Search Results - "Uchibori, C J"

InxGa1-xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier by UCHIBORI, C. J, OHTANI, Y, OKU, T, ONO, N, MURAKAMI, M

“…Significant reduction of the contact resistance of In0.7Ga0.3As/Ni/W contacts (which were previously developed by sputtering in our laboratory) was achieved by…”
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InxGa1-xAs ohmic contacts to n-type GaAs prepared by sputter deposition by OKUNISHI, M, UCHIBORI, C. J, OKU, T, OTSUKI, A, ONO, N, MURAKAMI, M

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SEILA: Soft error immune latch for mitigating multi-node-SEU and local-clock-SET by Uemura, T, Tosaka, Y, Matsuyama, H, Shono, K, Uchibori, C J, Takahisa, K, Fukuda, M, Hatanaka, K

“…We have developed a robust latch for achieving high reliability in LSI. The latch can attenuate multi-node single-event-upset (MNSEU) and single event…”
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Direct Attach of Photonic Components on Substrates With Optical Interconnects by Glebov, A.L., Uchibori, C.J., Lee, M.G.

“…Direct attach of lasers and photodiodes on boards with optical interconnects can facilitate high-density packaging of high-speed optical components. For the…”
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Thermal stress analysis of FCBGA during cooling under reflow process by Uchibori, C J, Lee, M

“…Thermal stresses in Flip Chip Ball Grid Array (FCBGA) generated by the Chip Package Interaction (CPI) while cooling during the reflow process were calculated…”
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Formation mechanism of In sub(x)Ga sub(1-x)As ohmic contacts to n-type GaAs prepared by radio frequency sputtering by Uchibori, C J, Okunishi, M, Oku, T, Otsuki, A, Ono, N, Murakami, M

“…The formation mechanisms of InAs/Ni/W ohmic contacts to n-type GaAs prepared by radio-frequency (rf) sputtering were studied by measuring contact resistances…”
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Formation mechanism of InxGa1-x ohmic contacts to n-type GaAs prepared by radio frequency sputtering by UCHIBORI, C. J, OKUNISHI, M, OKU, T, OTSUKI, A, ONO, N, MURAKAMI, M

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InxGa1-xAs-based Ohmic contacts to n-type GaAs with W-nitride barrier prepared by radio frequency sputtering by UCHIBORI, C. J, OHTANI, Y, OKU, T, ONO, N, MURAKAMI, M

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Formation of WSi-based ohmic contacts to n-type GaAs by Oku, Takeo, Furumai, Masaki, Uchibori, Chihiro J., Murakami, Masanori

“…An outcome of the indirect doping concept conceived recently in NiGe-based Ohmic contacts has led to the development of annealed WSi-based Ohmic contacts to…”
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Formation mechanism of InxGa1−xAs ohmic contacts to n-type GaAs prepared by radio frequency sputtering by Uchibori, Chihiro J., Okunishi, Masayuki, Oku, T., Otsuki, A., Ono, Naoki, Murakami, Masanori

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In situ x-ray photoelectron spectroscopy measurement during Ta deposition on low- k dielectric SiLK by Uchibori, Chihiro. J., Kimura, Takahiro

“…The bonding energy of Ta and C was measured by in situ x-ray photoelectron spectroscopy during sequential tantalum (Ta) deposition on low- k SiLK™. A tantalum…”
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