Search Results - "Waidhas, Bernd"

Flip-Chip Chip Scale Package (FCCSP) Process Characterization and Reliability of Coreless Thin Package with 7nm Si Technology by De Mesa, Eduardo, Wagner, Thomas, Keser, Beth, Proschwitz, Jan, Waidhas, Bernd

“…Advanced silicon nodes are continuously pushing the cutting edge of assembly technology with coreless thin packages used in mobile and electronic products to…”
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Study of the Board Level Reliability Performance of a Large 0.3 mm Pitch Wafer Level Package by Waidhas, Bernd, Proschwitz, Jan, Pietryga, Christoph, Wagner, Thomas, Keser, Beth

“…Board level reliability investigations have been performed on 36 mm² wafer level packages (WLP) with a 0.3 mm ball pitch. Three different solder ball alloys…”
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A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF Transceivers by Wolter, Andreas, Baumeister, Horst, Yeni, Ceren, Waidhas, Bemd, Proschwitz, Jan, Wagner, Thomas, Keser, Beth

“…For mobile phone RF transceivers, wafer level packages (WLP) are a cost attractive solution allowing for minimum footprint and package height while providing…”
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