Search Results - "Van Driel, W D"

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling by Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L.

“…The stress–strain properties of eutectic Sn-Pb and lead-free solders at strain rates between 0.1 s −1 and 300 s −1 are required to support finite-element…”
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Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties by Yazdan Mehr, M., van Driel, W.D., Jansen, K.M.B., Deeben, P., Boutelje, M., Zhang, G.Q.

“…► Degradation of bisphenol A polycarbonate under blue light radiation is studied. ► Increasing the exposure time is associated with yellowing. ► Two stages are…”
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A biomechanical regulatory model for periprosthetic fibrous-tissue differentiation by Huiskes, R, Van Driel, W D, Prendergast, P J, Søballe, K

“…Loosening of implants in bone is commonly associated with a development of fibrous interface tissues, due to interface gaps and a lack of mechanical stability…”
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Time-dependent mechanical behaviour of the periodontal ligament by van Driel, W D, van Leeuwen, E J, Von den Hoff, J W, Maltha, J C, Kuijpers-Jagtman, A M

“…The process of tooth displacement in response to orthodontic forces is thought to be induced by the stresses and strains in the periodontium. The mechanical…”
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Reliability and Lifetime Prediction of Remote Phosphor Plates in Solid-State Lighting Applications Using Accelerated Degradation Testing by Mehr, M. Yazdan, van Driel, W. D., Zhang, G. Q.

“…A methodology, based on accelerated degradation testing, is developed to predict the lifetime of remote phosphor plates used in solid-state lighting (SSL)…”
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High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies by Wong, E.H., Seah, S.K.W., Selvanayagam, C.S., Rajoo, R., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Leoni, M., Tan, L.C., Lai, Y.-S., Yeh, C.-L.

“…This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop…”
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Chemical–mechanical relationship of amorphous/porous low-dielectric film materials by Yuan, C.A., van der Sluis, O., Zhang, G.Q., Ernst, L.J., van Driel, W.D., van Silfhout, R.B.R., Thijsse, B.J.

“…We have performed a series of atomic simulations, from which the chemical–mechanical relationship of the amorphous/porous silica based low-dielectric (low-k)…”
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Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors by Yazdan Mehr, M., Volgbert, S., van Driel, W. D., Zhang, G. Q.

“…A graphene monolayer has been successfully coated on one side of a bisphenol-A-polycarbonate (BPA-PC) plate, used as a substrate for remote phosphor…”
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Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products by Yazdan Mehr, M., van Driel, W.D., Udono, H., Zhang, G.Q.

“…•Discolouration is associated with the oxidation at the surface.•CH band concentration decreases, new oxide features CO and OCO form.•Oxidation reaction at the…”
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A comparison of finite element codes for the solution of biphasic poroelastic problems by Prendergast, P J, van Driel, W D, Kuiper, J H

“…The extent to which three finite element codes can solve problems in biphasic poroelasticity is examined. Both linear and non-linear (that is where the…”
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Prediction of Delamination Related IC & Packaging Reliability Problems by van Driel, W.D., van Gils, M.A.J., van Silfhout, R.B.R., Zhang, G.Q.

“…This paper presents our effort to predict delamination related IC & packaging reliability problems. These reliability problems are driven by the mismatch…”
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Reliability and optical properties of LED lens plates under high temperature stress by Yazdan Mehr, M., van Driel, W.D., Koh, S., Zhang, G.Q.

“…•Thermal degradation of Bisphenol A Polycarbonate at 100–140°C is studied.•Increasing the exposure time is associated with yellowing.•Two stages are observed…”
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Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products by Yazdan Mehr, M., van Driel, W.D., Jansen, K.M.B., Deeben, P., Zhang, G.Q.

“…•Degradation of Bisphenol A Polycarbonate lens under elevated temperature is studied.•Increasing the exposure time is associated with the increasing the…”
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A fast moisture sensitivity level qualification method by Ma, Xiaosong, Jansen, K.M.B., Zhang, G.Q., van Driel, W.D., van der Sluis, O., Ernst, L.J., Regards, C., Gautier, C., Frémont, H.

“…In this paper, a fast moisture sensitivity level (MSL) qualification method and a fast moisture characterization method are discussed. The fast moisture…”
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Multi-physics reliability simulation for solid state lighting drivers by Tarashioon, S., van Driel, W.D., Zhang, G.Q.

“…•A new system level methodology to study the reliability of SSL drivers.•Integration of the component behavior in a system level simulation.•Help understanding…”
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Characterization and Modelling of Moisture Driven Interface Failures by VAN GILS, M. A. J, HABETS, P. J. J. H. A, ZHANG, G. Q, VAN DRIEL, W. D, SCHREURS, P. J. G

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Advances in the drop-impact reliability of solder joints for mobile applications by Wong, E.H., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Owens, N., Lai, Y.-S.

“…This manuscript presents the research studies in the drop-impact reliability of solder joints in the PCB assemblies intended for mobile applications. The works…”
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Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP by Sun, F., Hochstenbach, P., Van Driel, W.D., Zhang, G.Q.

“…In this study, the brittle fracture of intermetallic compound (IMC) between low-Ag SnAgCu (SAC) solder and under bump metallization (UBM) under high-speed pull…”
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Facing the challenge of designing for Cu/low- k reliability by van Driel, W.D.

“…With the decrease of the feature size to 90 nm and lower new materials are introduced in the waferfabs. Copper replaced aluminium and low- k dielectrics served…”
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Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods by van Driel, W.D., Liu, C.J., Zhang, G.Q., Janssen, J.H.J., van Silfhout, R.B.R., van Gils, M.A.J., Ernst, L.J.

“…Interfacial delamination is an often-observed failure mode in multi-layered IC packaging structures, which will not only influence the yield of wafer…”
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