Search Results - "Valek, B. C."

Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction by Wu, Albert T., Tu, K. N., Lloyd, J. R., Tamura, N., Valek, B. C., Kao, C. R.

“…Under constant current electromigration, white tin exhibited a resistance drop of up to 10%. It has a body-centered-tetragonal structure, and the resistivity…”
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Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect by Barabash, R.I, Ice, G.E, Tamura, N, Valek, B.C, Bravman, J.C, Spolenak, R, Patel, J.R

“…Electromigration-induced failure in metal interconnect constitutes a major reliability problem in the semiconductor industry. Recently, experimental techniques…”
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Silica thin films applied to Ni-20Cr alloy via combustion chemical vapor deposition by Valek, B.C., Hampikian, J.M.

“…Amorphous silica thin films (<0.5 μm) have been deposited onto Ni-20Cr via combustion chemical vapor deposition (CVD) using two different nozzle assemblies, an…”
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Electromigration-induced plastic deformation in passivated metal lines by Valek, B. C., Bravman, J. C., Tamura, N., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Spolenak, R., Brown, W. L., Batterman, B. W., Patel, J. R.

“…We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu)…”
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Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction by Budiman, A. S., Nix, W. D., Tamura, N., Valek, B. C., Gadre, K., Maiz, J., Spolenak, R., Patel, J. R.

“…Plastic deformation was observed in damascene Cu interconnect test structures during an in situ electromigration experiment and before the onset of visible…”
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