Search Results - "Vandamme, E.P."
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Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-wafer RF test-structures
Published in IEEE transactions on electron devices (01-04-2001)“…In order to model the RF behavior of a device-under-test (DUT), e.g., active and passive devices, dedicated on-wafer test-structures are required. However,…”
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Journal Article -
2
Critical discussion on unified 1/f noise models for MOSFETs
Published in IEEE transactions on electron devices (01-11-2000)“…Recently, unified noise models, like BSIM3, have been proposed in literature to describe the 1/f noise of n- and p-type MOSFETs in all operating regimes. These…”
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Journal Article -
3
Elevated source/drain by sacrificial selective epitaxy for high performance deep submicron CMOS: Process window versus complexity
Published in IEEE transactions on electron devices (01-07-2000)“…The continuous downscaling of CMOS devices aims at cost reduction and performance improvement. Process development constantly faces new constraints and…”
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Journal Article -
4
Modeling the subthreshold swing in MOSFET's
Published in IEEE electron device letters (01-08-1997)“…This letter reports on the bias-dependence of the inverse subthreshold slope or subthreshold swing in MOSFET's. It is shown by calculations and verified by…”
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Journal Article -
5
1/f noise and its coherence as a diagnostic tool for quality assessment of potentiometers
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01-09-1994)“…The excess noise of different types of potentiometers has been investigated, and all showed a 1/f noise power-spectral density. Two types of conductive tracks…”
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Journal Article -
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Current crowding and its effect on 1/ f noise and third harmonic distortion – a case study for quality assessment of resistors
Published in Microelectronics and reliability (01-11-2000)“…In this paper, we discuss the impact of current crowding on 1/ f noise generation and third harmonic distortion in semiconductor devices. We propose a model…”
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Journal Article -
7
Development of a RF large signal MOSFET model, based on an equivalent circuit, and comparison with the BSIM3v3 compact model
Published in Solid-state electronics (01-03-2002)“…The improved RF performance of silicon-based technologies over the years and their potential use in telecommunication applications has increased the research…”
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Journal Article -
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Impact of silicon substrate, iron contamination and perimeter on saturation current and noise in n+p diodes
Published in Solid-state electronics (01-06-1997)“…In this article two different generations of silicon material from the early-eighties and the mid-nineties are compared. The impact of iron contamination and…”
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Journal Article -
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Impact of silicidation on the excess noise behaviour of mos transistors
Published in Solid-state electronics (01-11-1995)“…The excess noise behaviour of silicided and non-silicided p- and n-channel MOSTs, biased in the ohmic region, has been investigated. Only a minor difference in…”
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Journal Article -
10
Diagnostics of the quality of MOSFETs
Published in Microelectronics and reliability (1996)“…The excess noise behaviour of silicided p-channel MOSFETs is investigated. Due to contact problems, generation-recombination noise spectra are observed…”
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Journal Article -
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Low frequency noise analysis as a diagnostic tool to assess the quality of 0.25μm Ti-silicided poly lines
Published in Microelectronics and reliability (01-06-1998)“…In this paper, do and low frequency noise measurement results on Ti-silicided poly lines are presented and analysed. Besides Raman scattering [1], low…”
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Journal Article Conference Proceeding -
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Use of Vectorial Large-Signal Measurements to Experimentally Evaluate Digital Circuits at Microwave Frequencies: Application to Inverters
Published in 57th ARFTG Conference Digest (01-05-2001)“…In this work, we characterise for the first time a digital circuit, and more specifically an inverter, by means of vectorial large-signal measurements. The…”
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Conference Proceeding -
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Capabilities of Vectorial Large-Signal Measurements to Validate RF Large-Signal Device Models
Published in 58th ARFTG Conference Digest (01-11-2001)“…The trend towards system-on-chip realisation tightens the design specifications and consequently imposes high accuracy requirements on device models. This…”
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Conference Proceeding -
14
Impact of non-quasi-static effects on the high frequency small-signal behaviour of MOSFETs
Published in ICM 2000. Proceedings of the 12th International Conference on Microelectronics. (IEEE Cat. No.00EX453) (2000)“…In this paper, we investigate the impact of nonquasi-static (NQS) effects on the small-signal RF behaviour of MOSFETs. We observed that the transistor power…”
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Conference Proceeding -
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5.5GHz LSNA MOSFET modeling for RF CMOS circuit design
Published in 60th ARFTG Conference Digest, Fall 2002 (2002)“…The recent trend towards integrating an entire transceiver, with all its RF/analog/DSP functions, on a single CMOS chip is a consequence of strong market…”
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Conference Proceeding -
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Reliable extraction of RF figures-of-merit for MOSFETs
Published in 29th European Solid-State Device Research Conference (1999)Get full text
Conference Proceeding -
17
Accuracy assessment of the BSIM3v3 MOSFET compact model for large signal RF applications
Published in 2000 Topical Meetings on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (Cat. No.00EX397) (2000)“…The design of RF systems requires accurate models to describe both small signal and large signal RF analog behaviour of transistors. So far, compact models…”
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Conference Proceeding