Search Results - "Vanalli, G.P."
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A Modified IBIS Model Aimed at Signal Integrity Analysis of Systems in Package
Published in IEEE transactions on circuits and systems. I, Regular papers (01-08-2008)“…Input-output buffer information specification BIS (IBIS) models are descriptions of the output buffers, used by the printed circuit board (PCB) designer to…”
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Journal Article -
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Signal Integrity Flow for System-in-Package and Package-on-Package Devices
Published in Proceedings of the IEEE (01-01-2009)“…As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address…”
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Journal Article -
3
A Reduced Output Ringing CMOS Buffer
Published in IEEE transactions on circuits and systems. II, Express briefs (01-02-2007)“…In a multichip module, the parasitic elements of the interconnections influence the performance of the devices enclosed in the package. Phenomena such as…”
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Journal Article -
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Risks for Signal Integrity in System in Package and Possible Remedies
Published in 2008 13th European Test Symposium (01-05-2008)“…We analyze the electrical phenomena that can affect the integrity of the communication among different chips within a system in package (SiP). We address these…”
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Conference Proceeding -
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Interconnection effects in Package on Package design
Published in 2007 IEEE Workshop on Signal Propagation on Interconnects (01-05-2007)“…The PoP (Package on Package) design procedure is described in this paper, focusing principally on the constraints and the system characteristics. The PoP…”
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Conference Proceeding -
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A single-chip telephone line interface in BCD technology
Published in 1992 IEEE International Solid-State Circuits Conference Digest of Technical Papers (1992)“…The authors describe an integrated electronic hook switch which, in conjunction with a low-voltage monochip, makes a two-chip telephone set possible. This chip…”
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Conference Proceeding -
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A single chip BiMOS telephone set
Published in IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers (1989)“…A single-chip telephone set in BCD (bipolar, CMOS and DMOS) technology is described. It integrates all of the functions usually found in a telephone set:…”
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Conference Proceeding