Search Results - "WALSTRA, Steven"
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EXTENSION OF THE McNUTT-SAH METHOD FOR MEASURING THIN OXIDE THICKNESSES OF MOS DEVICES
Published in Solid-state electronics (01-04-1998)“…Oxide capacitance and thickness are critical parameters in MOS process monitoring and device modeling. For process monitoring, where rapid results and minimum…”
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Journal Article -
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Effect of intrinsic capacitance degradation on circuit performance
Published in Digest of technical papers - Symposium on VLSI Technology (01-01-1996)“…The effect of intrinsic capacitance degradation on circuit performance has been investigated. Results show that: (1) the measured C sub(gd) decreases while C…”
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Journal Article -
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Measurements and analysis of SER-tolerant latch in a 90-nm dual-V/T/ CMOS process
Published in IEEE journal of solid-state circuits (01-09-2004)“…We designed a soft error rate (SER) tolerant latch utilizing local redundancy. We implemented a test chip containing both the standard and SER-tolerant latches…”
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Journal Article -
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Frequency and recovery effects in high-κ BTI degradation
Published in 2009 IEEE International Reliability Physics Symposium (01-04-2009)“…Net end-of-life aging prediction under realistic use conditions is the key objective for any product aging model. In this paper, a net degradation model is…”
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Conference Proceeding -
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Thin oxide thickness extrapolation from capacitance-voltage measurements
Published in IEEE transactions on electron devices (01-07-1997)“…Five oxide-thickness extrapolation algorithms, all based on the same model (metal gate, negligible interface traps, no quantum effects), are compared to…”
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Journal Article -
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Measurements and analysis of SER-tolerant latch in a 90-nm Dual-VT CMOS process
Published in IEEE journal of solid-state circuits (01-09-2004)Get full text
Journal Article -
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EXTENSION OF THE M cNUTT-SAH METHOD FOR MEASURING THIN OXIDE THICKNESSES OF MOS DEVICES
Published in Solid-state electronics (1998)Get full text
Journal Article -
8
Scaling effects on metal-oxide-semiconductor device characteristics
Published 01-01-1997“…As metal-oxide-semiconductor (MOS) transistor dimensions are decreased, channel-length modulation, polysilicon-gate depletion, and intrinsic-capacitance…”
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Dissertation -
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Circuit-level modeling of soft errors in integrated circuits
Published in IEEE transactions on device and materials reliability (01-09-2005)“…This paper describes the steps necessary to develop a soft-error methodology that can be used at the circuit-simulation level for accurate nominal soft-error…”
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Magazine Article