Search Results - "Theunissen, M.J.J."
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Impact of silicon substrates on leakage currents
Published in IEEE electron device letters (01-11-1983)“…Leakage currents of n + -p-diodes, made on four different groups of p-type silicon substrates, are investigated at temperatures between 50 and 120°C. At these…”
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Journal Article -
2
Planar ion-channeling measurements on buried nano-films
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01-12-2001)“…Planar MeV ion-channeling measurements on 2.2 nm thick Si 1− x Ge x nano-films buried in Si are presented. The presence of the nano-film leads to a step in the…”
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Journal Article -
3
Strain measurements in ultra-thin buried films (<50 Å) with RBS ion channeling
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01-03-2000)“…A method has been developed to measure strain in ultra-thin (<50 Å) buried films. The presence of the film leads to a step in the yield of the host crystal in…”
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Journal Article -
4
Technology of the Diode Programmable Read Only Memory
Published in 27th European Solid-State Device Research Conference (1997)Get full text
Conference Proceeding -
5
Comparison of polysilicon and silicon-carbon emitters with enhanced emitter efficiency
Published in Proceedings of IEEE Bipolar/BiCMOS Circuits and Technology Meeting (1994)“…Plasma-Enhanced CVD (PECVD) and Low-Pressure CVD (LPCVD) silicon-carbon emitters have been fabricated in the same transistor layout together with the best…”
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Conference Proceeding -
6
Resonant-Cavity-Enhanced Photodiode Using Silicon-on-Anything Technology
Published in 29th European Solid-State Device Research Conference (1999)Get full text
Conference Proceeding -
7
Reassessment of defect models in graphite strip heater zone-melt recrystallized material by non-destructive thin film diagnostics
Published in IEEE SOS/SOI Technology Conference (1989)“…Summary form only given. Recent state-of-the-art graphite strip heater ZMR wafers were examined by nondestructive diagnostic tools especially suited for the…”
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Conference Proceeding -
8
Defect analysis of SOI structures made by CO/sub 2/-laser zone melt recrystallization
Published in Proceedings. SOS/SOI Technology Workshop (1988)“…Summary form only given. During zone-melting of the polycrystalline silicon layer a large temperature gradient exists between the molten Si layer and the…”
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Conference Proceeding -
9
Selective-epitaxial base technology with 14 ps ECL-gate delay, for low power wide-band communication systems
Published in Proceedings of International Electron Devices Meeting (1995)“…A silicon bipolar technology is presented that incorporates a selectively epitaxially grown base in a double-polysilicon transistor. Si-bases as well as…”
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Conference Proceeding -
10
A Microwave Method for Contactless Measurement of the Lifetime of Free Carriers in Silicon Wafers
Published in ESSDERC '88: 18th European Solid State Device Research Conference (01-09-1988)“…Following an optical excitation of the free carriers in silicon wafers, their lifetimes are determined by measuring the reflected-microwave power. The…”
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Conference Proceeding