Search Results - "Vanalli, G.P."

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  1. 1

    A Modified IBIS Model Aimed at Signal Integrity Analysis of Systems in Package by Pulici, P., Girardi, A., Vanalli, G.P., Izzi, R., Bernardi, G., Ripamonti, G., Strollo, A., Campardo, G.

    “…Input-output buffer information specification BIS (IBIS) models are descriptions of the output buffers, used by the printed circuit board (PCB) designer to…”
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    Journal Article
  2. 2

    Signal Integrity Flow for System-in-Package and Package-on-Package Devices by Pulici, Paolo, Vanalli, Gian Pietro, Dellutri, Michele A., Guarnaccia, Domenico, Lo Iacono, Filippo, Campardo, Giovanni, Ripamonti, Giancarlo

    Published in Proceedings of the IEEE (01-01-2009)
    “…As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address…”
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    Journal Article
  3. 3

    A Reduced Output Ringing CMOS Buffer by Bartolini, M., Pulici, P., Stoppino, P.P., Campardo, G., Vanalli, G.P.

    “…In a multichip module, the parasitic elements of the interconnections influence the performance of the devices enclosed in the package. Phenomena such as…”
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    Journal Article
  4. 4

    Risks for Signal Integrity in System in Package and Possible Remedies by Rossi, D., Angelini, P., Metra, C., Campardo, G., Vanalli, G.P.

    Published in 2008 13th European Test Symposium (01-05-2008)
    “…We analyze the electrical phenomena that can affect the integrity of the communication among different chips within a system in package (SiP). We address these…”
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    Conference Proceeding
  5. 5

    Interconnection effects in Package on Package design by Pulici, P., Candela, G., Campardo, G., Vanalli, G.P., Stoppino, P.P., Losavio, A., Lessio, T., Dellutri, M., Guarnaccia, D., Lo Iacono, F.

    “…The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP…”
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    Conference Proceeding
  6. 6

    A single-chip telephone line interface in BCD technology by Consiglio, P., Clerici, G.C., Vanalli, G.P.

    “…The authors describe an integrated electronic hook switch which, in conjunction with a low-voltage monochip, makes a two-chip telephone set possible. This chip…”
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    Conference Proceeding
  7. 7

    A single chip BiMOS telephone set by Nguyen, C., Consiglio, P., Adduci, F., Vanalli, G.P., Marti, F., Robbe, M., Le Corre, J.L.

    “…A single-chip telephone set in BCD (bipolar, CMOS and DMOS) technology is described. It integrates all of the functions usually found in a telephone set:…”
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    Conference Proceeding