Search Results - "Tapaninen, Olli"

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    Copper-Core MCPCB With Thermal Vias for High-Power COB LED Modules by Juntunen, Eveliina, Tapaninen, Olli, Sitomaniemi, Aila, Jamsa, Markku, Heikkinen, Veli, Karppinen, Mikko, Karioja, Pentti

    Published in IEEE transactions on power electronics (01-03-2014)
    “…To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper…”
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    Journal Article
  2. 2

    Effect of Phosphor Encapsulant on the Thermal Resistance of a High-Power COB LED Module by Juntunen, Eveliina, Tapaninen, Olli, Sitomaniemi, Aila, Heikkinen, Veli

    “…With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue…”
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    Journal Article
  3. 3

    Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules by Juntunen, E., Sitomaniemi, A., Tapaninen, O., Persons, R., Challingsworth, M., Heikkinen, V.

    “…Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. However, heat management is a major…”
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    Journal Article
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