Search Results - "Tjengdrawira, C."

17.9% Metal-wrap-through mc-Si cells resulting in module efficiency of 17.0 by Lamers, M. W. P. E., Tjengdrawira, C., Koppes, M., Bennett, I. J., Bende, E. E., Visser, T. P., Kossen, E., Brockholz, B., Mewe, A. A., Romijn, I. G., Sauar, E., Carnel, L., Julsrud, S., Naas, T., de Jong, P. C., Weeber, A. W.

“…ABSTRACT We obtained 17.9% cell efficiency on thin and large mc‐Si REC wafers using ECN's metal‐wrap‐through (MWT) concept. Optimization of several cell…”
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Impact of materials on back-contact module reliability by Guichoux, M, Tjengdrawira, C, Veldman, D, de Jong, P C

“…This paper discusses the impact of several combinations of encapsulants, conductive adhesives and back-sheet foils on ECN's back-contact modules performance…”
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World first 17% efficient multi-crystalline silicon module by Tjengdrawira, C, Lamers, M W P E, Bennett, I J, de Jong, P C

“…The overall demand in reducing the cost of electricity from solar energy has driven the cost of solar modules down. ECN developed an innovative module…”
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