Search Results - "Tegethoff, M.M.V."
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1
Defects, fault coverage, yield and cost, in board manufacturing
Published in Proceedings., International Test Conference (1994)“…An analysis of the main contributors to the quality and cost of complex board manufacturing is presented. Manufacturing data from three boards built at…”
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Conference Proceeding
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2
On clustering of defects and yield of SMT assemblies
Published in Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium (1994)“…This paper describes a clustered yield model for complex Surface Mount Technology (SMT) assemblies. The model uses the negative binomial distribution of…”
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Conference Proceeding -
3
Manufacturing test simulator: a concurrent engineering tool for boards and MCMs
Published in Proceedings., International Test Conference (1994)“…A board and multi-chip module (MCM) manufacturing test simulator (MTSIM) is described, MTSIM is a concurrent engineering tool used to simulate the…”
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Conference Proceeding -
4
Opens board test coverage: when is 99% really 40%?
Published in Proceedings International Test Conference 1996. Test and Design Validity (1996)“…In this paper we discuss board test coverage of opens for power pins of large ASICs soldered to electronic boards. Multiple power pin connections cannot be…”
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Conference Proceeding -
5
IEEE Std 1149.1: where are we? where from here?
Published in IEEE design & test of computers (1995)“…The authors discuss the status and celebrate the success of IEEE Std 1149.1, hoping to motivate discussion and action that will encourage further development…”
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Journal Article -
6
Sensitivity analysis of critical parameters in board test
Published in IEEE design & test of computers (01-01-1996)“…The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation…”
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Journal Article -
7
A clustered yield model for SMT boards and MCM's
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-11-1995)“…This paper describes a clustered yield model for complex surface mount technology (SMT) assemblies and multichip modules (MCM's). Based on yield modeling…”
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Journal Article