Search Results - "Tsuruta, Kazuhiro"

High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates by Chen, Chuantong, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…Ag sinter joining technology has been used in the advanced power applications to replace conventional soldering technology due to its high temperature…”
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Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Sugahara, Tohru, Zhang, Hao, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The application of microporous sintered silver (Ag) as a bonding material to replace conventional die-bonding materials in power electronic devices has…”
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Self-healing of cracks in Ag joining layer for die-attachment in power devices by Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…Sintered silver (Ag) joining has attracted significant interest in power devices modules for its ability to form stable joints with a porous interconnection…”
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Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design by Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

“…The mechanical properties of sintered Ag paste with microporous structure have been investigated by tensile and shear tests, focusing on the…”
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Thermal stability improvement of sintered Ag die-attach materials by addition of transition metal compound particles by Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

“…Sintered silver (Ag) die-attach has attracted much attention in assembling power modules for high power density and high temperature operation. We have…”
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CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…One of the applications of wide band gap semiconductors is high temperature operation. That application requires high temperature compatible (i) joining…”
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Preparation of Molecule-Responsive Microsized Hydrogels via Photopolymerization for Smart Microchannel Microvalves by Shiraki, Yusuke, Tsuruta, Kazuhiro, Morimoto, Junpei, Ohba, Chihiro, Kawamura, Akifumi, Yoshida, Ryo, Kawano, Ryuji, Uragami, Tadashi, Miyata, Takashi

“…Microdevices designed for practical environmental pollution monitoring need to detect specific pollutants such as dioxins. Bisphenol A (BPA) has been widely…”
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Control Model for Large‐Sized Gantry Type Linear Motor Slider by OJIRO, TETSUYA, HONDA, HIDEKI, TSURUTA, KAZUHIRO, HANAMOTO, TSUYOSHI

“…SUMMARY At present, many industrial carrier devices utilize linear motor sliders. However, a heavier load requires a linear motor (which is an example of a…”
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High precision control model of large-sized gantry-type linear motor slider by Ojiro, Tetsuya, Tachibana, Toshiyuki, Honda, Hideki, Watanabe, So, Hamamatsu, Hiroshi, Tsuruta, Kazuhiro

“…Large-sized gantry-type linear motor sliders are widely used in industry (e.g. in liquid crystal panel production equipment). An appropriate control model is…”
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Consideration of Multi-Degree of Freedom Vibration on Large-Sized Gantry Type Linear Motor Slider by Ojiro, Tetsuya, Tachibana, Toshiyuki, Honda, Hideki, Hamamatsu, Hiroshi, Tsuruta, Kazuhiro, Hanamoto, Tsuyoshi

“…Many transport units for large production devices now incorporate large-sized gantry type linear motor sliders comprising two parallel linear sliders linked by…”
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High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics by Sungwon Park, Nagao, Shijo, Kato, Yoshitaka, Ishino, Hiroshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…Pure Zn is a Pb-free die-attach material considered suitable for application in high-temperature electronics such as widebandgap semiconductor devices, as it…”
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Prominent interface structure and bonding material of power module for high temperature operation by Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chuantong Chen, Nagao, Shijo, Hao Zhang, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori

“…Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of…”
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High-speed and high-precision position control using a sliding mode compensator by Tsuruta, Kazuhiro, Sato, Kazuya, Ushimi, Nobuhiro, Fujimoto, Takashi

“…To achieve high‐speed, high‐precision position control for semiconductor product machines and industrial robots, full‐closed feedback control is applied. Many…”
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Identification of the Mechanical Parameters for Servo Drive by Tae-Suk Kwon, Seung-Ki Sul, Nakamura, H., Tsuruta, K.

“…This paper describes a novel identification technique of the moment of inertia and the viscous friction coefficient for a servo drive system. It is developed…”
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29.5- \hbox^ Recording Areal Density on Barium Ferrite Tape by Cherubini, Giovanni, Pantazi, Angeliki, Rothuizen, Hugo E., Berman, David, Imaino, Wayne, Jubert, Pierre-Olivier, McClelland, Gary, Koeppe, Peter V., Tsuruta, Kazuhiro, Harasawa, Takeshi, Murata, Yuto, Cideciyan, Roy D., Musha, Atsushi, Noguchi, Hitoshi, Ohtsu, Hiroki, Shimizu, Osamu, Suzuki, Ryota, Dellmann, Laurent, Eleftheriou, Evangelos, Haeberle, Walter, Jelitto, Jens, Kartik, Venkataraman, Lantz, Mark A., Olcer, Sedat

“…The recording performance of a new magnetic tape based on ultra-fine, perpendicularly-oriented BaFe particles was investigated. Specifically, using a low…”
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Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique by Zhang, Zheng, Chen, Chuantong, Suetake, Aiji, Ishino, Hiroshi, Sampei, Hirokazu, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

“…In this work, an acoustic emission (AE) technique was applied to online condition monitoring (CM) of solder fatigue in a clip-bonding SiC mosfet power assembly…”
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Reliability Evaluation of SiC Power Module With Sintered Ag Die Attach and Stress-Relaxation Structure by Sugiura, Kazuhiko, Iwashige, Tomohito, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Funaki, Tsuyoshi, Suganuma, Katsuaki

“…Silicon carbide (SiC) power modules with Ag sinter-bonding die attach were designed on the basis of thermal stress analysis for reliable high-temperature…”
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Consideration on control method of the large-sized gantry-type linear motor slider by Ojiro, Tetsuya, Honda, Hideki, Hanamoto, Tsuyoshi, Tsuruta, Kazuhiro

“…A large-sized gantry-type linear motor slider has a unique problem, that being mechanical distortion, creating a repulsive force between each axis that may…”
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High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
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A Study for Palladium-catalyzed Chemoselective Vinylation at C-3 Position of 4-Bromo-1-tosylindole by Yokoyama, Yuusaku, Tsuruta, Kazuhiro, Murakami, Yasuoki

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