Search Results - "Van Dal, Mark J.H."
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1
Germanium p-Channel FinFET Fabricated by Aspect Ratio Trapping
Published in IEEE transactions on electron devices (01-02-2014)“…We report scaled Ge p-channel FinFETs fabricated on a 300-mm Si wafer using the aspect-ratio-trapping technique. For long-channel devices, a combination of a…”
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2
Germanium n-Channel Planar FET and FinFET: Gate-Stack and Contact Optimization
Published in IEEE transactions on electron devices (01-11-2015)“…We demonstrate Ge enhancement-mode nMOS FinFETs fabricated on 300-mm Si wafers, incorporating an optimized gate-stack (interface trap density D it below 2 × 10…”
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3
High-Performance InAs Gate-All-Around Nanowire MOSFETs on 300 mm Si Substrates
Published in IEEE journal of the Electron Devices Society (01-09-2016)“…We report on the first realization of InAs n-channel gate-all-around nanowire MOSFETs on 300 mm Si substrates using a fully very large-scale integration…”
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4
Investigation of Strain Engineering in FinFETs Comprising Experimental Analysis and Numerical Simulations
Published in IEEE transactions on electron devices (01-06-2011)“…This study combines direct measurements of strain, electrical mobility measurements, and a rigorous modeling approach to provide insights about strain-induced…”
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5
Evaluation of Transmission Line Model Structures for Silicide-to-Silicon Specific Contact Resistance Extraction
Published in IEEE transactions on electron devices (01-05-2008)“…In order to measure silicide-to-silicon specific contact resistance rho c , transmission line model (TLM) structures were proposed as attractive candidates for…”
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6
Ni based silicides for 45 nm CMOS and beyond
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15-12-2004)“…Material issues that impact the applicability of Ni based silicides to CMOS flows were studied, including the excessive silicidation of narrow features, the…”
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Ni fully silicided gates for 45 nm CMOS applications
Published in Microelectronic engineering (01-12-2005)“…The Ni silicide phases and morphology in Ni fully silicided gates was investigated for varying deposited Ni to Si thickness ratios and rapid thermal processing…”
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Journal Article Conference Proceeding -
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Demonstration of short-channel self-aligned Pt2Si-FUSI pMOSFETs with low threshold voltage (-0.29 V) on SiON and HfSiON
Published in IEEE electron device letters (01-08-2006)Get full text
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9
Effect of SIIS on work function of self-aligned PtSi FUSI metal-gated capacitors
Published in IEEE transactions on electron devices (01-05-2006)“…A novel self-aligned fully silicided (FUSI) gate process for the integration of platinum monosilicide (PtSi) as a metal gate for pMOS applications is…”
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10
Germanium-based transistors for future high performance and low power logic applications
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01-12-2015)“…High mobility channel materials could replace strained Si to enhance speed performance and/or reduce power consumption in future transistors. Ge has the…”
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Conference Proceeding Journal Article -
11
Ni based silicides for 45nm CMOS and beyond
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01-12-2004)Get full text
Journal Article -
12
Ni fully silicided gates for 45nm CMOS applications
Published in Microelectronic engineering (01-12-2005)“…The Ni silicide phases and morphology in Ni fully silicided gates was investigated for varying deposited Ni to Si thickness ratios and rapid thermal processing…”
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Journal Article