Search Results - "Tsvetanova, Diana"
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All-Electrical Control of Scaled Spin Logic Devices Based on Domain Wall Motion
Published in IEEE transactions on electron devices (01-04-2021)“…Spin logic devices based on domain wall (DW) motion offer flexible architectures to store and carry logic information in a circuit. In this device concept,…”
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Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers
Published in Japanese Journal of Applied Physics (01-05-2021)“…Abstract We present the development of Nb/Al–AlO x /Nb trilayer stacks and the implementation of a full 300 mm process flow for the fabrication of…”
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Experimental Observation of Back-Hopping With Reference Layer Flipping by High-Voltage Pulse in Perpendicular Magnetic Tunnel Junctions
Published in IEEE transactions on magnetics (01-07-2016)“…Low write error rate (WER) is an important requirement for spin-transfer torque magnetic random access memory to be developed as a product. However, there have…”
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Influence of the Reference Layer Composition on the Back-End-of-Line Compatibility of Co/Ni-Based Perpendicular Magnetic Tunnel Junction Stacks
Published in IEEE transactions on magnetics (01-07-2016)“…Spin-transfer torque magnetic random access memory (STT-MRAM) is currently explored to challenge the dynamic random access memory and embedded memory…”
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Novel concepts for improved communication between nerve cells and silicon electronic devices
Published in Solid-state electronics (01-04-2008)“…Hybrid integration of living cells and electronic circuits on a chip requires a high-density matrix of sensors and actuators. This matrix must be processable…”
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Evaluation of Post Ion-Implantation Resist Strip with the Background Signal of a Light Scattering Tool
Published in Japanese Journal of Applied Physics (01-05-2010)“…A new method for the fast evaluation of photoresist residue removal efficiency is discussed in this paper. In this method "haze" which is the low frequency…”
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Dummy design characterization for STI CMP with fixed abrasive
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01-11-2014)“…The Shallow Trench Isolation (STI) Chemical Mechanical Polishing (CMP) process has an essential role in the STI module for the fabrication of the Complementary…”
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