Search Results - "WALCZYK, Damian"

  • Showing 1 - 12 results of 12
Refine Results
  1. 1

    Engineering of the Chemical Reactivity of the Ti/HfO2 Interface for RRAM: Experiment and Theory by Calka, Pauline, Sowinska, Malgorzata, Bertaud, Thomas, Walczyk, Damian, Dabrowski, Jarek, Zaumseil, Peter, Walczyk, Christian, Gloskovskii, Andrei, Cartoixà, Xavier, Suñé, Jordi, Schroeder, Thomas

    Published in ACS applied materials & interfaces (09-04-2014)
    “…The Ti/HfO2 interface plays a major role for resistance switching performances. However, clear interface engineering strategies to achieve reliable and…”
    Get full text
    Journal Article
  2. 2

    Impact of Temperature on the Resistive Switching Behavior of Embedded \hbox-Based RRAM Devices by Walczyk, C., Walczyk, D., Schroeder, T., Bertaud, T., Sowinska, M., Lukosius, M., Fraschke, M., Wolansky, D., Tillack, B., Miranda, E., Wenger, C.

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated 1 × μm 2 TiN/HfO 2 /Ti/TiN MIM memory devices in a 0.25- μm complementary metal-oxide-semiconductor technology were built to…”
    Get full text
    Journal Article
  3. 3
  4. 4

    Oxygen Vacancy Induced Room Temperature Ferromagnetism in Pr-Doped CeO2 Thin Films on Silicon by Niu, Gang, Hildebrandt, Erwin, Schubert, Markus Andreas, Boscherini, Federico, Zoellner, Marvin Hartwig, Alff, Lambert, Walczyk, Damian, Zaumseil, Peter, Costina, Ioan, Wilkens, Henrik, Schroeder, Thomas

    Published in ACS applied materials & interfaces (22-10-2014)
    “…Integration of functional oxides on Si substrates could open a pathway to integrate diverse devices on Si-based technology. Oxygen vacancies (Vo··) can…”
    Get full text
    Journal Article
  5. 5
  6. 6
  7. 7
  8. 8

    Statistical analysis of resistive switching characteristics in ReRAM test arrays by Zambelli, Cristian, Grossi, Alessandro, Olivo, Piero, Walczyk, Damian, Bertaud, Thomas, Tillack, Bernd, Schroeder, Thomas, Stikanov, Valeriy, Walczyk, Christian

    “…The design and the manufacturing of ReRAM test structures allow deeper insight in the performance of the FORMING, RESET, and SET operations at array level,…”
    Get full text
    Conference Proceeding
  9. 9
  10. 10

    Impact of Temperature on the Resistive Switching Behavior of Embedded [Formula Omitted]-Based RRAM Devices by Walczyk, Christian, Walczyk, Damian, Schroeder, Thomas, Bertaud, Thomas, Sowinska, Malgorzata, Lukosius, Mindaugas, Fraschke, Mirko, Wolansky, Dirk, Tillack, Bernd, Miranda, Enrique, Wenger, Christian

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated [Formula Omitted] MIM memory devices in a 0.25-[Formula Omitted] complementary metal-oxide-semiconductor technology were built to…”
    Get full text
    Journal Article
  11. 11

    Impact of Temperature on the Resistive Switching Behavior of Embedded hbox HfO 2 -Based RRAM Devices by Walczyk, Christian, Walczyk, Damian, Schroeder, Thomas, Bertaud, Thomas, Sowinska, Malgorzata, Lukosius, Mindaugas, Fraschke, Mirko, Wolansky, Dirk, Tillack, Bernd, Miranda, Enrique, Wenger, Christian

    Published in IEEE transactions on electron devices (01-09-2011)
    “…Back-end-of-line integrated hbox 1 hbox 1 Unknown character mu hbox m 2 Unknown character hbox TiN / HfO 2 / break hbox Ti / TiN MIM memory devices in a 0.25-…”
    Get full text
    Journal Article
  12. 12

    Electrical characterization of read window in reram arrays under different SET/RESET cycling conditions by Zambelli, Cristian, Grossi, Alessandro, Olivo, Piero, Walczyk, Damian, Dabrowski, Jarek, Tillack, Bernd, Schroeder, Thomas, Kraemer, Rolf, Stikanov, Valeriy, Walczyk, Christian

    “…In this work a SET/RESET investigation in cycling on ReRAM arrays has been performed, in order to find the most reliable SET/RESET operation conditions. The…”
    Get full text
    Conference Proceeding