Search Results - "Tu, C.T."

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu by Wang, Y.W., Lin, Y.W., Tu, C.T., Kao, C.R.

“…The reactions between Cu and the Sn2.5Ag0.8Cu solders doped with 0.03 wt.% Fe, Co, or Ni were studied. Reaction conditions included multiple reflows for up to…”
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Application of Phyllanthus emblica extract in manufacturing pharmaceutical composition for repairing liver damage by Lai, Y.C., Kuo, C.Y., Yang, S.C., Tu, C.T., Cheng, H.C.

“…The objective of this study was to prepare a medicinal formulation with the extract of Phyllanthus emblica to repair liver damage. The hepatocyte cell line…”
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[P2.14]: ADP‐ribosylation‐like factor‐6 interacting protein is required for neural crest development in zebrafish embryos by Yang, T.C., Tu, C.T., Tsai, H.J.

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Epoxy flux technology - Tacky flux with value added benefits by Chan, B., Qing Ji, Currie, M., Poole, N., Tu, C.T.

“…Since their inception over 30 years ago, underfills have enabled numerous new packages and have provided the required support and reliability needed for highly…”
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Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows by Toh, C.H., Hao Liu, Tu, C.T., Chen, T.D., Yeo, J.

“…Solder-joint performances for SAC405, SAC105 with 200ppm Ni and SAC105 with 500ppm Ni were reviewed for electrolytic Ni-Au BGA pad finish. For each alloy…”
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