Search Results - "Vivalda, John"

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  1. 1

    ERSFQ 8-Bit Parallel Adders as a Process Benchmark by Kirichenko, Alex F., Vernik, Igor V., Vivalda, John A., Hunt, Rick T., Yohannes, Daniel T.

    “…We have designed and demonstrated two versions of an ERSFQ 8-bit parallel adder. ERSFQ is a resistor-free approach to dc biasing of Single Flux Quantum…”
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    Journal Article
  2. 2

    Planarized, Extendible, Multilayer Fabrication Process for Superconducting Electronics by Yohannes, Daniel T., Hunt, Rick T., Vivalda, John A., Amparo, Denis, Cohen, Alexander, Vernik, Igor V., Kirichenko, Alex F.

    “…We report on technique and results for superconductor electronics fabrication process, featuring customizable number of planarized superconducting layers. The…”
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    Journal Article
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    Diffusion Stop-Layers for Superconducting Integrated Circuits and Qubits With Nb-Based Josephson Junctions by Tolpygo, S K, Amparo, D, Hunt, R T, Vivalda, J A, Yohannes, D T

    “…New technology for superconductor integrated circuits has been developed and is presented. It employs diffusion stop-layers (DSLs) to protect Josephson…”
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    Journal Article Conference Proceeding
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    Retargeting RSFQ cells to a submicron fabrication process by Brock, D.K., Kadin, A.M., Kirichenko, A.F., Mukhanov, O.A., Sarwana, S., Vivalda, J.A., Wei Chen, Lukens, J.E.

    “…There is a desire to move current state-of-the-art niobium Josephson IC fabrication processes (/spl sim/3 /spl mu/m) to smaller sub-micron linewidths in order…”
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    Journal Article Conference Proceeding
  8. 8

    Sloped niobium etching using CF4 and O2 by Sasserath, Jay N., Vivalda, John

    “…A sloped etching process for Nb is developed for pilot line operations. Reactive ion etching and plasma processes are compared for a CF4/O2 parallel plate etch…”
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    Journal Article
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    Diffusion stop-layers for superconducting integrated circuits and qubits with Nb-based Josephson junctions by Tolpygo, Sergey K, Amparo, Denis, Hunt, Richard T, Vivalda, John A, Yohannes, Daniel T

    Published 26-10-2010
    “…IEEE Trans. Appl. Supercond., vol. 21, No. 3, pp.119-125, June 2011 New technology for superconductor integrated circuits has been developed and is presented…”
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    Journal Article