Search Results - "Wachutka, Gerhard"

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  1. 1

    4H–SiC vertical magnetotransistor with microtesla detectivity up to 500 °C by Okeil, Hesham, Wachutka, Gerhard

    Published in Applied physics letters (06-05-2024)
    “…In this Letter, we demonstrate the operation of an in-plane magnetic field sensitive 4H–SiC vertical magnetotransistor over a wide range of temperatures,…”
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    Journal Article
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  3. 3

    A Perspective on Magnetic Field Sensors Operating Under Extreme High-Temperature Conditions by Okeil, Hesham, Wachutka, Gerhard

    Published in IEEE transactions on magnetics (01-01-2019)
    “…We compare alternative concepts of magnetic field sensors, which are capable of working under very high and even extreme temperature conditions, and outline…”
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    Journal Article
  4. 4

    Very High In‐Plane Magnetic Field Sensitivity in Ion‐Implanted 4H‐SiC PIN Diodes by Okeil, Hesham, Erlbacher, Tobias, Wachutka, Gerhard

    Published in Advanced electronic materials (01-05-2024)
    “…In this study ion‐implanted lateral 4H‐SiC pin diodes are reported, which show an unexpectedly high room temperature in‐plane magnetic field sensitivity…”
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    Journal Article
  5. 5

    Virtual testing of high power devices at the rim of the safe operating area and beyond by Wachutka, Gerhard

    “…The development of high-performance power devices is increasingly supported by predictive computer simulations on the basis of well-calibrated physical device…”
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    Conference Proceeding
  6. 6

    Electrothermal simulation of multichip-modules with novel transient thermal model and time-dependent boundary conditions by Gerstenmaier, Y.C., Castellazzi, A., Wachutka, G.K.M.

    Published in IEEE transactions on power electronics (01-01-2006)
    “…The ability of monitoring the chip temperatures of power semiconductor modules at all times under various realistic working conditions is the basis for…”
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    Journal Article
  7. 7

    Reliability analysis and modeling of power MOSFETs in the 42-V-PowerNet by Castellazzi, A., Gerstenmaier, Y.C., Kraus, R., Wachutka, G.K.M.

    Published in IEEE transactions on power electronics (01-05-2006)
    “…This paper analyzes the operation of PowerMOSFETs in the 42-V-PowerNet and shows that very stressful conditions are encountered, which can lead to severe…”
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    Journal Article
  8. 8

    4H-SiC Lateral Magnetotransistor With Sub-Microtesla In-Plane Magnetic Field Detectivity by Okeil, Hesham, Wachutka, Gerhard

    Published in IEEE electron device letters (01-11-2024)
    “…In this letter, we report on the first 4H-SiC based lateral magnetotransistor. The sensor is fabricated in a 4H-SiC wafer scale Bipolar-CMOS-DMOS (BCD)…”
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    Journal Article
  9. 9

    500 °C Microtesla Sensitive Magnetic Field Sensing Using a 4H-SiC PIN Diode by Okeil, Hesham, Wachutka, Gerhard

    Published in IEEE sensors journal (01-10-2024)
    “…Wide bandgap (WBG) semiconductors possess a large potential for the development of sensors operating in harsh environments. In this article, we present an…”
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    Journal Article
  10. 10

    High-Throughput Apparatus for Semiconductor Device Characterization in a Magnetic Field at Extreme High Temperatures by Okeil, Hesham, Schrag, Gabriele, Wachutka, Gerhard

    “…We report on the development of a 600 °C withstanding low-noise apparatus, which enables high-throughput magnetic-field-dependent characterization of…”
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    Journal Article
  11. 11

    Design and Simulation of Novel Low-Voltage CMOS Vertical Hall Devices With Capacitively Coupled Measuring Contacts by Okeil, Hesham, Schrag, Gabriele, Wachutka, Gerhard

    Published in IEEE transactions on electron devices (01-12-2020)
    “…In this article, we introduce the novel concept of capacitively coupled measuring contacts (CCMCs) for microscaled vertical Hall sensors. Using dedicated…”
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    Journal Article
  12. 12

    Sensitivity enhancement of MEMS inertial sensors using negative springs and active control by Handtmann, Martin, Aigner, Robert, Meckes, Andreas, Wachutka, Gerhard K.M.

    Published in Sensors and actuators. A, Physical (01-04-2002)
    “…In this paper, we present a device in which the inherent control scheme of force-feedback loops in Σ/ Δ-architecture [1] is used for increasing the mechanical…”
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    Journal Article Conference Proceeding
  13. 13

    Thermoelectric converters with optimum graded materials and current distribution in one dimension and three dimensions by Gerstenmaier, York Christian, Wachutka, Gerhard

    Published in physica status solidi (b) (01-07-2017)
    “…The description of TE‐converter performance with inhomogeneous material distribution is based on the classical Onsager–deGroot–Callen transport theory. A…”
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    Journal Article
  14. 14

    Convex corner undercutting of silicon in anisotropic KOH etching: the new step-flow model of 3-D structuring and first simulation results by Schroder, H., Obermeier, E., Horn, A., Wachutka, G.K.M.

    Published in Journal of microelectromechanical systems (01-03-2001)
    “…In this paper, the mechanism of convex corner (CC) undercutting of Si/sub {100}/ in pure aqueous KOH solutions is revisited by proposing the step-flow model of…”
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    Journal Article
  15. 15

    Very High Temperature Hall Sensors in a Wafer‐Scale 4H‐SiC Technology by Okeil, Hesham, Erlbacher, Tobias, Wachutka, Gerhard

    Published in Advanced materials technologies (07-08-2024)
    “…Abstract 4H‐SiC is a key enabler for realizing integrated electronics operating in harsh environments, which exhibit very high temperatures. Through advances…”
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    Journal Article
  16. 16

    Design and Simulation of a Novel Vertical Hall Sensor With High Negative Differential Sensitivity by Okeil, Hesham, Wachutka, Gerhard

    Published in IEEE magnetics letters (2019)
    “…We report on the design and simulation of a novel vertical Hall sensor, which exhibits highly nonlinear characteristics between Hall voltage and bias voltage,…”
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    Journal Article
  17. 17

    Computer-Based Investigations on the Reliability, Robustness, and Failure Mechanisms of High-Power Devices by Wachutka, Gerhard

    “…Todays state of the art of predictive high-fidelity computer simulation of "failure and virtual destruction" is illustrated with reference to selected…”
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    Conference Proceeding
  18. 18

    Macromodel-based simulation and measurement of the dynamic pull-in of viscously damped RF-MEMS switches by Niessner, Martin, Schrag, Gabriele, Iannacci, Jacopo, Wachutka, Gerhard

    Published in Sensors and actuators. A. Physical. (01-12-2011)
    “…We present a physics-based multi-energy domain coupled macromodel that allows for the efficient simulation of the dynamic response of electrostatically…”
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    Journal Article
  19. 19

    Testing semiconductor devices at extremely high operating temperatures by Borthen, Peter, Wachutka, Gerhard

    Published in Microelectronics and reliability (01-08-2008)
    “…We developed a dedicated measurement set-up for the electrical and electrothermal characterization of semiconductor devices and microsystems under very…”
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    Journal Article Conference Proceeding
  20. 20

    Comparative study of contact topographies of 4.5kV SiC MPS diodes for optimizing the forward characteristics by Yaren Huang, Wachutka, Gerhard

    “…The forward characteristics of MPS diodes is composed of two branches: the first one is determined by unipolar conductivity originating from the Schottky…”
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    Conference Proceeding