Search Results - "Tseng, Hsing Huang"
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Highly Manufacturable Double-Gate FinFET With Gate-Source/Drain Underlap
Published in IEEE transactions on electron devices (01-06-2007)“…The speed performance of a double-gate (DG) FinFET CMOS with gate-source/drain (G-S/D) underlap is investigated using 2-D device and mixed-mode circuit…”
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Defect Passivation With Fluorine and Interface Engineering for Hf-Based High- k/Metal Gate Stack Device Reliability and Performance Enhancement
Published in IEEE transactions on electron devices (01-12-2007)“…Using a fluorinated high-fc/metal gate stack combined with a stress relieved preoxide (SRPO) pretreatment before high-fc deposition, we show significant device…”
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Si tunnel transistors with a novel silicided source and 46mV/dec swing
Published in 2010 Symposium on VLSI Technology (01-06-2010)“…We report a novel tunneling field effect transistor (TFET) fabricated with a high-k/metal gate stack and using nickel silicide to create a special…”
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Conference Proceeding -
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Mechanisms Limiting EOT Scaling and Gate Leakage Currents of High- k/Metal Gate Stacks Directly on SiGe
Published in IEEE electron device letters (01-03-2009)“…This letter addresses mechanisms responsible for a high gate leakage current ( Jg ) and a thick interfacial layer in the surface channel SiGe pFET enabling…”
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Origin of the Flatband-Voltage Roll-Off Phenomenon in Metal/High- k Gate Stacks
Published in IEEE transactions on electron devices (01-09-2010)“…The effect of flatband-voltage reduction [roll-off (R-O)], which limits fabrication options for obtaining the needed band-edge threshold voltage values in…”
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Improved Electrical Characteristics of Ge-on-Si Field-Effect Transistors With Controlled Ge Epitaxial Layer Thickness on Si Substrates
Published in IEEE electron device letters (01-11-2007)“…The authors report on the novel MOSFETs that were fabricated on thin relaxed Ge epitaxial layers grown on Si substrates. With controlled epi-Ge thickness,…”
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Fermi-level pinning at the polysilicon/metal-oxide interface-Part II
Published in IEEE transactions on electron devices (01-06-2004)“…We report here that Fermi pinning at the polysilicon/metal-oxide interface causes high threshold voltages in MOSFET devices. In Part I, we investigated the…”
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Impact of Millisecond Flash-Assisted Rapid Thermal Annealing on SiGe Heterostructure Channel pMOSFETs With a High-k/Metal Gate
Published in IEEE transactions on electron devices (01-09-2011)“…Preserving the integrity (e.g., Ge concentration, strain, and lattice perfection) of pseudomorphically grown silicon germanium (SiGe) heterostructure channels…”
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A Study of Strain Engineering Using CESL Stressor on Reliability Comparing Effect of Intrinsic Mechanical Stress
Published in IEEE electron device letters (01-07-2009)“…The effects of a stressor nitride layer on device performance and reliability are investigated. To decouple intrinsic mechanical stress and process-related…”
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Effective Modulation of Ni Silicide Schottky Barrier Height Using Chlorine Ion Implantation and Segregation
Published in IEEE electron device letters (01-11-2009)“…Using a presilicide implantation approach, we demonstrate that the Schottky barrier height (SBH) of NiSi/n-Si(100) can be modulated by doping a Si substrate…”
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The Effect of a Si Capping Layer on RF Characteristics of High- k /Metal Gate SiGe Channel pMOSFETs
Published in IEEE electron device letters (01-10-2010)“…We present a comparative study of the effects of a Si capping layer on SiGe channel pMOSFETs used for radio-frequency (RF) applications. In Si-capped devices,…”
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Characteristics of Gate Current Random Telegraph Signal Noise in SiON/HfO2/TaN p-Type Metal--Oxide--Semiconductor Field-Effect Transistors under Negative Bias Temperature Instability Stress Condition
Published in Jpn J Appl Phys (01-04-2010)“…Gate dielectric traps are becoming a major concern in the high-$k$/metal gate devices. In this paper, new experimental results and in-depth study on gate…”
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Spectroscopic analysis of the process-dependent microstructure of ultra-thin high-k gate dielectric film systems
Published in Surface and interface analysis (01-12-2006)“…HfO2 gate dielectric thin films have been exposed to anneal processing in NH3 and N2 ambient in order to decouple the influence of N incorporation from that of…”
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Journal Article Conference Proceeding -
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Gate stack technology for nanoscale devices
Published in Materials today (Kidlington, England) (01-06-2006)“…Scaling of the gate stack has been a key to enhancing the performance of complementary metal-oxide-semiconductor (CMOS) field-effect transistors (FETs) of past…”
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Effect of Si interlayer thickness and post-metallization annealing on Ge MOS capacitor on Ge-on-Si substrate
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05-12-2008)“…We demonstrated the effect of post-metallization annealing and Si interlayer thickness on Ge MOS capacitor on Ge-on-Si substrate with HfO 2/TaN. Ge…”
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Fermi-level pinning at the polysilicon/metal oxide interface-Part I
Published in IEEE transactions on electron devices (01-06-2004)“…We report here that Fermi pinning at the polysilicon/metal oxide interface causes high threshold voltages in MOSFET devices. Results indicate that pinning…”
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Effect of substrate hot carrier stress on high-k gate stack
Published in 2008 IEEE International Integrated Reliability Workshop Final Report (01-10-2008)“…The origin of stress induced leakage current and defect generation process in the high-k/metal gate stacks under the substrate hot carrier stress and constant…”
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Conference Proceeding -
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Dual work function high-k/Metal Gate CMOS FinFETs
Published in ESSDERC 2007 - 37th European Solid State Device Research Conference (01-09-2007)“…For the first time, a set of complementary metal oxide semiconductor (CMOS) FinFET devices with two different high-k/metal gate stacks of dual work function…”
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Conference Proceeding