Search Results - "Via, G. D."

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    Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors by Douglas, E.A., Chang, C.Y., Gila, B.P., Holzworth, M.R., Jones, K.S., Liu, L., Kim, Jinhyung, Jang, Soohwan, Via, G.D., Ren, F., Pearton, S.J.

    Published in Microelectronics and reliability (2012)
    “…► AlGaN/GaN HEMTs exhibit a negative temperature dependence for V CRI. ► Breakdown at V CRI does not occur immediately with applied bias. ► DC stress results…”
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    Journal Article Conference Proceeding
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    AlGaN/GaN High Electron Mobility Transistor degradation under on- and off-state stress by Douglas, E.A., Chang, C.Y., Cheney, D.J., Gila, B.P., Lo, C.F., Lu, Liu, Holzworth, R., Whiting, P., Jones, K., Via, G.D., Kim, Jinhyung, Jang, Soohwan, Ren, Fan, Pearton, S.J.

    Published in Microelectronics and reliability (01-02-2011)
    “…AlGaN/GaN High Electron Mobility Transistors (HEMTs) with various gate lengths have been step-stressed under both on- and off-state conditions. On-state, high…”
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    Journal Article Conference Proceeding
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    RF Power Measurements of InAlN/GaN Unstrained HEMTs on SiC Substrates at 10 GHz by Jessen, G.H., Gillespie, J.K., Via, G.D., Crespo, A., Langley, D., Aumer, M.E., Ward, C.S., Henry, H.G., Thomson, D.B., Partlow, D.P.

    Published in IEEE electron device letters (01-05-2007)
    “…Unstrained high-electron mobility transistors (HEMTs) were fabricated from InAlN/GaN on semi-insulating SiC substrates. The devices had 0.24-mum T-gates with a…”
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    Journal Article
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    High-Power Ka-Band Performance of AlInN/GaN HEMT With 9.8-nm-Thin Barrier by Crespo, A., Bellot, M.M., Chabak, K.D., Gillespie, J.K., Jessen, G.H., Miller, V., Trejo, M., Via, G.D., Walker, D.E., Winningham, B.W., Smith, H.E., Cooper, T.A., Gao, X., Guo, S.

    Published in IEEE electron device letters (01-01-2010)
    “…We report the first CW Ka-band radio-frequency (RF) power measurements at 35 GHz from a passivated Al 0.82 In 0.18 N/GaN high-electron mobility transistor on…”
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    Journal Article
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    Thermal Properties of AlGaN/GaN HFETs on Bulk GaN Substrates by Killat, N., Montes, M., Pomeroy, J. W., Paskova, T., Evans, K. R., Leach, J., Li, X., Ozgur, U., Morkoc, H., Chabak, K. D., Crespo, A., Gillespie, J. K., Fitch, R., Kossler, M., Walker, D. E., Trejo, M., Via, G. D., Blevins, J. D., Kuball, M.

    Published in IEEE electron device letters (01-03-2012)
    “…Micro-Raman thermography, microphotoluminescence spectroscopy, and thermal simulation were used to study the thermal properties of AlGaN/GaN heterostructure…”
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    Journal Article
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    Effects of Sc2O3 and MgO passivation layers on the output power of AlGaN/GaN HEMTs by Gillespie, J.K., Fitch, R.C., Sewell, J., Dettmer, R., Via, G.D., Crespo, A., Jenkins, T.J., Luo, B., Mehandru, R., Kim, J., Ren, F., Gila, B.P., Onstine, A.H., Abernathy, C.R., Pearton, S.J.

    Published in IEEE electron device letters (01-09-2002)
    “…The low temperature (100/spl deg/C) deposition of Sc 2 O 3 or MgO layers is found to significantly increase the output power of AlGaN/GaN HEMTs. At 4 GHz,…”
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    Journal Article
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    Non-Arrhenius Degradation of AlGaN/GaN HEMTs Grown on Bulk GaN Substrates by Tapajna, M., Killat, N., Moereke, J., Paskova, T., Evans, K. R., Leach, J., Li, X., Ozgur, Ü, Morkoc, H., Chabak, K. D., Crespo, A., Gillespie, J. K., Fitch, R., Kossler, M., Walker, D. E., Trejo, M., Via, G. D., Blevins, J. D., Kuball, M.

    Published in IEEE electron device letters (01-08-2012)
    “…The reliability of AlGaN/GaN HEMTs processed on bulk GaN substrates was studied using electrical and optical methods, showing a decreasing degradation with…”
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    Journal Article
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    High performance 0.14 μm gate-length AlGaN/GaN power HEMTs on SiC by Jessen, G.H., Fitch, R.C., Gillespie, J.K., Via, G.D., Moser, N.A., Yannuzzi, M.J., Crespo, A., Sewell, J.S., Dettmer, R.W., Jenkins, T.J., Davis, R.F., Yang, J., Khan, M.A., Binari, S.C.

    Published in IEEE electron device letters (01-11-2003)
    “…High electron mobility transistors (HEMTs) were fabricated from AlGaN/GaN on semi-insulating SiC substrates with excellent performance and high yield. The…”
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    Journal Article
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    Ohmic contact characterization of AlGaN/GaN device layers with spatially localized LEEN spectroscopy by Jessen, G.H, White, B.D, Bradley, S.T, Smith, P.E, Brillson, L.J, Van Nostrand, J.E, Fitch, R, Via, G.D, Gillespie, J.K, Dettmer, R.W, Sewell, J.S

    Published in Solid-state electronics (01-09-2002)
    “…Low energy electron-excited nano-luminescence (LEEN) spectroscopy has been used to correlate higher intensities of deep level emissions with higher ohmic…”
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    Journal Article
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    Electrical characteristics of proton-irradiated Sc2O3 passivated AlGaN/GaN high electron mobility transistors by Luo, B., Kim, Jihyun, Ren, F., Gillespie, J. K., Fitch, R. C., Sewell, J., Dettmer, R., Via, G. D., Crespo, A., Jenkins, T. J., Gila, B. P., Onstine, A. H., Allums, K. K., Abernathy, C. R., Pearton, S. J., Dwivedi, R., Fogarty, T. N., Wilkins, R.

    Published in Applied physics letters (03-03-2003)
    “…Sc 2 O 3 -passivated AlGaN/GaN high electron mobility transistors (HEMTs) were irradiated with 40 MeV protons to a fluence corresponding to approximately 10…”
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    Journal Article
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    Degradation of sub-micron gate AlGaN/GaN HEMTs due to reverse gate bias by Douglas, E A, Chih-Yang Chang, Anderson, T, Hite, J, Liu Lu, Chien-Fong Lo, Byung-Hwan Chu, Cheney, D J, Gila, B P, Ren, F, Via, G D, Whiting, P, Holzworth, R, Jones, K S, Soohwan Jang, Pearton, S J

    “…GaN High Electron mobility transistors (HEMTs) were electrically step-stressed under high reverse gate bias conditions. Once a threshold voltage is reached,…”
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    Conference Proceeding
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    Effects of surface treatments on isolation currents in AlGaN/GaN high-electron-mobility transistors by Moser, N. A., Gillespie, J. K., Via, G. D., Crespo, A., Yannuzzi, M. J., Jessen, G. H., Fitch, R. C., Luo, B., Ren, F., Gila, B. P., Onstine, A. H., Abernathy, C. R., Pearton, S. J.

    Published in Applied physics letters (17-11-2003)
    “…Interdevice isolation currents in mesa-isolated AlGaN/GaN high-electron-mobility transistors are found to exhibit thermally activated behavior, with an…”
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    Journal Article
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    Effects of deep-level defects on ohmic contact and frequency performance of AlGaN/GaN high-electron-mobility transistors by Jessen, G. H., Fitch, R. C., Gillespie, J. K., Via, G. D., White, B. D., Bradley, S. T., Walker, D. E., Brillson, L. J.

    Published in Applied physics letters (21-07-2003)
    “…We have characterized AlGaN/GaN high-electron-mobility-transistors on sapphire and silicon carbide substrates with electrical and microcathodoluminescence…”
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    Journal Article
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    Direct observation of 0.57 eV trap-related RF output power reduction in AlGaN/GaN high electron mobility transistors by Arehart, A.R., Sasikumar, A., Rajan, S., Via, G.D., Poling, B., Winningham, B., Heller, E.R., Brown, D., Pei, Y., Recht, F., Mishra, U.K., Ringel, S.A.

    Published in Solid-state electronics (01-02-2013)
    “…► EC−0.57eV deep level observed in all MOCVD-grown GaN HEMTs. ► EC−0.57eV level increases ∼5× with high temperature RF stressing. ► Pulsed I–V exhibit…”
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    Journal Article
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    Prospects for Gallium Nitride-on-Diamond Transistors by Blevins, J. D., Via, G. D.

    “…Strategies aimed at improving the near junction heat removal of Gallium Nitride (GaN) High Electron Mobility Transistors (HEMTs) are presently limiting GaN…”
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    Conference Proceeding
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    Simplified ohmic and Schottky contact formation for field effect transistors using the single layer integrated metal field effect transistor (SLIMFET) process by DeSalvo, G.C., Quach, T.K., Bozada, C.A., Dettmer, R.W., Nakano, K., Gillespie, J.K., Via, G.D., Ebel, J.L., Havasy, C.K.

    “…A new III-V semiconductor device fabrication process for GaAs-based field effect transistors (FET) is presented which uses a single lithographic process and…”
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    Journal Article
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    Commercial-off-the-shelf algan/gan hemt device reliability study after exposure to heavy ion radiation by Poling, B.S., Via, G.D., Bole, K.D., Johnson, E.E., McDermott, J.M.

    Published in Microelectronics and reliability (01-01-2017)
    “…The reliability of commercial-off-the-shelf (COTS) GaN HEMTs was studied after irradiation using heavy ions of Neon (Ne), Silicon (Si), and Argon (Ar). Devices…”
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    Journal Article
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