A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, a...

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Bibliographic Details
Published in:	Micromachines (Basel) Vol. 14; no. 6; p. 1149
Main Authors:	Wang, Haoyu, Ma, Jianshe, Yang, Yide, Gong, Mali, Wang, Qinheng
Format:	Journal Article
Language:	English
Published:	Switzerland MDPI AG 29-05-2023 MDPI
Subjects:	advanced packaging Design optimization Electrical properties Forecasts and trends Innovations Integrated circuits Mechanical properties optimization Optimization techniques package reliability Packaging Power supply Reliability Review Semiconductor chips Semiconductors system-in-package Technology Thermal management advanced packaging integrated circuits package reliability optimization system-in-package
Online Access:	Get full text
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Summary:	The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors-thermal management, mechanical stress and electrical properties-can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-3 content type line 23 ObjectType-Review-1
ISSN:	2072-666X 2072-666X
DOI:	10.3390/mi14061149