Search Results - "Wachutka, Gerhard"
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4H–SiC vertical magnetotransistor with microtesla detectivity up to 500 °C
Published in Applied physics letters (06-05-2024)“…In this Letter, we demonstrate the operation of an in-plane magnetic field sensitive 4H–SiC vertical magnetotransistor over a wide range of temperatures,…”
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Publisher's Note: “4H–SiC vertical magnetotransistor with microtesla detectivity up to 500 °C” [Appl. Phys. Lett. 124, 192101 (2024)]
Published in Applied physics letters (13-05-2024)Get full text
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A Perspective on Magnetic Field Sensors Operating Under Extreme High-Temperature Conditions
Published in IEEE transactions on magnetics (01-01-2019)“…We compare alternative concepts of magnetic field sensors, which are capable of working under very high and even extreme temperature conditions, and outline…”
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Very High In‐Plane Magnetic Field Sensitivity in Ion‐Implanted 4H‐SiC PIN Diodes
Published in Advanced electronic materials (01-05-2024)“…In this study ion‐implanted lateral 4H‐SiC pin diodes are reported, which show an unexpectedly high room temperature in‐plane magnetic field sensitivity…”
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Virtual testing of high power devices at the rim of the safe operating area and beyond
Published in 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD) (01-06-2014)“…The development of high-performance power devices is increasingly supported by predictive computer simulations on the basis of well-calibrated physical device…”
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Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions
Published in IEEE transactions on power electronics (01-01-2006)“…The ability of monitoring the chip temperatures of power semiconductor modules at all times under various realistic working conditions is the basis for…”
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Reliability analysis and modeling of power MOSFETs in the 42-V-PowerNet
Published in IEEE transactions on power electronics (01-05-2006)“…This paper analyzes the operation of PowerMOSFETs in the 42-V-PowerNet and shows that very stressful conditions are encountered, which can lead to severe…”
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4H-SiC Lateral Magnetotransistor With Sub-Microtesla In-Plane Magnetic Field Detectivity
Published in IEEE electron device letters (01-11-2024)“…In this letter, we report on the first 4H-SiC based lateral magnetotransistor. The sensor is fabricated in a 4H-SiC wafer scale Bipolar-CMOS-DMOS (BCD)…”
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500 °C Microtesla Sensitive Magnetic Field Sensing Using a 4H-SiC PIN Diode
Published in IEEE sensors journal (01-10-2024)“…Wide bandgap (WBG) semiconductors possess a large potential for the development of sensors operating in harsh environments. In this article, we present an…”
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High-Throughput Apparatus for Semiconductor Device Characterization in a Magnetic Field at Extreme High Temperatures
Published in IEEE transactions on instrumentation and measurement (2023)“…We report on the development of a 600 °C withstanding low-noise apparatus, which enables high-throughput magnetic-field-dependent characterization of…”
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Design and Simulation of Novel Low-Voltage CMOS Vertical Hall Devices With Capacitively Coupled Measuring Contacts
Published in IEEE transactions on electron devices (01-12-2020)“…In this article, we introduce the novel concept of capacitively coupled measuring contacts (CCMCs) for microscaled vertical Hall sensors. Using dedicated…”
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Sensitivity enhancement of MEMS inertial sensors using negative springs and active control
Published in Sensors and actuators. A, Physical (01-04-2002)“…In this paper, we present a device in which the inherent control scheme of force-feedback loops in Σ/ Δ-architecture [1] is used for increasing the mechanical…”
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Thermoelectric converters with optimum graded materials and current distribution in one dimension and three dimensions
Published in physica status solidi (b) (01-07-2017)“…The description of TE‐converter performance with inhomogeneous material distribution is based on the classical Onsager–deGroot–Callen transport theory. A…”
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Convex corner undercutting of silicon in anisotropic KOH etching: the new step-flow model of 3-D structuring and first simulation results
Published in Journal of microelectromechanical systems (01-03-2001)“…In this paper, the mechanism of convex corner (CC) undercutting of Si/sub {100}/ in pure aqueous KOH solutions is revisited by proposing the step-flow model of…”
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Very High Temperature Hall Sensors in a Wafer‐Scale 4H‐SiC Technology
Published in Advanced materials technologies (07-08-2024)“…Abstract 4H‐SiC is a key enabler for realizing integrated electronics operating in harsh environments, which exhibit very high temperatures. Through advances…”
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Design and Simulation of a Novel Vertical Hall Sensor With High Negative Differential Sensitivity
Published in IEEE magnetics letters (2019)“…We report on the design and simulation of a novel vertical Hall sensor, which exhibits highly nonlinear characteristics between Hall voltage and bias voltage,…”
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Computer-Based Investigations on the Reliability, Robustness, and Failure Mechanisms of High-Power Devices
Published in 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) (23-10-2022)“…Todays state of the art of predictive high-fidelity computer simulation of "failure and virtual destruction" is illustrated with reference to selected…”
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Macromodel-based simulation and measurement of the dynamic pull-in of viscously damped RF-MEMS switches
Published in Sensors and actuators. A. Physical. (01-12-2011)“…We present a physics-based multi-energy domain coupled macromodel that allows for the efficient simulation of the dynamic response of electrostatically…”
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Testing semiconductor devices at extremely high operating temperatures
Published in Microelectronics and reliability (01-08-2008)“…We developed a dedicated measurement set-up for the electrical and electrothermal characterization of semiconductor devices and microsystems under very…”
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Comparative study of contact topographies of 4.5kV SiC MPS diodes for optimizing the forward characteristics
Published in 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01-09-2016)“…The forward characteristics of MPS diodes is composed of two branches: the first one is determined by unipolar conductivity originating from the Schottky…”
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Conference Proceeding