Search Results - "Tay, Andrew A O"
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An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks
Published in Micromachines (Basel) (01-10-2023)“…The era of 20 nm integrated circuits has arrived. There exist abundant heterogeneous micro/nano structures, with thicknesses ranging from hundreds of…”
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2
Electro-thermal cycle life model for lithium iron phosphate battery
Published in Journal of power sources (01-11-2012)“…An electro-thermal cycle life model is developed by incorporating the dominant capacity fading mechanism to account for the capacity fading effect on the…”
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3
Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders
Published in Journal of alloys and compounds (14-02-2008)“…Sn–3.8Ag–0.7Cu-based composite solders functionalized with single-wall carbon nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1 wt%…”
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4
Performance study and economic analysis of photo-voltaic thermal system under real-life thermal loads in tropical climate
Published in Sustainable environment research (12-12-2019)“…The paper describes the implementation of a photo-voltaic thermal (PVT) system for a student hostel located in Singapore to cater for hot water requirements of…”
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5
Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn–Pb solder alloy
Published in Journal of alloys and compounds (08-05-2008)“…Single-wall carbon nanotubes (SWCNTs) functionalized 63Sn–37Pb solders was synthesized. Composite solders up to 1 wt.% reinforcement of SWCNTs were prepared…”
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6
Numerical investigation of transfer coefficients of an evaporatively-cooled condenser
Published in Applied thermal engineering (01-07-2011)“…Vapour compression cooling systems working in tropical climatic conditions make the compressor pressure-lift relatively high. The lowering of the condensing…”
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7
Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation
Published in AIP advances (01-09-2017)“…Three-dimensional (3D) integration technology using Cu interconnections has emerged as a promising solution to improve the performance of silicon…”
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8
An experimental study of closed loop intermittent spray cooling of ICs
Published in Applied thermal engineering (01-10-2011)“…Spray cooling is one of the most prominent high heat flux removal schemes, for various applications including electronics cooling. In the past there has been…”
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9
An electro-thermal model and its application on a spiral-wound lithium ion battery with porous current collectors
Published in Electrochimica acta (01-03-2014)“…•A local electro-thermal model is developed to verify the validity of a lump electro-thermal model.•Comparisons on edge effect of batteries with porous current…”
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10
Integration issues of lithium-ion battery into electric vehicles battery pack
Published in Journal of cleaner production (01-02-2016)“…The critical challenges to enlarge the market share of electric vehicles (EVs) are cost, performance, reliability and safety. These issues are closely linked…”
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11
Numerical analyses on optimizing a heat pipe thermal management system for lithium-ion batteries during fast charging
Published in Applied thermal engineering (05-07-2015)“…Thermal management is crucial for the operation of electric vehicles because lithium ion batteries are vulnerable to excessive heat generation during fast…”
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12
Heating rate dependent delamination of metal–polymer interfaces: experiments and modeling
Published in International journal of fracture (01-06-2014)“…Bimaterial interfaces in microelectronics packages are the most common regions of failure under thermo-mechanical excursions. In this work, we report…”
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13
Structural and morphological qualities of InGaN grown via elevated pressures in MOCVD on AlN/Si(111) substrates
Published in Journal of crystal growth (15-11-2013)“…We examine the structural and morphological qualities of InxGa1−xN grown directly on AlN/Si(111) substrates by MOCVD as a function of growth pressure and…”
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14
Testing of two different types of photovoltaic–thermal (PVT) modules with heat flow pattern under tropical climatic conditions
Published in Energy for sustainable development (01-02-2013)“…In this paper, the testing of two different photovoltaic–thermal (PVT) modules under the tropical climatic conditions of Singapore, is evaluated. For this…”
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15
High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric
Published in Journal of materials science (01-02-2019)“…Development of low- k materials is critical for further improving the performance of integrated circuits. In this work, a novel type of fluorine-doped…”
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16
Effect of thermal contact resistances on fast charging of large format lithium ion batteries
Published in Electrochimica acta (10-07-2014)“…•The effect of thermal contact resistance on thermal performance of large format lithium ion batteries.•The effect of temperature gradient on electrochemical…”
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17
Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules – A constrained local curvature model
Published in Solar energy (01-04-2019)“…•The effect of the encapsulants on the IBC silicon cell stresses in a PV module were studied using finite element analysis.•The encapsulant modulus and…”
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18
Fracture in confined thin films: A discrete dislocation study
Published in Acta materialia (01-02-2006)“…The fracture toughness of thin metal films confined between elastic layers is studied using a two-dimensional discrete dislocation (DD) method. Fracture along…”
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From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X‐ray micro‐diffraction experiments and finite element simulations
Published in Progress in photovoltaics (01-09-2017)“…Fracture of silicon crystalline solar cells has recently been observed in increasing percentages especially in solar photovoltaic (PV) modules involving…”
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20
Dielectric materials for electrowetting-on-dielectric actuation
Published in Microsystem technologies : sensors, actuators, systems integration (01-03-2010)“…The fundamental building blocks of typical electrowetting-on-dielectric (EWOD) actuation and their importance in the EWOD mechanism are introduced and…”
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