Search Results - "Waltener, G." :: Katalog Arama

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A 42.24 Gb/s Channel Bonding Up-Converter with integrated multi-LO generation in 45nm CMOS by Siligaris, A., Courouve, P., Waltener, G., Hamani, A., Dehos, C., Gonzalez-Jimenez, J. L.

Published in 2023 IEEE 23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (22-01-2023)
“…This paper presents an energy-efficient wideband Vband channel-bonding up-converter. The circuit, fabricated in 45nm CMOS RFSOI technology is composed of four…”

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A Versatile Platform towards High Reliability Compact Package for Digital Chips by Ferrandon, C., Castagne, L., Kholti, B., Waltener, G., Lemaire, R., Puyal, V., Souriau, J.-C, Simon, G., Lacrevaz, T., Peltier, J.-P, Toffanin, L.

Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01-05-2017)
“…A technological multi-chip module with a large silicon interposer has been designed, manufactured and characterized for space and airborne applications. It…”

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