Search Results - "Tien-Sheng Chao"
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CMOS-Compatible Fabrication of Low-Power Ferroelectric Tunnel Junction for Neural Network Applications
Published in IEEE transactions on electron devices (01-02-2021)“…A low-cost fabrication process of Hf 1-x Zr x O 2 (HZO) nonvolatile memory (NVM) was proposed and its characteristics were investigated. We successfully…”
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Junctionless Nanosheet (3 nm) Poly-Si TFT: Electrical Characteristics and Superior Positive Gate Bias Stress Reliability
Published in IEEE electron device letters (01-01-2018)“…In this letter, a junctionless (JL) poly-Si thin-film transistor (TFT) with a 3-nm-thick nanosheet channel is successfully fabricated using the low-temperature…”
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3
Fabrication of Vertically Stacked Nanosheet Junctionless Field-Effect Transistors and Applications for the CMOS and CFET Inverters
Published in IEEE transactions on electron devices (01-09-2020)“…In this study, conventional CMOS and complementary field-effect transistor (CFET) inverters based on a vertically stacked-nanosheet (NS) structure were…”
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Reliability of p-Type Pi-Gate Poly-Si Nanowire Channel Junctionless Accumulation-Mode FETs
Published in IEEE transactions on electron devices (01-06-2021)“…In this study, p-type Pi-gate (PG) poly-Si nanowire channel junctionless accumulation-mode (JAM) field-effect transistors (FETs) were successfully fabricated…”
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5
Fabrication of GeSn Nanowire MOSFETs by Utilizing Highly Selective Etching Techniques
Published in IEEE transactions on electron devices (01-04-2023)“…Germanium-tin (GeSn) epitaxy layer was prepared on an 8-in SOI wafer with a Ge buffer layer. The etching rates of different solutions for the GeSn layer were…”
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Gate-All-Around Junctionless Transistors With Heavily Doped Polysilicon Nanowire Channels
Published in IEEE electron device letters (01-04-2011)“…In this letter, we have investigated experimentally, for the first time, the feasibility of gate-all-around polycrystalline silicon (poly-Si) nanowire…”
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Single‐Gate In‐Transistor Readout of Current Superposition and Collapse Utilizing Quantum Tunneling and Ferroelectric Switching
Published in Advanced materials (Weinheim) (01-08-2023)“…In nanostructure assemblies, the superposition of current paths forms microscopic electric circuits, and different circuit networks produce varying results,…”
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Comprehensive Analysis on Electrical Characteristics of Pi-Gate Poly-Si Junctionless FETs
Published in IEEE transactions on electron devices (01-07-2017)“…In this paper, the electrical characteristics of the Pi-gate junctionless FETs (PG JL FETs) with the in situ n + doped poly-Si (DP-Si) fin-channels have been…”
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9
Effect of Seed Layer on Gate-All-Around Poly-Si Nanowire Negative-Capacitance FETs With MFMIS and MFIS Structures: Planar Capacitors to 3-D FETs
Published in IEEE transactions on electron devices (01-02-2020)“…In this article, we successfully fabricated nanowire (NW) negative capacitance (NC)-related ferroelectric FETs (FE-FETs) with two structures: trigate (TG) and…”
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10
High-Performance Pi-Gate Poly-Si Junctionless and Inversion Mode FET
Published in IEEE transactions on electron devices (01-11-2016)“…In this paper, the Pi-gate (PG) poly-Si junction-less (JL) and inversion mode (IM) FETs with a high aspect ratio (A.R. = channel thickness/channel width ~ 3.4)…”
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11
Impacts of the Shell Doping Profile on the Electrical Characteristics of Junctionless FETs
Published in IEEE transactions on electron devices (01-11-2015)“…This paper presents the impacts of an advanced shell doping profile (SDP) on the electrical characteristics of a junctionless (JL) FET in terms of OFF-current,…”
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12
Junctionless Poly-Si Nanowire Transistors With Low-Temperature Trimming Process for Monolithic 3-D IC Application
Published in IEEE transactions on electron devices (01-12-2016)“…In this paper, the junctionless (JL) ultrathin polycrystalline-Si (poly-Si) nanowire (NW) transistors with gate-all-around configuration and raised…”
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13
Experimental Demonstration of Stacked Gate- All-Around Poly-Si Nanowires Negative Capacitance FETs With Internal Gate Featuring Seed Layer and Free of Post-Metal Annealing Process
Published in IEEE electron device letters (01-11-2019)“…For the first time, two-layer stacked nanowire gate-all-around (GAA) negative capacitance (NC) field-effect transistors (FETs) with an ultrasmall poly-Si…”
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14
Investigation of Two Bits With Multistate Antifuse on nMOS Poly-Silicon Junctionless GAA OTP
Published in IEEE transactions on electron devices (01-12-2021)“…One-time programmable (OTP) memory is essential to the security and gaming industries because of its "write once, read many" capability. This device supports…”
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15
Highly Stable Short Channel Ultrathin Atomic Layer Deposited Indium Zinc Oxide Thin Film Transistors With Excellent Electrical Characteristics
Published in IEEE electron device letters (01-10-2023)“…The high-performance atomic layer deposited (ALD) ultrathin (~2 nm) amorphous InZnO (<inline-formula> <tex-math notation="LaTeX">{a}…”
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Characteristics of Poly-Si Junctionless FinFETs With HfZrO Using Forming Gas Annealing
Published in IEEE transactions on nanotechnology (2020)“…In this study, an effective method was proposed to enhance the current drivability of junctionless field-effect transistors (JL-FETs) by utilizing…”
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17
High-Performance GAA Sidewall-Damascened Sub-10-nm In Situ n+-Doped Poly-Si NWs Channels Junctionless FETs
Published in IEEE transactions on electron devices (01-11-2014)“…The gate-all-around sidewall-damascened sub10-nm in situ n + -doped poly-Si nanowires channels junctionless FETs (GAA SWDNW-JLFETs) with one NW of sub-50-nm 2…”
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18
Improving the Electrical Performance of a Quantum Well FET With a Shell Doping Profile by Heterojunction Optimization
Published in IEEE transactions on electron devices (01-09-2017)“…This paper investigates the impacts of typical semiconductor material properties-electron affinity, bandgap, and dielectric constant, on the electrical…”
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19
A Harmonic Radar Tag with High Detection Range Utilizing Ge FinFETs CMOS Technology
Published in IEEE electron device letters (01-11-2022)“…This study fabricated and verified a germanium (Ge) fin field-effect transistor (FinFET) on developed GeSOI platform. The Ge FinFETs were demonstrated for…”
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20
Low-Temperature Microwave Annealing Processes for Future IC Fabrication-A Review
Published in IEEE transactions on electron devices (01-03-2014)“…Microwave annealing (MWA) and rapid thermal annealing (RTA) of dopants in implanted Si are compared in their abilities to produce very shallow and highly…”
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