Search Results - "Walker, D.M.H."
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Longest-path selection for delay test under process variation
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01-12-2005)“…Under manufacturing process variation, a path through a net is called longest if there exists a process condition under which the path has the maximum delay…”
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Estimation of fault-free leakage current using wafer-level spatial information
Published in IEEE transactions on very large scale integration (VLSI) systems (01-01-2006)“…Leakage current or the I/sub DDQ/ test has been shown to be an effective test screen in combination with traditional test methods. However, leakage current is…”
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Journal Article -
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Static compaction of delay tests considering power supply noise
Published in 23rd IEEE VLSI Test Symposium (VTS'05) (2005)“…Excessive power supply noise can lead to overkill during delay test. A static compaction algorithm is described in this paper that prevents such overkill. A…”
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Observability Driven Path Generation for Delay Test Coverage Improvement in Scan Limited Circuits
Published in 2020 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) (19-10-2020)“…Delay test is used to verify the timing performance of integrated circuits. The test requires launching rising or falling transitions into the circuit and…”
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Conference Proceeding -
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The essential role of test in DFM
Published in 2007 IEEE International Test Conference (01-10-2007)“…Design for manufacturing (DFM) is essential to achieving competitive yields in deep submicron technologies. The limiting factor in the successful application…”
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Dynamic Compaction for High Quality Delay Test
Published in 26th IEEE VLSI Test Symposium (vts 2008) (01-04-2008)“…Dynamic compaction is an effective way to reduce the number of test patterns while maintaining high fault coverage. This paper proposes a new dynamic…”
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I/sub DDQ/ test using built-in current sensing of supply line voltage drop
Published in IEEE International Conference on Test, 2005 (2005)“…A practical built-in current sensor (BICS) is described that senses the voltage drop on supply lines caused by quiescent current leakage. This noninvasive…”
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Conference Proceeding -
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Challenges in Delay Testing of Integrated Circuits
Published in 2009 24th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (01-10-2009)“…Delay testing of integrated circuits is increasingly focused on detecting small delay defects, and improving correlation to functional test. In this talk we…”
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Conference Proceeding -
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On comparison of NCR effectiveness with a reduced I/sub DDQ/ vector set
Published in 22nd IEEE VLSI Test Symposium, 2004. Proceedings (2004)“…I/sub DDQ/ test-based outlier rejection becomes difficult for deep sub-micron technology chips due to increased leakage and process variations. The use of…”
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K longest paths per gate (KLPG) test generation for scan-based sequential circuits
Published in 2004 International Conferce on Test (2004)“…To detect the smallest delay faults at a fault site, the longest path(s) through it must be tested at full speed. Existing test generation tools are…”
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Conference Proceeding -
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A probabilistic method to determine the minimum leakage vector for combinational designs in the presence of random PVT variations
Published in Integration (Amsterdam) (01-05-2008)“…The control of leakage power consumption is a growing design challenge for current and future CMOS circuits. Among existing techniques, ‘parking’ a circuit in…”
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Journal Article -
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Compact Delay Test Generation with a Realistic Low Cost Fault Coverage Metric
Published in 2009 27th IEEE VLSI Test Symposium (01-05-2009)“…This paper proposes a realistic low cost fault coverage metric targeting both global and local delay faults. It suggests the test strategy of generating a…”
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Conference Proceeding -
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Immediate neighbor difference I/sub DDQ/ test (INDIT) for outlier identification
Published in 16th International Conference on VLSI Design, 2003. Proceedings (2003)“…Increasing magnitude and variation in leakage current make it impossible to distinguish between faulty and fault-free chips using single threshold method…”
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Use of multiple I/sub DDQ/ test metrics for outlier identification
Published in Proceedings. 21st VLSI Test Symposium, 2003 (2003)“…With increasing circuit complexity and reliability requirements, screening outlier chips is an increasingly important test challenge. This is especially true…”
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Conference Proceeding -
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Chip level power supply partitioning for I/sub DDQ/ testing using built-in current sensors
Published in Proceedings 18th IEEE Symposium on Defect and Fault Tolerance in VLSI Systems (2003)“…The International Technology Roadmap for Semiconductors projects that I/sub DDQ/ levels will rise rapidly with each technology node. In addition, manufacturing…”
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Neighbor current ratio (NCR): a new metric for I/sub DDQ/ data analysis
Published in 17th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, 2002. DFT 2002. Proceedings (2002)“…I/sub DDQ/ test loses its effectiveness for deep sub-micron chips since it cannot distinguish between faulty and fault free currents. The concept of current…”
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A fast algorithm for critical path tracing in VLSI digital circuits
Published in 20th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems (DFT'05) (2005)“…An exact, linear-time critical path tracing algorithm is presented. The performance of critical path tracing is determined primarily by the efficiency of stem…”
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IDDQ data analysis using neighbor current ratios
Published in Journal of systems architecture (01-04-2004)“…I DDQ test loses its effectiveness for deep sub-micron chips since it cannot distinguish between faulty and fault-free currents. The concept of current ratios,…”
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Journal Article -
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Improved wafer-level spatial analysis for I/sub DDQ/ limit setting
Published in Proceedings International Test Conference 2001 (Cat. No.01CH37260) (2001)“…This paper proposes a new methodology for estimating the upper bound on the I/sub DDQ/ of defect free chips by using wafer level spatial information. This can…”
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Conference Proceeding