Search Results - "Tillocher, Thomas"

Comparison between Bosch and STiGer Processes for Deep Silicon Etching by Tillocher, Thomas, Nos, Jack, Antoun, Gaëlle, Lefaucheux, Philippe, Boufnichel, Mohamed, Dussart, Rémi

“…The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer,…”
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Novel Method Based on Spin-Coating for the Preparation of 2D and 3D Si-Based Anodes for Lithium Ion Batteries by Gabard, Marie, Zaghrioui, Mustapha, Chouteau, David, Grimal, Virginie, Tillocher, Thomas, Ghamouss, Fouad, Poirot, Nathalie

“…The present study describes a novel strategy for preparing thin Silicon 2D and 3D electrodes for lithium ion batteries by a spin coating method. A homogeneous…”
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Scalloping removal on DRIE via using low concentrated alkaline solutions at low temperature by Defforge, Thomas, Song, Xi, Gautier, Gaël, Tillocher, Thomas, Dussart, Rémi, Kouassi, Sébastien, Tran-Van, François

“…The scalloping removal on the silicon via sidewalls after a Deep Reactive Ion Etching (DRIE) by the so-called STiGer process has been achieved using a low…”
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Atomic layer etching of gallium nitride using fluorine-based chemistry by Hamraoui, Lamiae, Zhang, Tinghui, Crespi, Angela, Lefaucheux, Philippe, Tillocher, Thomas, Boufnichel, Mohamed, Dussart, Rémi

“…Atomic layer etching (ALE) of GaN on silicon substrates has been investigated using fluorine-based chemistry. The ALE process used for this study consists of a…”
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Morphology control in thin films of PS:PLA homopolymer blends by dip-coating deposition by Vital, Alexane, Vayer, Marylène, Tillocher, Thomas, Dussart, Rémi, Boufnichel, Mohamed, Sinturel, Christophe

“…[Display omitted] •A process to control the morphology of polymer blends thin film is described.•It is based on the use of dip-coating at various withdrawal…”
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Conformal coating by liquid route on three-dimensional topology by Poirot, Nathalie, Tillocher, Thomas, Raynal, Pierre-Ivan

“…We demonstrated a new approach to the production of three-dimensional-coated patterns using the liquid route. Metallic perovskite oxides were coated onto…”
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Cryo atomic layer etching of SiO 2 by C F8 physisorption followed by Ar plasma by Antoun, Gaelle, Lefaucheux, Philippe, Tillocher, Thomas, Dussart, Rémi, Yamazaki, Kumiko, Yatsuda, Koichi, Faguet, Jacques, Maekawa, Kaoru

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Cryogenic nanoscale etching of silicon nitride selectively to silicon by alternating SiF 4 /O 2 and Ar plasmas by Antoun, Gaelle, Tillocher, Thomas, Girard, Aurélie, Lefaucheux, Philippe, Faguet, J., Kim, H., Zhang, D., Wang, M., Maekawa, K., Cardinaud, Christophe, Dussart, Rémi

“…This article first presents quasi- in situ XPS measurements on Si 3 N 4 and a-Si samples after exposure to an SiF 4 /O 2 plasma at different cryogenic…”
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Mechanism understanding in cryo atomic layer etching of SiO2 based upon C4F8 physisorption by Antoun, G., Tillocher, T., Lefaucheux, P., Faguet, J., Maekawa, K., Dussart, R.

“…Cryogenic Atomic Layer Etching (cryo-ALE) of SiO 2 based on alternating a C 4 F 8 molecule physisorption step and an argon plasma step, has been enhanced…”
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Combined analysis methods for investigating titanium and nickel surface contamination after plasma deep etching by Ettouri, Rim, Tillocher, Thomas, Lefaucheux, Philippe, Boutaud, Bertrand, Fernandez, Vincent, Fairley, Neal, Cardinaud, Christophe, Girard, Aurélie, Dussart, Rémi

“…Plasma etching techniques can result in damage and contamination of materials, which, if not removed, can interfere with further processing. Therefore,…”
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Polymer masks for structured surface and plasma etching by Vital, Alexane, Vayer, Marylène, Sinturel, Christophe, Tillocher, Thomas, Lefaucheux, Philippe, Dussart, Rémi

“…•Sub-micrometric silicon structures were prepared by cryogenic plasma etching.•Polymer templates based on phase-separated films of PS/PLA were used.•Silica…”
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Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF6/O2 plasmas by Tinck, Stefan, Tillocher, Thomas, Georgieva, Violeta, Dussart, Rémi, Neyts, Erik, Bogaerts, Annemie

“…Cryogenic plasma etching is a promising technique for high‐control wafer development with limited plasma induced damage. Cryogenic wafer temperatures…”
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Concurrent effects of wafer temperature and oxygen fraction on cryogenic silicon etching with SF 6 /O 2 plasmas by Tinck, Stefan, Tillocher, Thomas, Georgieva, Violeta, Dussart, Rémi, Neyts, Erik, Bogaerts, Annemie

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Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above −50 °C by Chanson, R., Zhang, L., Naumov, S., Mankelevich, Yu. A., Tillocher, T., Lefaucheux, P., Dussart, R., Gendt, S. De, Marneffe, J.-F. de

“…The micro-capillary condensation of a new high boiling point organic reagent (HBPO), is studied in a periodic mesoporous oxide (PMO) with ∼34 % porosity and…”
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Low-k integration: Gas screening for cryogenic etching and plasma damage mitigation by Chanson, Romain, Dussart, Remi, Tillocher, Thomas, Lefaucheux, P., Dussarrat, Christian, de Marneffe, Jean François

“…The integration of porous organo-silicate low- k materials has met a lot of technical challenges. One of the main issues is plasma-induced damage, occurring…”
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The role of physisorption in the cryogenic etching process of silicon by Antoun, G., Dussart, R., Tillocher, T., Lefaucheux, P., Cardinaud, C., Girard, A., Tahara, S., Yamazaki, K., Yatsuda, K., Faguet, J., Maekawa, K.

“…The growth mechanism of the passivation layer in the cryogenic process used for silicon deep etching is explored experimentally in an inductively coupled…”
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Modification of poly(styrene) thin films and enhancement of cryogenic plasma etching resistance by ruthenium tetroxide vapor staining by Vital, A., Vayer, M., Sinturel, C., Tillocher, T., Lefaucheux, P., Dussart, R., Boufnichel, M.

“…Poly(styrene) thin films, typically 80 nm thick, were stained using ruthenium tetroxide vapors and studied using AFM, XPS, ToF-SIMS, ellipsometry and tested as…”
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Novel Method Based on Spin-Coating for the Preparation of 2D and 3D Si-Based Anodes for Lithium Ion Batteries by Gabard, Marie, Zaghrioui, Mustapha, Chouteau, David, Grimal, Virginie, Tillocher, Thomas, Ghamouss, Fouad, Poirot, Nathalie

“…The present study describes a novel strategy for preparing thin Silicon 2D and 3D electrodes for lithium ion batteries by a spin coating method. A homogeneous…”
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Parametric study of STiGer etching process in order to reduce extended formation of scalloping defects on the sidewalls of silicon submicron trenches by Kafrouni, W., Tillocher, T., Ladroue, J., Lefaucheux, P., Boufnichel, M., Ranson, P., Dussart, R.

“…A first study was carried out to define the appropriate parameters to create a passivation layer by SiF4/O2 plasma that resists lateral chemical etching by SF6…”
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High aspect ratio etched sub-micron structures in silicon obtained by cryogenic plasma deep-etching through perforated polymer thin films by Kulsreshath, M., Vital, A., Lefaucheux, P., Sinturel, C., Tillocher, T., Vayer, M., Boufnichel, M., Dussart, R.

“…Cryogenic plasma deep-etching for silicon sub-micron structures was studied with the use of modified poly(styrene) (PS) perforated masks obtained from…”
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