

Investigation of metal contamination induced by a through silicon via reveal process using direct Si/Cu grinding and residual metal removal by Watanabe, Naoya, Aoyagi, Masahiro, Katagawa, Daisuke, Bandoh, Tsubasa, Mitsui, Takahiko, Yamamoto, Eiichi

“…We investigated metal contamination induced by a through silicon via (TSV) reveal process using direct Si/Cu grinding and residual metal removal. A…”
Get full text

Damage Evaluation of Wet-Chemical Si-Wafer Thinning/Backside Via Exposure Process by Watanabe, Naoya, Miyazaki, Takumi, Yoshikawa, Kazuhiro, Aoyagi, Masahiro

“…To realize low-cost and damage-less through silicon via (TSV) formation, we evaluated the damage caused by a new wet-chemical Si-wafer thinning/backside via…”
Get full text

Fabrication of a membrane probe card using transparent film for three-dimensional integrated circuit testing by Watanabe, Naoya, Suzuki, Motohiro, Kawano, Kenji, Eto, Michiyuki, Aoyagi, Masahiro

“…We fabricated a novel membrane probe card using a transparent film for the chip-level testing of a three-dimensional integrated circuit (3D-IC). In this…”
Get full text