Search Results - "Tong, William M"

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    Circuit Fabrication at 17 nm Half-Pitch by Nanoimprint Lithography by Jung, Gun-Young, Johnston-Halperin, Ezekiel, Wu, Wei, Yu, Zhaoning, Wang, Shih-Yuan, Tong, William M, Li, Zhiyong, Green, Jonathan E, Sheriff, Bonnie A, Boukai, Akram, Bunimovich, Yuri, Heath, James R, Williams, R. Stanley

    Published in Nano letters (01-03-2006)
    “…High density metal cross bars at 17 nm half-pitch were fabricated by nanoimprint lithography. Utilizing the superlattice nanowire pattern transfer technique, a…”
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    Journal Article
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    Plasma-Induced Formation of Ag Nanodots for Ultra-High-Enhancement Surface-Enhanced Raman Scattering Substrates by Li, Zhiyong, Tong, William M, Stickle, William F, Neiman, David L, Williams, R. Stanley, Hunter, Luke L, Talin, A. Alec, Li, D, Brueck, S. R. J

    Published in Langmuir (24-04-2007)
    “…We report here plasma-induced formation of Ag nanostructures for surface-enhanced Raman scattering (SERS) applications. An array of uniform Ag patterned…”
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    Journal Article
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    Improved Pattern Transfer in Nanoimprint Lithography at 30 nm Half-Pitch by Substrate−Surface Functionalization by Jung, Gun-Young, Li, Zhiyong, Wu, Wei, Ganapathiappan, S, Li, Xuema, Olynick, Deirdre L, Wang, S. Y, Tong, William M, Williams, R. Stanley

    Published in Langmuir (05-07-2005)
    “…Resist detachment from the substrate during mold−substrate separation is one of the key challenges for nanoimprint lithography as the pitch of features…”
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    Journal Article
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    Vapor-Phase Self-Assembled Monolayer for Improved Mold Release in Nanoimprint Lithography by Jung, Gun-Young, Li, Zhiyong, Wu, Wei, Chen, Yong, Olynick, Deirdre L, Wang, Shih-Yuan, Tong, William M, Williams, R. Stanley

    Published in Langmuir (15-02-2005)
    “…Resist adhesion to the mold is one of the challenges for nanoimprint lithography. The main approach to overcoming it is to apply a self-assembled monolayer of…”
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    Journal Article
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    Memristor−CMOS Hybrid Integrated Circuits for Reconfigurable Logic by Xia, Qiangfei, Robinett, Warren, Cumbie, Michael W, Banerjee, Neel, Cardinali, Thomas J, Yang, J. Joshua, Wu, Wei, Li, Xuema, Tong, William M, Strukov, Dmitri B, Snider, Gregory S, Medeiros-Ribeiro, Gilberto, Williams, R. Stanley

    Published in Nano letters (14-10-2009)
    “…Hybrid reconfigurable logic circuits were fabricated by integrating memristor-based crossbars onto a foundry-built CMOS (complementary…”
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    Journal Article
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    Sub-10 nm Nanoimprint Lithography by Wafer Bowing by Wu, Wei, Tong, William M, Bartman, Jonathan, Chen, Yufeng, Walmsley, Robert, Yu, Zhaoning, Xia, Qiangfei, Park, Inkyu, Picciotto, Carl, Gao, Jun, Wang, Shih-Yuan, Morecroft, Deborah, Yang, Joel, Berggren, Karl K, Williams, R. Stanley

    Published in Nano letters (01-11-2008)
    “…We introduce the concept of wafer bowing to affect nanoimprinting. This approach allows a design that can fit the key imprinting mechanism into a compact…”
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    Journal Article
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    Fabrication of a 34 × 34 Crossbar Structure at 50 nm Half-pitch by UV-based Nanoimprint Lithography by Jung, G. Y, Ganapathiappan, S, Ohlberg, Douglas A. A, Olynick, Deirdre L, Chen, Y, Tong, William M, Williams, R. Stanley

    Published in Nano letters (14-07-2004)
    “…We have developed a single-layer UV-nanoimprint process, which was utilized to fabricate 34 × 34 crossbar circuits with a half-pitch of 50 nm (equivalent to a…”
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    Journal Article
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    Radiation Hardness of Memristive Junctions by Tong, William M, Yang, J Joshua, Kuekes, Philip J, Stewart, Duncan R, Williams, R Stanley, DeIonno, Erica, King, Everett E, Witczak, Steven C, Looper, Mark D, Osborn, Jon V

    Published in IEEE transactions on nuclear science (01-06-2010)
    “…Semiconducting TiO 2 displays non-volatile multi-state, hysteretic behavior in its I-V characteristics that can be exploited as a memory material in a…”
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    Journal Article
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    Nanoclusters of MoO3−x embedded in an Al2O3 matrix engineered for customizable mesoscale resistivity and high dielectric strength by Tong, William M., Brodie, Alan D., Mane, Anil U., Sun, Fuge, Kidwingira, Françoise, McCord, Mark A., Bevis, Christopher F., Elam, Jeffrey W.

    Published in Applied physics letters (24-06-2013)
    “…We have synthesized a material consisting of conducting metal oxide (MoO3−x) nanoclusters embedded in a high-dielectric-strength insulator (Al2O3) matrix. The…”
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    Journal Article
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    Atomic force microscope studies of fullerene films - Highly stable C60 fcc (311) free surfaces by Snyder, Eric J., Tong, William M., Williams, R. S., Anz, Samir J., Anderson, Mark S.

    “…Atomic force microscopy and X-ray diffractometry were used to study 1500 A-thick films of pure C60 grown by sublimation in ultrahigh vacuum onto a CaF2 (111)…”
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    Journal Article
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    Radiation effects studies on thin film TiO2 memristor devices by DeIonno, Erica, Looper, Mark D., Osborn, Jon V., Barnaby, Hugh J., Tong, William M.

    Published in 2013 IEEE Aerospace Conference (01-03-2013)
    “…Memristor devices have been identified as potential replacements for a variety of memory applications and may also be suitable for space applications. In this…”
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    Conference Proceeding
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    Radiation Hardness of rm TiO 2 Memristive Junctions by Tong, William M, Yang, JJoshua, Kuekes, Philip J, Stewart, Duncan R, Williams, RStanley, DeIonno, Erica, King, Everett E, Witczak, Steven C, Looper, Mark D, Osborn, Jon V

    Published in IEEE transactions on nuclear science (01-06-2010)
    “…Semiconducting rm TiO 2 displays non-volatile multi-state, hysteretic behavior in its I hbox - - V characteristics that can be exploited as a memory material…”
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    Journal Article
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    58.3: Fabrication of Zinc Tin Oxide TFTs by Self-Aligned Imprint Lithography (SAIL) on Flexible Substrates by Jackson, Warren, Taussig, Carl, Elder, Rich, Tong, William M., Hoffman, Randy, Emery, Tim, Smith, Dan, Koch, Tim

    “…Zinc tin oxide (ZTO) thin‐film transistors (TFTs) provide attractive performance and are suitable for low‐temperature processes compatible with flexible…”
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    Journal Article
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