Search Results - "Wai, L.L."

Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios by Zhang, Y.P., Sun, M., Chua, K.M., Wai, L.L., Duixian Liu

“…This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly…”
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Integration of Yagi Antenna in LTCC Package for Differential 60-GHz Radio by Sun, M., Zhang, Y.P., Chua, K.M., Wai, L.L., Liu, D., Gaucher, B.P.

“…A Yagi antenna implemented in a thin cavity-down ceramic ball grid array package in low temperature cofired ceramic (LTCC) technology is reported. The antenna,…”
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Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications by Jongbae Park, Lu, A.C.W., Chua, K.M., Wai, L.L., Junho Lee, Joungho Kim

“…We propose a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG)…”
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Hybrid analytical modeling method for split power bus in multilayered package by Youchul Jeong, Lu, A.C.W., Wai, L.L., Wei Fan, Lok, B.K., Hyunjeong Park, Kim, Joungho

“…As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an…”
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Integration of Grid Array Antenna in Chip Package for Highly Integrated 60-GHz Radios by Mei Sun, Zhang, Y.P., Guo, Y.X., Chua, K.M., Wai, L.L.

“…A grid array antenna integrated in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic (LTCC) technology is reported…”
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Mixed-mode S-parameter characterization of differential structures by Fan, W., Lu, A., Wai, L.L., Lok, B.K.

“…Combined differential-mode and common-mode (mixed-mode) scattering parameters (S-parameters) are well adapted to accurate measurements of linear networks at RF…”
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Antenna-in-Package in LTCC for 60-GHz Radio by Zhang, Y.P., Sun, M., Chua, K.M., Wai, L.L., Liu, D., Gaucher, B.P.

“…An IEEE standards group, 802.15.3c, is defining specifications for 60-GHz radio to use the 7 GHz of unlicensed spectrum to enable very high-data-rate…”
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Calibration of Super-Kamiokande using an electron LINAC: The Super-Kamiokande Collaboration by Nakahata, M, Fukuda, Y, Hayakawa, T, Ichihara, E, Inoue, K, Ishihara, K, Ishino, H, Kajita, T, Kameda, J, Kobayashi, K, Kobayashi, Y, Koshio, Y, Martens, K, Miura, M, Nakayama, S, Okada, A, Okumura, K, Sakurai, N, Shiozawa, M, Takeuchi, Y, Totsuka, Y, Yamada, S, Earl, M, Habig, A, Kearns, E, Messier, M.D, Stone, J.L, Sulak, L.R, Goldhaber, M, Casper, D, Gajewski, W, Halverson, P.G, Hsu, J, Kropp, W.R, Price, L.R, Reines, F, Sobel, H.W, Vagins, M.R, Keig, W.E, Ellsworth, R.W, Tasaka, S, Flanagan, J.W, Stenger, V.J, Takemori, D, Kanzaki, J, Kobayashi, T, Mine, S, Nishikawa, K, Oyama, Y, Sakai, A, Sakuda, M, Sasaki, O, Echigo, S, Kohama, M, Suzuki, A.T, Haines, T.J, Sanford, R, Svoboda, R, Chen, M.L, Conner, Z, Goodman, J.A, Sullivan, G.W, Hill, J, Jung, C.K, Mauger, C, Sharkey, E, Viren, B, Yanagisawa, C, Doki, W, Miyano, K, Okazawa, H, Saji, C, Takahata, M, Nagashima, Y, Takita, M, Yoshida, M, Kim, S.B, Etoh, M, Fujita, K, Hasegawa, A, Hasegawa, T, Hatakeyama, S, Iwamoto, T, Koga, M, Suzuki, A, Tsushima, F, Koshiba, M, Nemoto, M, Nishijima, K, Futagami, T, Hayato, Y, Kanaya, Y, Kaneyuki, K, Watanabe, Y, Kielczewska, D, Doyle, R.A, George, J.S, Stachyra, A.L, Wilkes, R.J, Kobayashi, H

“…In order to calibrate the Super-Kamiokande experiment for solar neutrino measurements, a linear accelerator (LINAC) for electrons was installed at the…”
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LTCC based integration for RF applications by Wai, L.L., Lu, A.C.W., Wei Fan, Chua, K.M., Sunappan, V.

“…Low temperature cofired ceramic technology (LTCC) is a substrate platform that provides true 3D integration whilst satisfying very high frequency performance…”
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Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications by Ng, Y.T., Wai, L.L., Fan, W., Gian, P.W., Lu, H., Lu, A.C.W.

“…This paper discloses the design optimization of embedded electromagnetic bandgap (EBG) structures for noise suppression in power/ground plane applications. We…”
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Ultra Compact LTCC Based AiP for 60 GHz Applications by Wai, L.L., Chua, K.M., Lu, A.C.W., Zhang, Y.P., Sun, M.

“…In this paper we propose to integrate two antennas in an IC package that carries the 60-GHz radio chip sets. The antennas realized in this manner are simply…”
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Processing and electrical characterization of co-sintered composite glass ceramics by Sunappan, V., Vadiveloo, P.L., Wai, L.L., Fan, W., Lu, C.W.

“…The demand for smaller size with increased functionality in electronic devices require new materials, which will allow integration of passives elements in…”
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Characterization of low temperature processing and high density integrated capacitor on organic substrate by Fan, W., Lok, B.K., Lu, A.C.W., Wai, L.L.

“…Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral…”
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Evaluation of Printed Heating Element for Micro-System Applications by Fan, W., Wang, Z.F., Lu, A.C.W., Chua, K.M., Wai, L.L.

“…The heating element with different configurations has been designed and fabricated by the screen printing approach using the conductive silver ink XZ250 with…”
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Miniaturization of electromagnetic bandgap structures for noise suppression by Lu, A.C.W., Wai, L.L., Sunappan, V., Park, J., Fan, W., Chua, K.M., Ng, Y.T., Kim, J.

“…Advancement in semiconductor technologies including CMOS and SiGe is enabling the commercialisation of devices that have increased switching speed, reduced…”
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Efficiency of differential signaling on cavity noise suppression in applications with reference plane change by Junho Lee, Jaemin Kim, Joungho Kirn, Lu, A.C.W., Wei Fan, Wai, L.L.

“…We present the effect of reference plane change of signal traces on cavity noise generation and signal quality deterioration. Also, the efficiency of…”
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The scalable modeling of multi-layer embedded capacitor based on LTCC substrate by Jongbae Park, Lu, A.C.W., Wei Fan, Wai, L.L., Chua, K.M., Yujeong Shim, Kim, Joungho

“…Low temperature co-fired ceramic (LTCC) technology is the preferred platform for integrating multi-layer capacitors due to excellent high frequency performance…”
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Modeling and characterization of wire bonding for RF applications by Lu, A.C.W., Wei Fan, Wai, L.L., Low, L.A., Ke, F.X., Yip, K.C., Lim, Y.P.

“…This paper describes a design methodology for improving the electrical performance of wire bonding. Adjacent power or ground wires are used to provide return…”
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Broadband via transition analysis and characterization by Lu, A.C.W., Wai, L.L., Wei Fan, Lin Jin

“…This paper presents a new methodology to analyze the key aspects of via transition. Proliferation of mixed-signal functionality in modem applications is…”
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Design optimization of wire bonding for high frequency applications by Lu, A.C.W., Wei Fan, Wai, L.L.

“…This paper describes a novel controlled impedance design methodology for wire bonding. Adjacent power or ground wires are used to provide return paths in a…”
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