Search Results - "Tapaninen, Olli"
-
1
Copper-Core MCPCB With Thermal Vias for High-Power COB LED Modules
Published in IEEE transactions on power electronics (01-03-2014)“…To improve thermal performance of high-power chip-on-board multichip LED module, a copper-core metal core printed circuit board (MCPCB) substrate with copper…”
Get full text
Journal Article -
2
Effect of Phosphor Encapsulant on the Thermal Resistance of a High-Power COB LED Module
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-07-2013)“…With their many advantages, such as small size, energy efficiency, and long lifetime, light emitting diodes (LEDs) are conquering the lighting world. Blue…”
Get full text
Journal Article -
3
Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-12-2012)“…Evolution of lumens per watt efficacy has enabled exponential growth in light-emitting diode (LED) lighting applications. However, heat management is a major…”
Get full text
Journal Article -
4
Optical and thermal simulation chain for LED package
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01-04-2016)“…This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open…”
Get full text
Conference Proceeding