Search Results - "Verestek, Wolfgang"

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  1. 1

    Molecular Dynamics Simulation of High-Temperature Creep Behavior of Nickel Polycrystalline Nanopillars by Xu, Xiang, Binkele, Peter, Verestek, Wolfgang, Schmauder, Siegfried

    Published in Molecules (Basel, Switzerland) (29-04-2021)
    “…As Nickel (Ni) is the base of important Ni-based superalloys for high-temperature applications, it is important to determine the creep behavior of its…”
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    Journal Article
  2. 2

    Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC by Yan, Shuang, Verestek, Wolfgang, Zeizinger, Harald, Schmauder, Siegfried

    Published in Polymers (13-09-2021)
    “…The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties…”
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    Journal Article
  3. 3

    Molecular dynamics simulations investigating consecutive nucleation, solidification and grain growth in a twelve-million-atom Fe-system by Okita, Shin, Verestek, Wolfgang, Sakane, Shinji, Takaki, Tomohiro, Ohno, Munekazu, Shibuta, Yasushi

    Published in Journal of crystal growth (15-09-2017)
    “…Continuous processes of homogeneous nucleation, solidification and grain growth are spontaneously achieved from an undercooled iron melt without any…”
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    Journal Article
  4. 4

    Green Characterization of Advanced Sustainable Materials for Engineering Applications: Determination of Thermal Properties using Molecular Dynamics by Ramzy, Amna, Abdallah, Mohamed, Khairat, Laila, Verestek, Wolfgang, Schmauder, Siegfried, Omar, Khloud, Hany, Marwa, Ibrahim, Hesham, Abu Elmagd, Wael

    “…The concept of holistic sustainability offers novel approaches to minimize the impact of laboratory experiments in the field of engineering polymer materials…”
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    Journal Article
  5. 5

    A multiscale modeling on fracture and strength of graphene platelets reinforced epoxy by Bian, Peiliang, Verestek, Wolfgang, Yan, Shuang, Xu, Xiang, Qing, Hai, Schmauder, Siegfried

    Published in Engineering fracture mechanics (01-08-2020)
    “…[Display omitted] •MD simulation on crosslinking and deformation of pure and graphene reinforced epoxy.•A new multiscale simulation framework for…”
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    Journal Article
  6. 6
  7. 7

    Microstructural Modeling and Simulation of a Carbon Black-Based Conductive PolymerA Template for the Virtual Design of a Composite Material by Wang, Yuanzhen, Xu, Chensheng, Jahnke, Timotheus, Verestek, Wolfgang, Schmauder, Siegfried, Spatz, Joachim P.

    Published in ACS omega (23-08-2022)
    “…Carbon black is the most frequently applied conductive additive in rubber and polymer composites. In this work, we show how a carbon black microstructure in a…”
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    Journal Article