Search Results - "Tenreiro, G"

Numerical Design of a Thread-Optimized Gripping System for Lap Joint Testing in a Split Hopkinson Apparatus by Moreira, Bernardo S, Nunes, Paulo D P, da Silva, Carlos M, Tenreiro, António Francisco G, Lopes, António M, Carbas, Ricardo J C, Marques, Eduardo A S, Parente, Marco P L, da Silva, Lucas F M

“…Currently, few experimental methods exist that enable the mechanical characterization of adhesives under high strain rates. One such method is the Split…”
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Pattern recognition in electromechanical impedance spectroscopy damage detection of adhesive joints using multidimensional scaling by Francisco, A, Tenreiro, G, Lopes, António M, da Silva, Lucas FM

“…Adhesive joints are prone to various types of damage sources, which may not be identifiable with current non-destructive tests (NDTs). Structural health…”
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Damage Metrics for Void Detection in Adhesive Single-Lap Joints by Tenreiro, António Francisco G., Lopes, António M., da Silva, Lucas F. M.

“…Structural Health Monitoring (SHM) techniques, such as Electromechanical Impedance Spectroscopy (EMIS), aim to continuously monitor structures for defects,…”
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A Tribute to José António Tenreiro Machado (1957–2021): Life and Work by Galhano, Alexandra M. S. F., Tenreiro, Antonio Francisco G., Tenreiro, José Pedro G.

“…José António Tenreiro Machado (Figure 1) left us unexpectedly on 6 October, the day of his 64th birthday [...]…”
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On the influence of joining processes on the vibration of structures by Millan, Pedro, Tenreiro, A.Francisco G., Amorim, João D.P., Kasaei, Mohammad Mehdi, Beygi, Reza, Ambrósio, Jorge, da Silva, Lucas F.M.

“…The joining of new and dissimilar materials in the transportation sector, to meet the demands for lighter structures, requires the use of alternative joining…”
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A review of structural health monitoring of bonded structures using electromechanical impedance spectroscopy by Tenreiro, A Francisco G, Lopes, António M, da Silva, Lucas FM

“…The article presents a literature review of electromechanical impedance spectroscopy for structural health monitoring, with emphasis in adhesively bonded…”
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Design of a new pneumatic impact actuator of a Split Hopkinson Pressure Bar (SHPB) setup for tensile and compression testing of structural adhesives by Tenreiro, A. Francisco G., Silva, Carlos M., Lopes, António M., Nunes, Paulo D.P., Carbas, Ricardo J.C., da Silva, Lucas F.M.

“…•New architecture for impact testing apparatus, the Split Hopkinson Pressure Bar.•New pneumatic actuator architecture that can reach high speeds.•Functional…”
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Effect of mechanical properties and geometric dimensions on electromechanical impedance signatures for adhesive joint integrity monitoring by Tenreiro, A. Francisco G., Lopes, António M., da Silva, Lucas F. M., Amorim, João D. P.

“…Adhesive joints are prone to damage, which may be difficult to detect using Nondestructive Test. Structural Health Monitoring techniques, such as the…”
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Influence of void damage on the electromechanical impedance spectra of Single Lap Joints by Tenreiro, A. Francisco G., Lopes, António M., da Silva, Lucas F.M., Carbas, Ricardo J.C.

“…Adhesively bonded joints are susceptible to a variety of damage sources, which may be of difficult detection with current Non-Destructive Testing (NDT)…”
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