Search Results - "Tobback, Bert"

Demonstrating Electrical Connection on Reconstituted ASIC Chips on 8-Inch Silicon Wafer by Wei, Wei, Zhang, Lei, Tobback, Bert, Visker, Jakob, Stakenborg, Tim, Karve, Gauri, Tezcan, Deniz S.

“…Wafer reconstitution entails the assembly of dies from multiple sources onto a wafer by die to wafer attach [1]-[4]. This reconstituted wafer can then be used…”
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Fabrication of Superconducting Nb Airbridges in a 300 mm Pilot Line for Quantum Technologies by Wan, Danny, Mongillo, Massimo, Canvel, Yann, Lozano, Daniel Perez, Tobback, Bert, Ivanov, Tsvetan, Pacco, Antoine, Piao, Xiaoyu, Massar, Shana, Potocnik, Anton, De Greve, Kristiaan

“…Superconducting Nb airbridges were fabricated in imec's 300 mm pilot line utilizing an advanced production toolset. An optimized process flow, which does not…”
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Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking by Derakhshandeh, Jaber, Beyne, Eric, Beyer, Gerald, Capuz, Giovanni, Cherman, Vladimir, De Preter, Inge, Gerets, Carine, Shafahian, Ehsan, Kennes, Koen, Jamieson, Geraldine, Cochet, Tom, Webers, Tomas, Tobback, Bert, Van der Plas, Geert, La Tulipe, Douglas Charles, Phommahaxay, Alain, Miller, Andy

“…In this paper, for first time, damascene process on thinned and bonded device wafer to a carrier using TBM layer is introduced. All the BS process steps…”
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Overlay performance of through Si via last lithography for 3D packaging by Flack, Warren W., Hsieh, Robert, Kenyon, Gareth, Slabbekoorn, John, Czarnecki, Piotr, Tobback, Bert, Van Huylenbroeck, Stefaan, Stucchi, Michele, Vandeweyer, Tom, Miller, Andy

“…Foundry customers and makers of leading-edge devices are evaluating through-silicon via (TSV) for next-generation three-dimensional (3D) packaging. Scaling the…”
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