Search Results - "Wan, Lixi"

Linearity Enhancement Techniques for PGA Design by Wang, Yujun, Wang, Yi, Wan, Lixi, Jin, Zhi

“…This paper presents some techniques to improve the linearity of traditional resistive feedback PGAs. By utilizing the switched op-amp in the PGA, the MOS…”
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Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model by Chen, Cheng, Yu, Daquan, Wang, Teng, Xiao, Zhiyi, Wan, Lixi

“…The fan-out package is designed to provide increased I/O density within a reduced form factor at a lower cost, as well as good electrical performance and…”
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The Design of a 1–6 GHz Broadband Double-Balanced Mixer by Wang, Yujun, Tian, Jianglai, Wang, Bo, Wan, Lixi, Jin, Zhi

“…This brief proposes a 1–6 GHz broadband double-balanced mixer. On the basis of the standard Marchand balun mixer, two techniques to enhance the performance of…”
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Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station by Tian, Gengxin, Li, Jun, Hou, Fengze, Zhang, Wenwen, Guo, Xueping, Cao, Liqiang, Wan, Lixi

“…In the current 4G Long Term Evolution and the incoming 5G mobile communication technology, as the number of radio frequency (RF) devices in the RF front-end…”
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Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application by Tian, Gengxin, Li, Jun, Liu, Xiaofang, Wan, Lixi, Cao, Liqiang

“…Near-field measurement, as an efficient method for studying the electromagnetic interference (EMI) problem, is becoming increasingly important. The calibration…”
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Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application by Su, Meiying, Yu, Daquan, Liu, Yijun, Wan, Lixi, Song, Chongshen, Dai, Fengwei, Xue, Kai, Jing, Xiangmeng, Guidotti, Daniel

“…The dielectric via liner of through silicon vias was deposited at 400°C using a tetraethyl orthosilicate (TEOS)-based plasma enhanced chemical vapor deposition…”
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A super-resolution Fresnel zone plate and photon sieve by Jia, Jia, Xie, Changqing, Liu, Ming, Wan, Lixi

“…Realizing a smaller or sharper diffractive center spot is a valuable research aim in soft X-ray focus and other related research applications. Fresnel zone…”
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Board-level optical-to-electrical signal distribution at 10 gb/s by Yin-Jung Chang, Guidotti, D., Lixi Wan, Gaylord, T.K., Gee-Kung Chang

“…An opto/electrical prototype for on-board optical-to-electrical signal broadcasting operating at 10 Gb/s per channel over an interconnect distance of 10 cm is…”
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Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint by He, Hongwen, Cao, Liqiang, Wan, Lixi, Zhao, Haiyan, Xu, Guangchen, Guo, Fu

“…The electromigration test was conducted in Cu/Sn-58Bi/Cu solder joint with high current density of 10 4 A/ cm 2 . Results showed that a large number of…”
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A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth by Liu Fengman, Li Baoxia, Li Zhihua, Wan Lixi, Gao Wei, Chu Yanbiao, Du Tianmin, Song Jian, Xiang Haifei, Wang Haidong, Yang Kun, Yang Binbin

“…The high-speed parallel optical transmitter module based on VCSEL/PD array, high-speed specialized integrated circuit, fiber array micro-optical components…”
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Processing and Dielectric Properties of Nanocomposite Thin Film "Supercapacitors" for High-Frequency Embedded Decoupling by Raj, P.M., Balaraman, D., Govind, V., Abothu, I.R., Lixi Wan, Gerhardt, R., Swaminathan, M., Tummala, R.

“…The embedded decoupling capacitor problem has been pursued by several groups and industry around the world over the past decade. Currently, popular…”
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A 10-Gbps x 12-Channel Pluggable Parallel Optical Transceiver Based on CXP Interface Specifications by KUN YANG, ZHIHUA LI, BAOXIA LI, WEI GAO, FENGMAN LIU, JIAN SONG, LIXI WAN

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Hybrid Integration of End-to-End Optical Interconnects on Printed Circuit Boards by Zhaoran Rena Huang, Guidotti, D., Lixi Wan, Yin-Jung Chang, Jianjun Yu, Jin Liu, Hung-Fei Kuo, Gee-Kung Chang, Fuhan Liu, Tummala, R.R.

“…This paper discusses the integration of an end-to-end optical interconnect testbed on printed circuit boards using inexpensive off-the-shelf, bare die,…”
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The Redistribution Layer-First Embedded Fan-Out Wafer Level Packaging for 2-D Ultrasonic Transducer Arrays by Lu, Yao, Yu, Daquan, Wan, Lixi, Zhang, Xiaodong, Xiang, Min, Zhang, Zhiqiang, Su, Min, Qiu, Weibao

“…In this letter, the redistribution layer-first embedded fan-out wafer-level packaging (RDL-first FO-WLP) for 2-D ultrasonic transducer arrays with individual…”
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Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications by Cheng Chen, Teng Wang, Daquan Yu, Shuying Ma, Kai Zhu, Zhiyi Xiao, Lixi Wan

“…In this paper, ultra-thin eSiFO packages with body thickness of 150 μm were presented and the reliability were comprehensively studied, with an emphasis on…”
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SiP/SoP technology and its implementation by Lixi Wan

“…ldquoSystem-in-packagerdquo(SiP) and ldquosystem-on-packagerdquo (SoP) are different but similar in concepts. SiP and SoP definition were found in many open…”
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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate by Chen, Cheng, Hou, Fengze, Liu, Fengman, She, Qian, Cao, Liqiang, Wan, Lixi

“…The RF SiP module based on LTCC substrate has attracted considerable attention in wireless communications for the last two decades. However, the…”
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Thermal characterization of a novel 3D stacked package structure by CFD simulation by Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, Lixi Wan

“…In this paper, a novel 3D stacked package structure with horizontal fins is designed to solve the heat dissipation issue. In order to verify the thermal…”
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The tolerance method for electromagnetic scattering by Lixi, Wan

“…The original electromagnetic field will be disturbed when the parameter of a local region is changed. To find the distribution of the disturbed electromagnetic…”
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Fabrication and reliability evaluation of a novel package-on-package (PoP) structure based on organic substrate by Xiaofeng Sun, Lixi Wan, Yuan Lu

“…The package-on-package(PoP) stacking technique with the advantages of printed-circuit-board(PCB) space saving, flexible combination and assembly has become a…”
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