Search Results - "Tremmel, Florian"

Mechanical Robustness Analysis of Semiconductors with a Single Needle Probe Card Using Acoustic Emissions by Tremmel, Florian, Nagler, Oliver, Kutter, Christoph, Holmer, Rainer

“…The combination of indentation testing and acoustic emission (AE) is widely used to analyze the fracture toughness of test substrates. In the manufacturing of…”
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Cluster-based acoustic emission signal processing and loading rate effects study of nanoindentation on thin film stack structures by Liu, Chen, Nagler, Oliver, Tremmel, Florian, Unterreitmeier, Marianne, Frick, Jessica J., Patil, Radhika P., Gu, X. Wendy, Senesky, Debbie G.

“…•Prediction of degradation of multilayer thin film stack structures on Si wafer via acoustic emission (AE) testing integrated with a nanoindentation…”
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Nanoindentation characterization of thin film stack structures by finite element analysis and experiments using acoustic emission testing by Liu, Chen, Nagler, Oliver, Tremmel, Florian, Unterreitmeier, Marianne, Frick, Jessica J., Gu, X. Wendy, Senesky, Debbie G.

“…Increased risk of crack formation in the brittle insulating layers of crack-sensitive backend-of-line (BEOL) structures in semiconductor integrated circuits…”
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