Search Results - "Tai, Tom"

Through the genetic bottleneck: O. rufipogon as a source of trait-enhancing alleles for O. sativa by McCouch, Susan R, Sweeney, Megan, Li, Jiming, Jiang, Hui, Thomson, Michael, Septiningsih, Endang, Edwards, Jeremy, Moncada, Pilar, Xiao, Jinhua, Garris, Amanda, Tai, Tom, Martinez, Cesar, Tohme, Joe, Sugiono, M, McClung, Anna, Yuan, Long Ping, Ahn, Sang-Nag

“…This paper summarizes results from a decade of collaborative research using advanced backcross (AB) populations to a) identify quantitative trait loci (QTL)…”
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Self-Perceived Stigma, Depressive Symptoms, and Suicidal Behaviors Among Female Sex Workers in China by Hong, Yan, Fang, Xiaoyi, Li, Xiaoming, Liu, Yang, Li, Mingquiang, Tai-Seale, Tom

“…Data regarding female sex workers’ (FSWs) self-perceived stigma and their mental health are limited, particularly in developing countries. This study, using a…”
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Prevalence and correlates of doctor–geriatric patient lifestyle discussions: Analysis of ADEPT videotapes by Ory, Marcia G., Yuma, Paula J., Hurwicz, Margo-Lea, Jarvis, Crystal, Barron, Kate L., Tai-Seale, Tom, Tai-Seale, Ming, Patel, Dhaval, Hackethorn, David, Bramson, Rachel, Street, Richard, Cook, Mary Ann

“…This study identifies the prevalence and correlates of physician–geriatric patient discussions about physical activity and nutrition lifestyle behaviors…”
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Effects of Photosensitive Film Sidewall Profile with Different Exposure Wavelength and Process Characteristics of Wafer Bump Technology by Jui-i Yu, Yu, R., Tai, T., Huang, D., Jau, W., Ker-Chang Hsieh, Hsieh, A., Su, S., Homing Tong

“…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
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Effects of photosensitive film sidewall profile with different exposure wavelength and process characteristics of plating bump technology by Jui-I Yu, Yu, R., Tai, T., Huang, D., Jau, W., Lin, J., Homing Tong, Ker-Chang Hsieh

“…Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film…”
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Considerations for using low dielectric constant material as re-passivation layer on 300mm wafer bump process and manufacturing benefits of flip chip package by Yu, R., Tai, T., Hsieh, A., Cheng, A., Tseng, I., Tsai, M., Homing Tong, Lee, J.J.

“…Major improvements over the last four years have removed and reduced many of these barriers with the transition from 150mm, 200mm to 300mm process wafers;…”
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