Search Results - "Visalli, Domenica"

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  1. 1

    Experimental and simulation study of breakdown voltage enhancement of AlGaN/GaN heterostructures by Si substrate removal by Visalli, Domenica, Van Hove, Marleen, Srivastava, Puneet, Derluyn, Joff, Das, Johan, Leys, Maarten, Degroote, Stefan, Cheng, Kai, Germain, Marianne, Borghs, Gustaaf

    Published in Applied physics letters (13-09-2010)
    “…The breakdown mechanism in GaN-based heterostructures (HFETs) grown on silicon substrate is investigated in detail by TCAD simulations and silicon substrate…”
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    Journal Article
  2. 2

    Silicon Substrate Removal of GaN DHFETs for Enhanced (<1100 V) Breakdown Voltage by Srivastava, Puneet, Das, Jo, Visalli, Domenica, Derluyn, Joff, Van Hove, Marleen, Malinowski, Pawel E, Marcon, Denis, Geens, Karen, Kai Cheng, Degroote, Stefan, Leys, Maarten, Germain, Marianne, Decoutere, Stefaan, Mertens, Robert P, Borghs, Gustaaf

    Published in IEEE electron device letters (01-08-2010)
    “…In this letter, we present a novel approach to enhance the breakdown voltage ( V BD ) for AlGaN/GaN/AlGaN double-heterostructure FETs (DHFETs), grown by…”
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    Journal Article
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    Electrically active defects at AlN/Si interface studied by DLTS and ESR by Simoen, Eddy, Visalli, Domenica, Van Hove, Marleen, Leys, Maarten, Favia, Paola, Bender, Hugo, Borghs, Gustaaf, Nguyen, Ahn Puc Duc, Stesmans, Andre

    “…A combined deep‐level transient spectroscopy (DLTS) and electron spin resonance (ESR) study is performed to identify the electrically active defects at the…”
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    Journal Article
  4. 4

    Limitations of Field Plate Effect Due to the Silicon Substrate in AlGaN/GaN/AlGaN DHFETs by Visalli, D, Van Hove, M, Derluyn, J, Srivastava, P, Marcon, D, Das, J, Leys, M R, Degroote, S, Kai Cheng, Vandenplas, E, Germain, M, Borghs, G

    Published in IEEE transactions on electron devices (01-12-2010)
    “…We investigated the limitations of the field plate (FP) effect on breakdown voltage V BD that is due to the silicon substrate in AlGaN/GaN/AlGaN double…”
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    Journal Article
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    A 96% Efficient High-Frequency DC-DC Converter Using E-Mode GaN DHFETs on Si by Das, J., Everts, J., Van Den Keybus, J., Van Hove, M., Visalli, D., Srivastava, P., Marcon, D., Kai Cheng, Leys, M., Decoutere, S., Driesen, J., Borghs, G.

    Published in IEEE electron device letters (01-10-2011)
    “…III-Nitride materials are very promising to be used in next-generation high-frequency power switching applications. In this letter, we demonstrate the…”
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    Journal Article
  8. 8

    Statistics and localisation of vertical breakdown in AlGaN/GaN HEMTs on SiC and Si substrates for power applications by Fleury, Clément, Zhytnytska, Rimma, Bychikhin, Sergey, Cappriotti, Mattia, Hilt, Oliver, Visalli, Domenica, Meneghesso, Gaudenzio, Zanoni, Enrico, Würfl, Joachim, Derluyn, Joff, Strasser, Gottfried, Pogany, Dionyz

    Published in Microelectronics and reliability (01-09-2013)
    “…•Probability distribution functions of GaN buffer breakdown voltage were determined.•A time dependent behaviour of vertical breakdown was observed.•Vertical…”
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    Journal Article Conference Proceeding
  9. 9

    Experimental and simulation study of breakdown voltage enhancementof AlGaN/GaN heterostructures by Si substrate removal by Visalli, Domenica, Van Hove, Marleen, Srivastava, Puneet, Derluyn, Joff, Das, Johan, Leys, Maarten, Degroote, Stefan, Cheng, Kai, Germain, Marianne, Borghs, Gustaaf

    Published in Applied physics letters (13-09-2010)
    “…The breakdown mechanism in GaN-based heterostructures (HFETs) grown on silicon substrate is investigated in detail by TCAD simulations and silicon substrate…”
    Get full text
    Journal Article
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    Record Breakdown Voltage (2200 V) of GaN DHFETs on Si With 2- \mu\hbox Buffer Thickness by Local Substrate Removal by Srivastava, Puneet, Das, Jo, Visalli, Domenica, Van Hove, Marleen, Malinowski, Pawel E, Marcon, Denis, Lenci, Silvia, Geens, Karen, Kai Cheng, Leys, Maarten, Decoutere, Stefaan, Mertens, Robert P, Borghs, Gustaaf

    Published in IEEE electron device letters (01-01-2011)
    “…In this letter, we present a local substrate removal technology (under the source-to-drain region), reminiscent of through-silicon vias and report on the…”
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    Journal Article
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    Record Breakdown Voltage (2200 V) of GaN DHFETs on Si With 2- mu hbox m Buffer Thickness by Local Substrate Removal by Srivastava, Puneet, Das, Jo, Visalli, Domenica, Van Hove, Marleen, Malinowski, Pawel E, Marcon, Denis, Lenci, Silvia, Geens, Karen, Cheng, Kai, Leys, Maarten, Decoutere, Stefaan, Mertens, Robert P, Borghs, Gustaaf

    Published in IEEE electron device letters (01-01-2011)
    “…In this letter, we present a local substrate removal technology (under the source-to-drain region), reminiscent of through-silicon vias and report on the…”
    Get full text
    Journal Article
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    High temperature on- and off-state stress of GaN-on-Si HEMTs with in-situ Si3N4 cap layer by Marcon, Denis, Medjdoub, Farid, Visalli, Domenica, Van Hove, Marleen, Derluyn, Joff, Das, Jo, Degroote, Stefan, Leys, Maarten, Kai Cheng, Decoutere, Stefaan, Mertens, Robert, Germain, Marianne, Borghs, Gustaaf

    “…In this work the stability of Gallium Nitride based high electron mobility transistors grown on 4-in Si substrate (GaN-on-Si HEMTs) were tested both in…”
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    Conference Proceeding
  17. 17

    Water and Copper Contamination in SiOC:H Damascene: Novel Characterization Methodology based on Triangular Voltage Sweep Measurements by Ciofi, I., Tokei, Z., Visalli, D., Van Hove, M.

    “…We evaluated the triangular voltage sweep (TVS) method as a new technique to address the degradation mechanisms that occur in Cu/low-k interconnects. TVS…”
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    Conference Proceeding