Search Results - "WALSTRA, Steven"

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  1. 1

    EXTENSION OF THE McNUTT-SAH METHOD FOR MEASURING THIN OXIDE THICKNESSES OF MOS DEVICES by Walstra, Steven V., Sah, Chih-Tang

    Published in Solid-state electronics (01-04-1998)
    “…Oxide capacitance and thickness are critical parameters in MOS process monitoring and device modeling. For process monitoring, where rapid results and minimum…”
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    Journal Article
  2. 2

    Effect of intrinsic capacitance degradation on circuit performance by Dai, Changhong, Walstra, Steven V, Lee, Shiuh-Wuu

    “…The effect of intrinsic capacitance degradation on circuit performance has been investigated. Results show that: (1) the measured C sub(gd) decreases while C…”
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    Journal Article
  3. 3

    Measurements and analysis of SER-tolerant latch in a 90-nm dual-V/T/ CMOS process by Hazucha, P, Karnik, T, Walstra, S, Bloechel, B A, Tschanz, J W, Maiz, J, Soumyanath, K, Dermer, G E, Narendra, S, De, V, Borkar, S

    Published in IEEE journal of solid-state circuits (01-09-2004)
    “…We designed a soft error rate (SER) tolerant latch utilizing local redundancy. We implemented a test chip containing both the standard and SER-tolerant latches…”
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    Journal Article
  4. 4

    Frequency and recovery effects in high-κ BTI degradation by Ramey, S., Prasad, C., Agostinelli, M., Sangwoo Pae, Walstra, S., Gupta, S., Hicks, J.

    “…Net end-of-life aging prediction under realistic use conditions is the key objective for any product aging model. In this paper, a net degradation model is…”
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    Conference Proceeding
  5. 5

    Thin oxide thickness extrapolation from capacitance-voltage measurements by Walstra, S.V., Chih-Tang Sah

    Published in IEEE transactions on electron devices (01-07-1997)
    “…Five oxide-thickness extrapolation algorithms, all based on the same model (metal gate, negligible interface traps, no quantum effects), are compared to…”
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    Journal Article
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    Scaling effects on metal-oxide-semiconductor device characteristics by Walstra, Steven Vincent

    Published 01-01-1997
    “…As metal-oxide-semiconductor (MOS) transistor dimensions are decreased, channel-length modulation, polysilicon-gate depletion, and intrinsic-capacitance…”
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    Dissertation
  9. 9

    Circuit-level modeling of soft errors in integrated circuits by Walstra, S.V., Changhong Dai

    “…This paper describes the steps necessary to develop a soft-error methodology that can be used at the circuit-simulation level for accurate nominal soft-error…”
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    Magazine Article