Search Results - "Tilmans, H A C"
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MEMS packaging and reliability: An undividable couple
Published in Microelectronics and reliability (01-09-2012)“…This paper reviews various approaches to package MEMS, illustrated mainly with examples from imec. Wafer-level or 0-level packaging is mostly dealt with. The…”
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Acoustic meta-materials in MEMS BAW resonators
Published in Applied physics. A, Materials science & processing (01-06-2011)“…This paper presents a meta-material-based design method for bulk acoustic wave (BAW) resonators with enhanced characteristics compared to those obtained with…”
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3
V-band low phase-noise oscillator based on a cavity resonator integrated in the silicon substrate of the MCM-D platform
Published in Microwave and optical technology letters (01-08-2012)“…In this article, we present a V‐band low‐phase‐noise oscillator stabilized by a silicon integrated cavity resonator (SiCR). The SiCR is realized in a multi…”
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4
Compact cavity resonators using high impedance surfaces
Published in Applied physics. A, Materials science & processing (01-06-2011)“…This paper presents a miniaturization concept for cavity resonators. The idea is to create a λ /4 long cavity resonator by using a combination of Perfect…”
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5
Materials issues in the processing, the operation and the reliability of MEMS
Published in Microelectronic engineering (01-10-2004)“…In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the…”
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6
Investigation of internal nonhomogenous volumes of perturbation as tuning and miniaturization elements for cavity resonators
Published in Microwave and optical technology letters (01-02-2012)“…In this article, we investigate the tuning and miniaturization performance induced by a volume perturbation inserted in a cavity resonator. The volume…”
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7
The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices
Published in Journal of microelectromechanical systems (01-06-2000)“…A variety of microelectromechanical system devices requires encapsulation of their crucial fragile parts in a hermetically sealed cavity for reasons of…”
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8
Nonlinearity and hysteresis of resonant strain gauges
Published in Journal of microelectromechanical systems (01-03-1998)“…The nonlinearity and hysteresis effects of the electrostatically activated voltage-driven resonant microbridges have been studied theoretically and…”
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9
A wet release process for fabricating slender and compliant suspended micro-mechanical structures
Published in Sensors and actuators. A, Physical (15-01-2003)“…This paper reports on the development of a generic wet release process for the fabrication of suspended slender and compliant micro-mechanical structures of…”
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10
Fast analytical design of MEMS capacitive pressure sensors with sealed cavities
Published in Mechatronics (Oxford) (01-12-2016)“…This paper presents a fast design strategy for MEMS capacitive pressure sensors with sealed cavities. Based on circular Kirchhoff-Love plate theory and the…”
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Above-IC generic poly-SiGe thin film wafer level packaging and MEM device technology: Application to accelerometers
Published in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (01-01-2011)“…We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices…”
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12
Light sensitive SiGe MEM resonator for detection and frequency tuning applications
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01-01-2010)“…This paper presents a silicon-based MEM resonant light sensor, a novel application for MEM resonators. The sensor is a particular kind of micro-bolometer in…”
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13
High-Q torsional mode Si triangular beam resonators encapsulated using SiGe thin film
Published in 2010 International Electron Devices Meeting (01-12-2010)“…This paper reports on an SOI-based 20 MHz MEMS torsional resonator, wafer-level packaged using SiGe thin film and hermetically sealed using Al sputtering at…”
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14
A new characterization method for electrostatically actuated resonant MEMS: Determination of the mechanical resonance frequency, quality factor and dielectric charging
Published in Sensors and actuators. A. Physical. (24-09-2009)“…In this paper, a novel technique to characterize MEMS is described. The technique is based on electric admittance measurements of electrostatically actuated…”
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15
Optimal T-support anchoring for bar-type BAW resonators
Published in 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (01-01-2011)“…This paper reports on an optimal support anchoring for bar-type BAW resonators. We demonstrate both theoretically and experimentally the implementation of long…”
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16
Design considerations and technology assessment of phased-array antenna systems with RF MEMS for automotive radar applications
Published in IEEE transactions on microwave theory and techniques (01-06-2005)“…Planar array antennas are attractive for use in future automotive radar systems due to their flexibility in design and control of radar beams. The complexity…”
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17
Acoustic meta-materials in MEMS BAW resonators: Advances in Metamaterials and Photonics
Published in Applied physics. A, Materials science & processing (2011)Get full text
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18
Effect of substrate charging on the reliability of capacitive RF MEMS switches
Published in Sensors and actuators. A. Physical. (24-09-2009)“…In this paper, we show that substrate charging is another possible failure mechanism limiting the lifetime of capacitive RF MEMS switches. Switches fabricated…”
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19
A MEMS variable Faraday cage as tuning element for integrated silicon micromachined cavity resonators
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01-01-2010)“…This paper reports the design and the realization of a variable-sized MEMS-based Faraday cage, used to tune the resonant frequency of a silicon micromachined…”
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20
Challenges of monolithic integration for SiGe MEMS technology
Published in 2016 IEEE SENSORS (01-10-2016)“…The paper describes the key challenges of CMOS integrated monolithic MEMS Accelerometer with SiGe MEMS technology combined with TSMC 0.18 μm CMOS technology…”
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