Search Results - "Tierno, Davide"
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Temperature-dependent resistivity of alternative metal thin films
Published in Applied physics letters (27-07-2020)“…The temperature coefficients of the resistivity (TCR) of Cu, Ru, Co, Ir, and W thin films have been investigated as a function of film thickness below 10 nm…”
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2
Resistance modeling of short-range connections: impact of current spreading
Published in Japanese Journal of Applied Physics (01-04-2023)“…Abstract We investigated the impact of current spreading on the resistance of short-range connections by performing simulations in Synopsys Sentaurus, based on…”
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Experimental study of time-dependent dielectric degradation by means of random telegraph noise spectroscopy
Published in Solid-state electronics (01-04-2024)“…Time-dependent dielectric breakdown (TDDB) is commonly used to assess dielectric failures. However, TDDB provides limited insights into the physics of…”
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Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01-03-2022)“…The electrical reliability of 1 µm pitch wafer-to-wafer (W2W) Cu/SiCN hybrid bonding interface is evaluated. Breakdown voltage distributions of the W2W hybrid…”
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Conference Proceeding -
5
Microwave Characterization of Ba-Substituted PZT and ZnO Thin Films
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01-05-2018)“…The microwave dielectric properties of (Ba 0.1 Pb 0.9 )(Zr 0.52 Ti 0.48 )O 3 (BPZT) and ZnO thin films with thicknesses below 2 μm were investigated. No…”
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Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations
Published in 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) (01-05-2023)“…We benchmarked Co and Ru metallizations against Cu at cryogenic temperatures (5K-300K) by using imec resistivity model and actual interconnects, with widths…”
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Conference Proceeding -
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Cryo-Computing for Infrastructure Applications: A Technology-to-Microarchitecture Co-optimization Study
Published in 2022 International Electron Devices Meeting (IEDM) (03-12-2022)“…Cryo-computing has been proposed for data center and HPC applications. Ultra-low temperature CMOS not only has the potential to aid the node-to-node…”
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Conference Proceeding -
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Temperature-Dependent Resistivity of Alternative Metal Thin Films
Published 02-07-2020“…Applied Physics Letters 117, 043104 (2020) The temperature coefficients of the resistivity (TCR) of Cu, Ru, Co, Ir, and W thin films have been investigated as…”
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Journal Article -
9
ALD Mo for Advanced MOL Local Interconnects
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27-06-2022)“…This paper introduces ALD Mo as a potential replacement for W and Co as the conductor for logic MOL interconnects. 10nm ALD Mo without a liner and barrier has…”
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Conference Proceeding -
10
Impact of surface condition on Cobalt drift into LK3.0 films
Published in 2020 IEEE International Interconnect Technology Conference (IITC) (05-10-2020)“…Metal drift induced failure is a serious threat to the reliability of advanced back-end-of-line (BEOL) systems based on ultra-thin dielectric layers and…”
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Conference Proceeding -
11
Reliability of Barrierless PVD Mo
Published in 2021 IEEE International Interconnect Technology Conference (IITC) (06-07-2021)“…We evaluate the reliability of barrierless Mo metallization on various dielectrics that are used in both BEOL and MOL integration schemes. In particular, we…”
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Conference Proceeding -
12
Strain coupling optimization in magnetoelectric transducers
Published 16-10-2017“…The mechanical behavior of magnetoelectric transducers consisting of piezoelectric-magnetostrictive bilayers has been modeled. The effect of the aspect ratio…”
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