Structure and properties of sputter deposited crystalline and amorphous Cu–Ti films

Structure and properties of sputter deposited crystalline and amorphous Cu–Ti films

Thin film metallic glasses (TFMG) can possess a variety of advantages against crystalline thin metal films. High strength and toughness as well as specific corrosion resistivity are features, which can be widely used in MEMS (micro-electromechanical systems), lab-on-a-chip or surface acoustic wave (...

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Bibliographic Details
Published in:Thin solid films Vol. 598; pp. 184 - 188
Main Authors: Turnow, H., Wendrock, H., Menzel, S., Gemming, T., Eckert, J.
Format: Journal Article
Language:English
Published: Elsevier B.V 01-01-2016
Subjects:
Amorphous
Amorphous materials
AMORPHOUS STRUCTURE
Binary systems
Copper
Copper base alloys
COPPER TITANIUM ALLOYS
CORROSION
CRYSTAL STRUCTURE
Cu–Ti
DEPOSITION
Devices
ELECTRICAL CONDUCTIVITY
Electrical resistivity
ELECTRONIC PRODUCTS
Intrinsic stress
SPUTTERING
Surface acoustic waves
Thin film
THIN FILMS
Amorphous
Cu–Ti
Intrinsic stress
Sputtering
Thin film
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Summary:Thin film metallic glasses (TFMG) can possess a variety of advantages against crystalline thin metal films. High strength and toughness as well as specific corrosion resistivity are features, which can be widely used in MEMS (micro-electromechanical systems), lab-on-a-chip or surface acoustic wave (SAW) device applications. Amongst others, the Cu–Ti binary alloy system is known for having a moderate glass forming ability (GFA) in mid-composition range. In the present study a systematic characterization of sputter deposited Cu–Ti thin films in dependence on the chemical composition is carried out. Intrinsic stress, Young's modulus, surface roughness and electrical resistivity are discussed with respect to the present phases and microstructure. Especially the films within the amorphous range from 25 to 75at.% Cu exhibit favorable mechanical properties. •Cu–Ti thin films of the whole composition range were made by magnetron-co-sputtering.•The films containing 25–75at.% Cu appear amorphous and have a monolithic microstructure.•Residual film stresses, Young's moduli and resistivities show strong dependences on composition.•Combination of advanced film properties offers a broad spectrum of applications.
Bibliography:ObjectType-Article-1
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ISSN:0040-6090
1879-2731
DOI:10.1016/j.tsf.2015.10.081