Search Results - "Takai, Toshiaki"

A 25.78-Gbit/s × 4-ch Active Optical Cable with Ultra-Compact Form Factor for High-Density Optical Interconnects by Kohmu, Naohiro, Takai, Toshiaki, Chujo, Norio, Arimoto, Hideo

“…A 25.78-Gbit/s × 4-ch active optical cable (AOC) with an ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm3, which is 55% smaller…”
Get full text

Fortification of niboshi with histidine prepared from katsuobushi protein digest by Hiraoka, Y.(Ehime-ken. Industrial Research Center, Matsuyama (Japan)), Sasaki, Y, Takai, T, Kawakubo, A, Miyoshi, S, Nakajima, S

“…Free and total histidine contents in the muscle of various fishes and invertebrates caught in the Seto Inland Sea were estimated. These contents were higher in…”
Get full text

Photoluminescence Properties of Selectively Ag-Photodoped Al–ZnSe at Room Temperature by Lee, Hyun-Yong, Takai, Toshiaki, Yao, Takafumi

“…Selective Ag photodoping at RT has been performed on Al-doped n-type ZnSe grown by MBE. Some 6-nm-thick Ag islands with a square shape (2 mm x 2 mm) are…”
Get full text

A Compact 310-Gb/s Optical Transceiver for High-Density Optical Interconnects by Matsuoka, Yasunobu, Kohmu, Naohiro, Yong Lee, Arimoto, Hideo, Takai, Toshiaki, Chujo, Norio, Sato, Masataka, Komatsuzaki, Shinji, Ogura, Akira, Yamazaki, Kinya, Sunaga, Yoshinori

“…A prototype compact 310-Gb/s (25.78-Gb/s × 12-ch) parallel-optical-transceiver module for large-capacity and high-density optical interconnects was fabricated…”
Get full text

A 20 Gbps inductorless CMOS optical receiver for short-distance VCSEL-based 850 nm optical links by Yazaki, Toru, Takai, Toshiaki, Chujo, Norio, Matsushima, Naoki, Ohhata, Kenichi

“…This paper presents a circuit design and experimental results for a 20 Gbps CMOS inductorless optical receiver, a transimpedance amplifier (TIA) and a limiting…”
Get full text

A 25 Gb/s 65-nm CMOS Low-Power Laser Diode Driver With Mutually Coupled Peaking Inductors for Optical Interconnects by Chujo, N., Takai, T., Sugawara, T., Matsuoka, Y., Kawamura, D., Adachi, K., Kawamata, T., Ohno, T., Ohhata, K.

“…A 25 Gb/s laser diode (LD) driver has been developed on the basis of standard 65 nm CMOS technology for optical interconnects. The LD driver consists of a main…”
Get full text

25-Gbps×4 optical transmitter with adjustable asymmetric pre-emphasis in 65-nm CMOS by Yazaki, Toru, Chujo, Norio, Yamashita, Hiroki, Takemoto, Takashi, Yong Lee, Matsuoka, Yasunobu

“…This paper describes the design and experiment results of 25 Gbps, 4 channels optical transmitter which consist of a vertical-cavity surface emitting laser…”
Get full text

25-Gb/s 100-m MMF Transmission Using a Prototype 1.3- \mu-Range CMOS-Based Transceiver for Optical Interconnections by Lee, Y., Kawamura, D., Takai, T., Kogo, K., Adachi, K., Sugawara, T., Chujo, N., Matsuoka, Y., Hamamura, S., Yamazaki, K., Ishigami, Y., Takemoto, T., Yuki, F., Yamashita, H., Tsuji, S.

“…A prototype transceiver composed of a 1.3-μm-range lens-integrated laser diode and photodiode as well as a complementary metal-oxide-semiconductor (CMOS) laser…”
Get full text

Femtosecond three-pulse photon echo and population grating studies of the optical properties of CdTe/ZnSe quantum dots by Van Dao, Lap, Lowe, Martin, Hannaford, Peter, Makino, Hisao, Takai, Toshiaki, Yao, Takafumi

“…Femtosecond three-pulse two-color photon echo and population grating (PG) techniques have been used to characterize CdTe quantum dots (QDs) grown on ZnSe by…”
Get full text

A 53-Gbit/s VCSEL-Based High Density Optical Assembly for Large Capacity Optical Interconnection by Kohmu, Naohiro, Takai, Toshiaki, Chujo, Norio

“…A 53-Gbit/s VCSEL-based compact optical module is proposed. In order to realize 50-Gbit/s-class optical transmission, high-bandwidth optical devices are…”
Get full text

An ultra-compact 25.78-Gbit/s × 4-ch active optical cable with a high heat-dissipation structure by Kohmu, Naohiro, Matsuoka, Yasunobu, Takai, Toshiaki, Chujo, Norio, Arimoto, Hideo

“…A 25.78-Gbit/s × 4-ch active optical cable (AOC) with a ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm 3 , which is 45-% smaller…”
Get full text

An ultra-compact 25-Gbit/s × 4-ch active optical cable with gapped ground electrode structure by Kohmu, Naohiro, Takai, Toshiaki, Chujo, Norio, Arimoto, Hideo

“…A 25.78-Gbit/s × 4-ch active optical cable (AOC) with a ultra-compact form factor is proposed. The size of the proposed AOC is 5.2 cm 3 , which is 45-% smaller…”
Get full text

Silver photodoping into Al–ZnSe for application to white light emitters by Lee, Hyun-Yong, Takai, Toshiaki, Yao, Takafumi

“…Room-temperature Ag photodoping into crystalline Al-doped ZnSe grown by molecular-beam epitaxy (MBE) has been achieved. A promising approach to apply to a…”
Get full text

7.2-Tb/s compact optical backplane using ribbon fiber sheet and high-density connector by Chujo, Norio, Nomura, Rika, Yazaki, Toru, Takai, Toshiaki, Matsushima, Naoki

“…A compact optical backplane was developed, and a ribbon fiber sheet and high-density connector were used to reduce the cost and wiring area. A bandwidth of…”
Get full text

Strong luminescence due to localized excitons in CdTe/ZnSe fractional monolayer structures by Chang, Jiho, Takai, Toshiaki, Godo, Kenji, Makino, Hisao, Goto, Takenari, Yao, Takafumi

“…Highly efficient luminescence at room temperature is achieved from a novel CdTe(thickness ⩽2 ML )/ZnSe fractional monolayer heterostructures (FMS) grown by…”
Get full text

LTCC package for high-bandwidth logic to memory interconnection by Chujo, Norio, Uematsu, Yutaka, Takai, Toshiaki, Toyama, Masahiro, Masukawa, Junichi, Yamazaki, Hiroyuki Nagatomo

“…Advancements in packaging technologies are required to meet the future bandwidth, and space- and energy-efficient demands of ICT systems. One of the key…”
Get full text

10 Tb/s scale optical interconnection system using high-density optical wiring by Chujo, Norio, Matsushima, Naoki, Mizushima, Akiko, Takai, Toshiaki, Fukumiya, Kouichi, Akutsu, Itoe

“…The bandwidth of information and communication technology (ICT) systems is increasing and is predicted to reach 10 Tb/s and over. However, an electrical…”
Get full text

A compact 25-Gbit/s × 12-ch active optical cable formed by high-density optical sub-assembly techniques by Matsuoka, Yasunobu, Kohmu, Naohiro, Takai, Toshiaki, Chujo, Norio, Arimoto, Hideo, Sato, Masataka, Komatsuzaki, Shinji, Ogura, Akira, Yamazaki, Kinya, Sunaga, Yoshinori

“…A compact 300-Gbit/s (25-Gbit/s × 12-ch) active optical cable (AOC) with a small-form-factor "DensPac™12" module was fabricated. Formed by using high-density…”
Get full text

A high-density 300-Gbit/s parallel optical interconnect module with efficient thermal dissipation characteristics by Takai, Toshiaki, Chujo, Norio, Matsushima, Naoki, Matsuoka, Yasunobu, Yong Lee, Arimoto, Hideo, Sato, Masataka, Komatsuzaki, Shinji, Ogura, Akira, Yamazaki, Kinya, Sunaga, Yoshinori

“…A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical interconnect module (OIM) with a high efficiency heat radiation structure was fabricated using a…”
Get full text

A high-density 300-Gbit/s parallel optical interconnect module with efficient optical sub-assembly techniques by Matsuoka, Yasunobu, Yong Lee, Arimoto, Hideo, Takai, Toshiaki, Chujo, Norio, Matsushima, Naoki, Sato, Masataka, Komatsuzaki, Shinji, Ogura, Akira, Yamazaki, Kinya, Sunaga, Yoshinori

“…A high-density 300-Gbit/s (25-Gbit/s × 12-ch) parallel optical-interconnect module (OIM) was fabricated by using an efficient, newly developed optical…”
Get full text