Search Results - "Torzewicz, T"
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1
Automated stand for thermal characterization of electronic packages
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01-03-2011)“…This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard…”
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Conference Proceeding -
2
Accuracy and boundary condition independence of Cauer RC ladder compact thermal models
Published in Microelectronics (01-07-2013)“…This paper presents an experimental study aimed at the investigation of the influence of variable boundary conditions on the element values of compact thermal…”
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Journal Article -
3
Behavioral Approach to SiC MPS Diode Electrothermal Model Generation
Published in IEEE transactions on electron devices (01-02-2013)“…A comprehensive approach to generation of electrothermal models of silicon carbide (SiC) power Schottky diodes is presented. Both the electrical and thermal…”
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Journal Article -
4
Parametric Compact Thermal Modeling of Power LEDs
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01-05-2019)“…Light-emitting diodes are nowadays the most dynamically developing type of light sources. Considering that temperature is the main factor affecting electrical…”
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Conference Proceeding -
5
Influence of boundary conditions on thermal RC ladder model element values
Published in 29th IEEE Semiconductor Thermal Measurement and Management Symposium (01-03-2013)“…This paper presents an experimental study aimed at the investigation of the influence of boundary conditions on the element values of compact thermal models…”
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Conference Proceeding -
6
Advanced Stand for Transient Thermal Measurements
Published in 2017 IEEE 30th International Conference on Microelectronics (MIEL) (01-10-2017)“…This paper presents in detail the design and the practical realization of a dedicated stand for the transient thermal measurement of electronic devices. The…”
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Conference Proceeding -
7
Compact thermal modelling of power LED light sources
Published in 2017 IEEE 30th International Conference on Microelectronics (MIEL) (01-10-2017)“…This paper discuses on the practical example the problem of thermal modelling of power LEDs used in luminaries. The proper determination of the thermal…”
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Conference Proceeding -
8
Dual cold plate system with active temperature and heat flux control
Published in 18th International Workshop on THERMal INvestigation of ICs and Systems (01-09-2012)“…This paper presents in detail a practical realization of the measurement system allowing active control of cooling conditions during thermal characterization…”
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Conference Proceeding -
9
Active control of circuit cooling conditions for transient thermal measurement purposes
Published in 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01-09-2011)“…This paper presents a practical realization of the circuit for the active control of cooling conditions for transient thermal measurements of a tested device…”
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Conference Proceeding