Search Results - "Tseng, A.A"

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  1. 1

    Effects of oxide layer on Leidenfrost temperature during spray cooling of steel at high temperatures by Chabičovský, M., Hnízdil, M., Tseng, A.A., Raudenský, M.

    “…•The oxide layer significantly influences the Leidenfrost temperature.•The Leidenfrost temperature increases with an increasing oxide layer thickness.•The…”
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    Journal Article
  2. 2

    Electron beam lithography in nanoscale fabrication: recent development by Tseng, A.A., Kuan Chen, Chen, C.D., Ma, K.J.

    “…Miniaturization is the central theme in modern fabrication technology. Many of the components used in modern products are getting smaller and smaller. In this…”
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    Journal Article
  3. 3

    Low stress packaging of a micromachined accelerometer by Li, G., Tseng, A.A.

    “…A packaging study of an acceleration microelectromechanical systems (MEMS) sensor is presented. The sensor consists of two silicon chips: a surface…”
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    Journal Article
  4. 4

    Influence of Si-nanocrystal distribution in the oxide on the charging behavior of MOS structures by Liu, Y., Chen, T.P., Ng, C.Y., Ding, L., Tse, M.S., Fung, S., Tseng, A.A.

    Published in IEEE transactions on electron devices (01-04-2006)
    “…In this brief, the electrical characteristics of MOS structures with specially designed distributions of Si nanocrystals (nc-Si) embedded in the oxides were…”
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    Journal Article
  5. 5

    Recent Developments in Nanofabrication Using Focused Ion Beams by Tseng, Ampere A.

    “…Focused ion beam (FIB) technology has become increasingly popular in the fabrication of nanoscale structures. In this paper, the recent developments of the FIB…”
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    Journal Article
  6. 6

    Mechanical Strength and Interface Characteristics of Transmission Laser Bonding by Tseng, A.A., Jong-Seung Park

    “…A laser-based bonding technique, called transmission laser bonding (TLB), is studied for the purposes of device and wafer-level packaging. The TLB technique…”
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    Journal Article
  7. 7

    Recent Developments in Nanofabrication Using Ion Projection Lithography by Tseng, Ampere A.

    “…Ion projection lithography (IPL) is an emerging technology and a major candidate for the next‐generation lithography (NGL) designed to complement and…”
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    Relationship Between Current Transport and Electroluminescence in \hbox^-Implanted \hbox Thin Films by Liang Ding, Chen, T.P., Ming Yang, Jen It Wong, Zhanhong Cen, Yang Liu, Furong Zhu, Tseng, A.A.

    Published in IEEE transactions on electron devices (01-11-2009)
    “…Relationship between current transport and electroluminescence (EL) in the system of excess Si distributed in SiO 2 thin films synthesized with low-energy ion…”
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    Journal Article
  10. 10

    Si ion-induced instability in flatband Voltage of Si/sup +/-implanted gate oxides by Ng, C.Y., Chen, T.P., Ding, L., Chen, Q., Liu, Y., Zhao, P., Tseng, A.A., Fung, S.

    Published in IEEE transactions on electron devices (01-05-2006)
    “…Effect of the trapped Si ions in a 30-nm gate oxide implanted with Si/sup +/ at a very low energy (1.3 keV) on the flatband voltage after various thermal…”
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    Journal Article
  11. 11

    Micro-mechanical characterizations of solder mask materials by Hau Zhu, Yifan Guo, Wen-Ying Li, Tseng, A.A., Martin, B.

    “…The mechanical properties of solder masks are critical in the reliability performance of flip-chip packages. Many recent studies show that the mechanical…”
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    Conference Proceeding
  12. 12

    Influence of excess Si distribution in the gate oxide on the memory characteristics of MOSFETs by Wong, J.I., Chen, T.P., Yang, M., Liu, Y., Ng, C.Y., Ding, L., Chong, C.F., Tseng, A.A.

    “…In this work, Si ions are implanted into the gate oxide of MOSFETs with different implantation schemes, followed by a high-temperature annealing. The memory…”
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    Journal Article
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    Advanced deposition techniques for freeform fabrication of metal and ceramic parts by Tseng, A.A., Tanaka, M.

    Published in Rapid prototyping journal (01-03-2001)
    “…Two newly invented deposition techniques for the freeform fabrication of metal and ceramic parts are presented. The first deposition technique studied is one…”
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    Journal Article
  15. 15

    Projection ablation of glass-based single and arrayed microstructures using excimer laser by Chen, Ying-Tung, Ma, Kung-Jeng, Tseng, Ampere A., Chen, P.H.

    Published in Optics and laser technology (01-06-2005)
    “…Ablation of single and arrayed microstructures using an excimer laser is studied. The single feature microstructures are fabricated for evaluating the ablation…”
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    Journal Article
  16. 16

    Deformation behavior of steels in mushy state by Tseng, A.A, Horský, J, Raudenský, M, Kotrbácek, P

    Published in Materials in engineering (01-04-2001)
    “…Processing metals in a semisolid or mushy state has emerged as a vital commercial process to produce metal and metal-matrix composite components. The…”
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    Journal Article
  17. 17

    Knowledge-based mold design for injection molding processing by Tseng, A.A., Kaplan, J.D., Arinze, O.B., Zhao, T.J.

    “…The current status of the knowledge-based system which is the most promising and desirable enhancement to computer-aided-design technology is reviewed. An…”
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    Conference Proceeding
  18. 18

    Assembling uniform oxide lines and layers by overlapping dots and lines using AFM local oxidation by Notargiacomo, A., Tseng, A.A.

    “…Atomic force microscopy lithography has been widely used for creating oxide patterns at the nanoscale on a number of different material surfaces. In this work…”
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    Conference Proceeding
  19. 19

    THERMAL MODELING OF ROLL AND STRIP INTERFACE IN ROLLING PROCESSES: PART 1-REVIEW by Tseng, Ampere A.

    “…In rolling, the roll is used as a tool to deform the strip, resulting in rolling contact between the roll and strip and creating thermal resistance along the…”
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    Journal Article
  20. 20

    Rotating laserbased system for full profile measurement by Tseng, A.A., Tanaka, M., Leeladharan, B., Choi, Jong G.

    Published in Construction innovation (01-06-2003)
    “…A laserbased system has been developed to automatically measure complete inner profiles of various structures. The system uses a pointed laser source passing…”
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    Journal Article