Search Results - "Tashtoush, T."

Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure by Arfaei, B., Wentlent, L., Joshi, S., Alazzam, A., Tashtoush, T., Halaweh, M., Chivukula, S., Yin, L., Meilunas, M., Cotts, E., Borgesen, P.

“…Effects of solder alloy, volume and pad finishes on various aspects of microstructure and the corresponding thermomechanical properties of SnAgCu solder joints…”
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Dependence of SnAgCu solder joint properties on solder microstructure by Arfaei, B., Tashtoush, T., Kim, N., Wentlent, L., Cotts, E., Borgesen, P.

“…It is well known that variations in the microstructure of lead free solders greatly affect their thermomechanical properties. Sn grain size, orientation and…”
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