Search Results - "U. YURUKER, Sevket"

Highly Compressible, Anisotropic Aerogel with Aligned Cellulose Nanofibers by Song, Jianwei, Chen, Chaoji, Yang, Zhi, Kuang, Yudi, Li, Tian, Li, Yiju, Huang, Hao, Kierzewski, Iain, Liu, Boyang, He, Shuaiming, Gao, Tingting, Yuruker, Sevket U, Gong, Amy, Yang, Bao, Hu, Liangbing

“…Aerogels can be used in a broad range of applications such as bioscaffolds, energy storage devices, sensors, pollutant treatment, and thermal insulating…”
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System-level Pareto frontiers for on-chip thermoelectric coolers by U. YURUKER, Sevket, C. FISH, Michael, YANG, Zhi, BALDASARO, Nicholas, BARLETTA, Philip, BAR-COHEN, Avram, YANG, Bao

“…The continuous rise in heat dissipation of integrated circuits necessitates advanced thermal solutions to ensure system reliability and efficiency…”
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A Vertically Enhanced Manifold Microchannel System for Thermal Management of Power Electronics by Yuruker, Sevket U., Mandel, Raphael K., McCluskey, Patrick, Ohadi, Michael

“…In a more electrified future, development of high power, compact, and synergistically cooled power electronics for improved performance and reliability is of…”
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An Experimental and Computational Study on Efficiency of White LED Packages With a Thermocaloric Approach by Yuruker, Sevket U., Tamdogan, Enes, Arik, Mehmet

“…Thermal management of light-emitting diode (LED) chips is crucial for light extraction and lifetime. It is well known that the light output of an LED decreases…”
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System-Level Thermal Modeling and Its Significance in Electronics Packaging by Yuruker, Sevket U., Mandel, Raphael K., McCluskey, Patrick, Ohadi, Michael

“…Thermal management of electronics has been a major limiting factor in achieving high-power, high-performance systems. Isolating various heat dissipating…”
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A Metamodeling Approach for Optimization of Manifold Microchannel Systems for High Heat Flux Cooling Applications by Yuruker, Sevket U., Mandel, Raphael K., Shooshtari, Amir, Ohadi, Michael M.

“…As today's electronics already face critical thermal challenges, it is almost certain that future electronic systems will require improved thermal management…”
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Packaging and Thermal Decoupling of an Optical Array using a Thermoelectric Cooler by Yuruker, Sevket U., Mandel, Raphael K., Bae, Daniel G., Gektin, Vadim, Ohadi, Michael M.

“…Today's compact electronic packages consist of chips with different restrictions on their operating temperatures. To ensure reliability in such devices, each…”
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Integration of micro-contact enhanced thermoelectric cooler with a FEEDS manifold-microchannel system for cooling of high flux electronics by Yuruker, Sevket U., Bae, Daniel G., Mandel, Raphael K., Bao Yang, McCluskey, Patrick, Bar-Cohen, Avram, Ohadi, Michael M.

“…Two-phase microchannel cooling has demonstrated substantial performance enhancement for thermal management of high-power electronics, offering remarkable heat…”
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