Search Results - "Wachutka, Gerhard K.M."

Micromachined CMOS thermoelectric generators as on-chip power supply by Strasser, M., Aigner, R., Lauterbach, C., Sturm, T.F., Franosch, M., Wachutka, G.

“…As the power consumption of a large number of microelectronic devices has been continuously reduced in recent years, power supply units of a few microwatts…”
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Reliability analysis and modeling of power MOSFETs in the 42-V-PowerNet by Castellazzi, A., Gerstenmaier, Y.C., Kraus, R., Wachutka, G.K.M.

“…This paper analyzes the operation of PowerMOSFETs in the 42-V-PowerNet and shows that very stressful conditions are encountered, which can lead to severe…”
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Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions by Gerstenmaier, Y.C., Castellazzi, A., Wachutka, G.K.M.

“…The ability of monitoring the chip temperatures of power semiconductor modules at all times under various realistic working conditions is the basis for…”
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Sensitivity enhancement of MEMS inertial sensors using negative springs and active control by Handtmann, Martin, Aigner, Robert, Meckes, Andreas, Wachutka, Gerhard K.M.

“…In this paper, we present a device in which the inherent control scheme of force-feedback loops in Σ/ Δ-architecture [1] is used for increasing the mechanical…”
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Convex corner undercutting of silicon in anisotropic KOH etching: the new step-flow model of 3-D structuring and first simulation results by Schroder, H., Obermeier, E., Horn, A., Wachutka, G.K.M.

“…In this paper, the mechanism of convex corner (CC) undercutting of Si/sub {100}/ in pure aqueous KOH solutions is revisited by proposing the step-flow model of…”
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Electrofluidic full-system modelling of a flap valve micropump based on Kirchhoffian network theory by Voigt, P., Schrag, G., Wachutka, G.

“…We describe a comprehensive methodology for setting up physically based consistent full-system models for the effort-economizing and yet accurate numerical…”
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Physically rigorous modeling of internal laser-probing techniques for microstructured semiconductor devices by Thalhammer, R.K., Wachutka, G.K.M.

“…The space- and time-resolved distributions of charge carriers and temperature in the interior of microstructured semiconductor devices have become accessible…”
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Transient temperature fields with general nonlinear boundary conditions in electronic systems by Gerstenmaier, Y.C., Wachutka, G.K.M.

“…Green's function representations of the solution of the heat conduction equation for general boundary conditions are generalized for the nonlinear, i.e.,…”
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Efficient calculation of transient temperature fields responding to fast changing heatsources over long duration in power electronic systems by Gerstenmaier, Y.C., Wachutka, G.K.M.

“…A method is presented, which describes the evolution of the complete temperature field in electronic systems by multiplication of two low order matrices, one…”
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Realistic step flow model for orientation-dependent wet etching implemented in a modular TCAD environment by HORN, Anton, WITTMANN, Franz, WACHUTKA, Gerhard

“…In this paper we present a new simulation tool for orientation-dependent wet etching of silicon which is based on a new model proposed by Schroder. What is…”
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