Search Results - "Verbinnen, Greet"

Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material by Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Xiao Liu, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan

“…Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has…”
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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications by Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, Eric

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding has become a key element in device…”
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Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film by Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Guerrero, Alice, Bailey, Susan, Privett, Mark, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

“…Handling wafers with sub-100 μm thicknesses requires a support or carrier wafer during handling, transport and processing in a semiconductor process line. This…”
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A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP by Phommahaxay, Alain, Potoms, Goedele, Bertheau, Julien, Bex, Pieter, Duval, Fabrice, Podpod, Arnita, Teng Wang, Verbinnen, Greet, Beyer, Gerald, Sleeckx, Erik, Beyne, Eric, Nakamura, Atsushi, Kamochi, Yoshitaka

“…Among the technological developments pushed by the adoption of Through Silicon Vias and 3D Stacked IC technologies, wafer thinning on a temporary carrier has…”
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Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer by Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Yess, Kim, Arnold, Kim

“…Over the past few years, temporary bonding has expanded together with the development of 3D stacked IC (SIC) technology. As maturity of the various processes…”
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Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal by Phommahaxay, Alain, Nakamura, Atsushi, Jourdain, Anne, Verbinnen, Greet, Kamochi, Yoshitaka, Koyama, Ichiro, Iwai, Yu, Sawano, Mitsuru, Tan, Shiro, Miller, A., Beyer, Gerald, Sleeckx, E., Beyne, Eric

“…Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As…”
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Fabrication and successful in-vivo implantation of a flexible neural implant with a hybrid polyimide-silicon design by Andrei, A., Tutunjyan, N., Verbinnen, G., VanPut, S., Krylychkina, O., Eberle, W., Musa, S.

“…A flexible neural implant was designed and fabricated using an novel integration approach that offers the advantages of both silicon and polymer based…”
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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding by Phommahaxay, A., Jourdain, A., Verbinnen, G., Woitke, T., Bisson, P., Gabriel, M., Spiess, W., Guerrero, A., McCutcheon, J., Puligadda, R., Bex, P., Van den Eede, A., Swinnen, B., Beyer, G., Miller, A., Beyne, E.

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in…”
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Process characterization of thin wafer debonding with thermoplastic materials by Phommahaxay, Alain, Jourdain, Anne, Verbinnen, Greet, Woitke, Tobias, Stieber, Ralf, Bisson, Peter, Gabriel, Markus, Spiess, Walter, Guerrero, Alice, McCutcheon, Jeremy, Puligadda, Rama, Bex, Pieter, Van den Eede, Axel, Swinnen, Bart, Beyer, Gerald, Miller, Andy, Beyne, Eric

“…Among the technological developments pushed by the emergence of 3D Stacked IC technologies, temporary wafer bonding and thinning have become key elements in…”
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Temporary wafer bonding defect impact assessment on substrate thinning: Process enhancement through systematic defect track down by Phommahaxay, A., Verbinnen, G., Suhard, S., Bex, P., Pancken, J., Lismont, M., Van den Eede, A., Jourdain, A., Woitke, T., Bisson, P., Spiess, W., Swinnen, B., Beyer, G., Miller, A., Beyne, E.

“…Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As…”
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TSV metrology and inspection challenges by Alapati, R., Travaly, Y., Van Olmen, J., Teixeira, R.C., Vaes, J., van Cauwenbergh, M., Jourdain, A., Verbinnen, G., Marcuccilli, G., Florence, G., Wolfling, S., Pelissier, C., Haiping Zhang, Sinha, J., Machura, A., Malik, I.

“…The interest in 3D packaging and specifically TSV processes has grown significantly in the past few years, with nearly every major chip manufacturer announcing…”
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