Search Results - "Temiz, Y."

A Compact Angular Rate Sensor System Using a Fully Decoupled Silicon-on-Glass MEMS Gyroscope by Alper, S.E., Temiz, Y., Akin, T.

“…This paper presents the development of a compact single-axis angular rate sensor system employing a 100- mum-thick single-crystal silicon…”
Get full text

The efficacy of Tc99m dimercaptosuccinic acid (Tc-DMSA) scintigraphy and ultrasonography in detecting renal scars in children with primary vesicoureteral reflux (VUR) by Temiz, Y, Tarcan, T, Onol, F F, Alpay, H, Simşek, F

“…Pyelonephritis-induced renal scarring in children is a major predisposing factor for proteinuria, hypertension, and ultimate renal failure. The aim of this…”
Get full text

Electrogates for stop-and-go control of liquid flow in microfluidics by Arango, Y., Temiz, Y., Gökçe, O., Delamarche, E.

“…Diagnostics based on microfluidic devices necessitate specific reagents, flow conditions, and kinetics for optimal performance. Such an optimization is often…”
Get full text

A Novel In-Operation High g-Survivable MEMS Gyroscope by Azgin, K., Temiz, Y., Akin, T.

“…This paper presents a new SOI-MEMS gyroscope with very high in-operation shock survivability together with very low R nonlinearity and scale factor…”
Get full text

An HIV-negative penil Kaposi's sarcoma by Demir, A, Temiz, Y, Bozkurt, S U, Erbarut, I, Ilker, Y

“…Kaposi's sarcoma is a tumour of reticuloendothelial system. Non-epidemic Kaposi's sarcoma limited to the penile involvement should be aggressively treated…”
Get full text

Integrating bio-sensing functions on CMOS chips by Guiducci, C, Temiz, Y, Leblebici, Y, Accastelli, E, Ferretti, A, Cappi, G, Bianchi, E

“…The paper discusses the recent achievements in the development of chips with integrated sensing of biomolecules. In particular, it focuses on integrated…”
Get full text

Resistive Programmable Through-Silicon Vias for Reconfigurable 3-D Fabrics by Sacchetto, D., Zervas, M., Temiz, Y., De Micheli, G., Leblebici, Y.

“…In this letter, we report on the fabrication and characterization of titanium dioxide (TiO 2 )-based resistive RAM (ReRAM) cointegration with 380 μm-height Cu…”
Get full text

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology by Beanato, G., Giovannini, P., Cevrero, A., Athanasopoulos, P., Zervas, M., Temiz, Y., Leblebici, Y.

“…An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together…”
Get full text

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling by Sabry, M M, Sridhar, A, Atienza, D, Temiz, Y, Leblebici, Y, Szczukiewicz, S, Borhani, N, Thome, J R, Brunschwiler, T, Michel, B

“…New tendencies envisage 3D Multi-Processor System-On-Chip (MPSoC) design as a promising solution to keep increasing the performance of the next-generation…”
Get full text

An HIV-negative Penil Kaposi?s sarcoma by Demir, A., Temiz, Y., Bozkurt, S.U., Erbarut, I., Ilker, Y.

Get full text

Real-time high-sensitivity impedance measurement interface for tethered BLM biosensor arrays by Temiz, Y., Gurkaynak, F.K., Terrettaz, S., Vogel, H., De Micheli, G., Leblebici, Y., Guiducci, C., Benini, L.

“…This paper presents a switched-capacitor (SC) current integrator circuit for impedance measurement of tethered bilayer lipid membrane (tBLM) biosensors. The…”
Get full text

Internet of the Body - Wearable Monitoring and Coaching by Brunschwiler, T., Weiss, J., Paredes, S., Sridhar, A., Pluntke, U., Chau, S. Mai, Gerke, S., Barroso, J., Loertscher, E., Temiz, Y., Ruch, P., Michel, B., Zafar, S., van Kessel, T.

“…Wearables that acquire relevant vital and contextual parameters improve work safety as well as quality of life of elderly citizens or patients with chronic…”
Get full text

A new approach for the surgery of large renal masses: abdominal wall flap incision by Türkeri, Levent N, Temiz, Yusuf, Ozgur, Abdurrahman, Onol, Fikret Fatih

“…The type of skin incision affects the course of surgery during radical nephrectomy. We investigated the efficacy of a new type of incision for the surgical…”
Get more information

Die-level TSV fabrication platform for CMOS-MEMS integration by Temiz, Y., Zervas, M., Guiducci, C., Leblebici, Y.

“…This paper reports a new post-CMOS processing platform for die-level through-silicon-via (TSV) fabrication, based on wafer reconstitution from embedded dies,…”
Get full text

Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home by Straessle, R., Temiz, Y., Gerke, S., Weiss, J., Sridhar, A., Paredes, S., Brunschwiler, T., Loertscher, E., Ebejer, N., Michel, B., van Kessel, T., Faro, I., Zafar, S., Libsch, F., Taubenblatt, M. A., Matsumoto, K.

“…Wearables that continuously acquire vital and other medically relevant parameters facilitate treatment optimizations for individual patients and reduce the…”
Get full text

Fabrication and characterization of wafer-level deep TSV arrays by Zervas, M., Temiz, Y., Leblebici, Y.

“…Three Dimensional (3D) integration, based on through silicon vias (TSV), has the potential to become a key enabling technology for many applications. TSVs are…”
Get full text

Internet of the Body and Cognitive Hypervisor by Strassle, R., Gerke, S., Brunschwiler, T., Temiz, Y., Weiss, J., Sridhar, A., Paredes, S., Loertscher, E., Ebejer, N., Michel, B., Lee, H.-M., Alvarado, C., Faro, I., Van Kessel, T., Meghelli, M., Taubenblatt, M. A., Zafar, S., Libsch, F., Matsumoto, K.

“…Wearables that continuously acquire medically relevant parameters can reduce duration of hospitalizations and derive treatment optimizations for individual…”
Get full text

Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks by Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Toral, G., Temiz, Y., Leblebici, Y.

“…Interlayer cooling is the only heat removal concept which scales with the number of active tiers in a vertically integrated chip stack. In this work, we…”
Get full text

An SOI-MEMS tuning fork gyroscope with linearly coupled drive mechanism by Azgin, K., Temiz, Y., Akin, T.

“…This paper presents a new tuning fork gyroscope structure with a highly linear coupling mechanism that keeps the phases of the drive mode oscillating masses…”
Get full text

A CMOS-compatible chip-to-chip 3D integration platform by Temiz, Y., Zervas, M., Guiducci, C., Leblebici, Y.

“…In this paper, a CMOS-compatible chip-to-chip 3D integration platform will be presented. The developed technology allows reconstituting a wafer from diced and…”
Get full text