Search Results - "Van Olmen, J."

'What kind of life is this?' Diabetes related notions of wellbeing among adults in eastern Uganda and implications for mitigating future chronic disease risk by Mayega, R W, Ekirapa, E, Kirunda, B, Nalwadda, C, Aweko, J, Tomson, G, Ostenson, C G, Van Olmen, J, Daivadanam, M, Kiguli, J

“…Effective prevention and care for type 2 diabetes requires that people link healthy behaviours to chronic disease-related wellbeing. This study explored how…”
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SARS-CoV-2 Infection in Captive Hippos ( Hippopotamus amphibius ), Belgium by Vercammen, Francis, Cay, Brigitte, Gryseels, Sophie, Balmelle, Nadège, Joffrin, Léa, Van Hoorde, Koenraad, Verhaegen, Bavo, Mathijs, Elisabeth, Van Vredendaal, Rianne, Dharmadhikari, Tanmay, Chiers, Koen, Van Olmen, Tim J S, Agliani, Gianfilippo, Van den Brand, Judith M A, Leirs, Herwig

“…Two adult female hippos in Zoo Antwerp who were naturally infected with SARS-CoV-2 showed nasal discharge for a few days. Virus was detected by…”
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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration by Olmen, J. Van, Huyghebaert, C., Coenen, J., Aelst, J. Van, Sleeckx, E., Ammel, A. Van, Armini, S., Katti, G., Vaes, J., Dehaene, W., Beyne, E., Travaly, Y.

“…In this paper we will highlight key integration issues that were encountered during the development of the 3D-stacked IC Through Silicon Via (TSV) module and…”
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A policy analysis of the chronic care policies in Belgium by Danhieux, K, Martens, M, Colman, E, Remmen, R, Van Olmen, J, Anthierens, S

“…Abstract Introduction Chronic diseases form the largest burden of disease in European countries. Redesign of health systems towards chronic integrated care is…”
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Process evaluation of care scale up for hypertension in diabetes in Belgium, Slovenia and Cambodia by Martens, M, Wouters, E, Stjepanovič, TK, Stojnic, N, Chham, S, Por, I, van Olmen, J, Klipstein-Grobusch, K, Boateng, D

“…Background Effective integrated care interventions for hypertension (HT) and type 2 diabetes (T2D) exist and need to be scaled-up. The ‘SCale-Up diaBetes and…”
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The quality of routine data for measuring facility-based maternal mortality in public and private health facilities in Kampala City, Uganda by Birabwa, Catherine, Banke-Thomas, Aduragbemi, Semaan, Aline, van Olmen, Josefien, Kananura, Rornald Muhumuza, Arinaitwe, Emma Sam, Waiswa, Peter, Beňová, Lenka

“…Routine health facility data are an important source of health information in resource-limited settings. Regular quality assessments are necessary to improve…”
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Scale-up integrated care for diabetes and hypertension in Cambodia, Slovenia and Belgium by Klipstein-Grobusch, K, Poplas Susič, T A, Por, I, Wouters, E, Makivič, I, Te, V, Martens, M, Danhieux, K, Remmen, R, Van Olmen, J

“…Abstract Many countries struggle to find the best way to treat hypertension (HT) and type 2 diabetes (T2D). As a result, many patients receive suboptimal care,…”
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SMART2D—development and contextualization of community strategies to support self-management in prevention and control of type 2 diabetes in Uganda, South Africa, and Sweden by Absetz, Pilvikki, Van Olmen, Josefien, Guwatudde, David, Puoane, Thandi, Alvesson, Helle Mölsted, Delobelle, Peter, Mayega, Roy, Kasujja, Francis, Naggayi, Gloria, Timm, Linda, Hassen, Mariam, Aweko, Juliet, De Man, Jeroen, Álvarez Ahlgren, Jhon, Annerstedt, Kristi Sidney, Daivadanam, Meena

“…When developing programs to help patients with type 2 diabetes or its risk factors to manage their condition better, it is important to take into account the…”
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Process evaluation of a pragmatic implementation trial to support self-management for the prevention and management of type 2 diabetes in Uganda, South Africa and Sweden in the SMART2D project by van Olmen, Josefien, Absetz, Pilvikki, Mayega, Roy William, Timm, Linda, Delobelle, Peter, Alvesson, Helle Mölsted, Naggayi, Glorai, Kasujja, Francis, Hassen, Mariam, de Man, Jeroen, Sidney Annerstedt, Kristi, Puoane, Thandi, Östenson, Claes-Göran, Tomson, Goran, Guwatudde, David, Daivadanam, Meena

“…IntroductionType 2 diabetes (T2D) and its complications are increasing rapidly. Support for healthy lifestyle and self-management is paramount, but not…”
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P46 Survey of patients in primary care for diabetes health centres in Kinshasa, DR Congo by Kalobu, J.C, Bewa, E, Darras, C, De Clerck, M, Van Olmen, J, Kegels, G, Criel, B

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Using a cross-contextual reciprocal learning approach in a multisite implementation research project to improve self-management for type 2 diabetes by van Olmen, Josefien, Delobelle, Peter, Guwatudde, David, Absetz, Pilvikki, Sanders, David, Mölsted Alvesson, Helle, Puoane, Thandi, Ostenson, Claes-Goran, Tomson, Göran, Mayega, Roy William, Sundberg, Carl Johan, Peterson, Stefan, Daivadanam, Meena

“…This paper reports on the use of reciprocal learning for identifying, adopting and adapting a type 2 diabetes self-management support intervention in a…”
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Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performance by Mercha, A, Van der Plas, G, Moroz, V, De Wolf, I, Asimakopoulos, P, Minas, N, Domae, S, Perry, D, Choi, M, Redolfi, A, Okoro, C, Yang, Y, Van Olmen, J, Thangaraju, S, Tezcan, D S, Soussan, P, Cho, J H, Yakovlev, A, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

“…As scaling becomes increasingly difficult, 3D integration has emerged as a viable alternative to achieve the requisite bandwidth and power efficiency…”
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Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures by Yang, Y., Labie, R., Ling, F., Zhao, C., Radisic, A., Van Olmen, J., Travaly, Y., Verlinden, B., De Wolf, I.

“…Through-silicon vias (TSVs) are critical components in most 3D architectures. In this paper, fully filled cylindrical Cu TSVs with a diameter of 5 μm and a…”
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Electrical performance, reliability and microstructure of sub-45 nm copper damascene lines fabricated with TEOS backfill by Leaming-Sphabmixay, K., Van Olmen, J., Moon, K.J., Vanstreels, Kris, D’Haen, J., Tokei, Z., List, S., Beyer, G.

“…The fabrication of narrow Cu trenches using a conformal TEOS backfill approach is shown. Cu trenches with widths down to 30–40 nm were achieved. With an…”
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Electrical performance, reliability and microstructure of sub-45nm copper damascene lines fabricated with TEOS backfill by Leaming-Sphabmixay, K, Van Olmen, J, Moon, K J, Vanstreels, Kris, D'Haen, J, Tokei, Z, List, S, Beyer, G

“…The fabrication of narrow Cu trenches using a conformal TEOS backfill approach is shown. Cu trenches with widths down to 30-40nm were achieved. With an…”
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Borderline and malignant phyllodes tumors of the breast: a population-based study of all cases in the Netherlands 1989–2020 by Bartels, S., van Olmen, J., Bekers, E., Drukker, C., van Duijnhoven, F.

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Management of Phyllodes tumors: a Dutch population-based retrospective cohort between 1989 and 2022 by Van Olmen, J., Bartels, S.A.L., Beerthuizen, A.W.J., Bekers, E.M., Scholten, A.N., Drukker, C.A., Vrancken Peeters, M.J.T.F.D., van Duijnhoven, F.H.

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On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance by Travaly, Y., Mandeep, B., Carbonell, L., Tokei, Z., Van Olmen, J., Iacopi, F., Van Hove, M., Stucchi, M., Maex, K.

“…Interconnect RC delay, predominantly affected by the effective dielectric constant (k-value) and by the copper resistivity (rho Cu ), is an important…”
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Mapping patient pathways for NCDs from a policy perspective: a novel multinational initiative by Danhieux, K, Monnet, F, Safadi, H, Surján, C, Varga, G, Lám, J, Van Olmen, J, Wouters, E

“…Abstract Background Chronic diseases like CVD and DM pose global health challenges. Understanding patient pathways is vital for effective disease management…”
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Impact of thinning and through silicon via proximity on High-k / Metal Gate first CMOS performance by Mercha, A, Redolfi, A, Stucchi, M, Minas, N, Van Olmen, J, Thangaraju, S, Velenis, D, Domae, S, Yang, Y, Katti, G, Labie, R, Okoro, C, Zhao, M, Asimakopoulos, P, De Wolf, I, Chiarella, T, Schram, T, Rohr, E, Van Ammel, A, Jourdain, A, Ruythooren, W, Armini, S, Radisic, A, Philipsen, H, Heylen, N, Kostermans, M, Jaenen, P, Sleeckx, E, Sabuncuoglu Tezcan, D, Debusschere, I, Soussan, P, Perry, D, Van der Plas, G, Cho, J H, Marchal, P, Travaly, Y, Beyne, E, Biesemans, S, Swinnen, B

“…3D integration has the potential to alleviate the performance limitations that CMOS scaling is facing provided that it preserves the integrity of both front…”
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