Search Results - "Van Dal, Mark J.H."

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  1. 1

    Germanium p-Channel FinFET Fabricated by Aspect Ratio Trapping by van Dal, Mark J. H., Vellianitis, Georgios, Duriez, Blandine, Doornbos, Gerben, Chih-Hua Hsieh, Bi-Hui Lee, Kai-Min Yin, Passlack, Matthias, Diaz, Carlos H.

    Published in IEEE transactions on electron devices (01-02-2014)
    “…We report scaled Ge p-channel FinFETs fabricated on a 300-mm Si wafer using the aspect-ratio-trapping technique. For long-channel devices, a combination of a…”
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    Journal Article
  2. 2

    Germanium n-Channel Planar FET and FinFET: Gate-Stack and Contact Optimization by van Dal, Mark J. H., Duriez, Blandine, Vellianitis, Georgios, Doornbos, Gerben, Passlack, Matthias, Yee-Chia Yeo, Diaz, Carlos H.

    Published in IEEE transactions on electron devices (01-11-2015)
    “…We demonstrate Ge enhancement-mode nMOS FinFETs fabricated on 300-mm Si wafers, incorporating an optimized gate-stack (interface trap density D it below 2 × 10…”
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    Journal Article
  3. 3

    High-Performance InAs Gate-All-Around Nanowire MOSFETs on 300 mm Si Substrates by Doornbos, Gerben, Holland, Martin, Vellianitis, Georgios, Van Dal, Mark J. H., Duriez, Blandine, Oxland, Richard, Afzalian, Aryan, Ta-Kun Chen, Hsieh, Gordon, Passlack, Matthias, Yee-Chia Yeo

    “…We report on the first realization of InAs n-channel gate-all-around nanowire MOSFETs on 300 mm Si substrates using a fully very large-scale integration…”
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    Journal Article
  4. 4

    Investigation of Strain Engineering in FinFETs Comprising Experimental Analysis and Numerical Simulations by Conzatti, F, Serra, N, Esseni, D, De Michielis, M, Paussa, A, Palestri, P, Selmi, L, Thomas, S M, Whall, T E, Leadley, D, Parker, E H C, Witters, L, Hytch, M J, Snoeck, E, Wang, T J, Lee, W C, Doornbos, G, Vellianitis, G, van Dal, M J H, Lander, R J P

    Published in IEEE transactions on electron devices (01-06-2011)
    “…This study combines direct measurements of strain, electrical mobility measurements, and a rigorous modeling approach to provide insights about strain-induced…”
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    Journal Article
  5. 5

    Evaluation of Transmission Line Model Structures for Silicide-to-Silicon Specific Contact Resistance Extraction by Stavitski, N., van Dal, M.J.H., Lauwers, A., Vrancken, C., Kovalgin, A.Y., Wolters, R.A.M.

    Published in IEEE transactions on electron devices (01-05-2008)
    “…In order to measure silicide-to-silicon specific contact resistance rho c , transmission line model (TLM) structures were proposed as attractive candidates for…”
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    Journal Article
  6. 6

    Ni based silicides for 45 nm CMOS and beyond by Lauwers, Anne, Kittl, Jorge A., Van Dal, Mark J.H., Chamirian, Oxana, Pawlak, Malgorzata A., de Potter, Muriel, Lindsay, Richard, Raymakers, Toon, Pages, Xavier, Mebarki, Bencherki, Mandrekar, Tushar, Maex, Karen

    “…Material issues that impact the applicability of Ni based silicides to CMOS flows were studied, including the excessive silicidation of narrow features, the…”
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    Journal Article
  7. 7

    Ni fully silicided gates for 45 nm CMOS applications by Kittl, Jorge A., Lauwers, Anne, Pawlak, Malgorzata A., van Dal, Mark J.H., Veloso, Anabela, Anil, K.G., Pourtois, Geoffrey, Demeurisse, Caroline, Schram, Tom, Brijs, Bert, de Potter, Muriel, Vrancken, Christa, Maex, Karen

    Published in Microelectronic engineering (01-12-2005)
    “…The Ni silicide phases and morphology in Ni fully silicided gates was investigated for varying deposited Ni to Si thickness ratios and rapid thermal processing…”
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    Journal Article Conference Proceeding
  8. 8
  9. 9

    Effect of SIIS on work function of self-aligned PtSi FUSI metal-gated capacitors by van Dal, M.J.H., Pourtois, G., Cunniffe, J., Veloso, A., Lauwers, A., Maex, K., Kittl, J.A.

    Published in IEEE transactions on electron devices (01-05-2006)
    “…A novel self-aligned fully silicided (FUSI) gate process for the integration of platinum monosilicide (PtSi) as a metal gate for pMOS applications is…”
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    Journal Article
  10. 10

    Germanium-based transistors for future high performance and low power logic applications by Yee-Chia Yeo, Xiao Gong, van Dal, Mark J. H., Vellianitis, Georgios, Passlack, Matthias

    “…High mobility channel materials could replace strained Si to enhance speed performance and/or reduce power consumption in future transistors. Ge has the…”
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    Conference Proceeding Journal Article
  11. 11
  12. 12

    Ni fully silicided gates for 45nm CMOS applications by Kittl, Jorge A., Lauwers, Anne, Pawlak, Malgorzata A., van Dal, Mark J.H., Veloso, Anabela, Anil, K.G., Pourtois, Geoffrey, Demeurisse, Caroline, Schram, Tom, Brijs, Bert, de Potter, Muriel, Vrancken, Christa, Maex, Karen

    Published in Microelectronic engineering (01-12-2005)
    “…The Ni silicide phases and morphology in Ni fully silicided gates was investigated for varying deposited Ni to Si thickness ratios and rapid thermal processing…”
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    Journal Article