Search Results - "Taeshik Yoon"

Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process by Yoon, Taeshik, Shin, Woo Cheol, Kim, Taek Yong, Mun, Jeong Hun, Kim, Taek-Soo, Cho, Byung Jin

“…Direct measurement of the adhesion energy of monolayer graphene as-grown on metal substrates is important to better understand its bonding mechanism and…”
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Thermal expansion behavior of thin films expanding freely on water surface by Kim, Jae-Han, Jang, Kyung-Lim, Ahn, Kwangho, Yoon, Taeshik, Lee, Tae-Ik, Kim, Taek-Soo

“…Coefficient of thermal expansion (CTE) for thin film has been measured only from change in thickness because thin film has to be constrained on a solid…”
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Healing Graphene Defects Using Selective Electrochemical Deposition: Toward Flexible and Stretchable Devices by Yoon, Taeshik, Kim, Jae-Han, Choi, Jun Hyung, Jung, Dae Yool, Park, Ick-Joon, Choi, Sung-Yool, Cho, Nam Sung, Lee, Jeong-Ik, Kwon, Young-Duck, Cho, Seungmin, Kim, Taek-Soo

“…Graphene produced by chemical-vapor-deposition inevitably has defects such as grain boundaries, pinholes, wrinkles, and cracks, which are the most significant…”
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Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process by Cheol Shin, Woo, Yoon, Taeshik, Hun Mun, Jeong, Yong Kim, Taek, Choi, Sung-Yool, Kim, Taek-Soo, Jin Cho, Byung

“…We present the facile dry transfer of graphene synthesized via chemical vapor deposition on copper film to a functional device substrate. High quality uniform…”
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Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump by Kim, Youngsoon, Yoon, Taeshik, Kim, Tae-Wan, Kim, Taek-Soo, Paik, Kyung-Wook

“…Electronic devices as well as electronic packaging technology have required higher speed, I/O capability, and density. To meet these requirements, flip-chip…”
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Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process by Hwang, Jaewon, Yoon, Taeshik, Jin, Sung Hwan, Lee, Jinsup, Kim, Taek-Soo, Hong, Soon Hyung, Jeon, Seokwoo

“…RGO flakes are homogeneously dispersed in a Cu matrix through a molecular‐level mixing process. This novel fabrication process prevents the agglomeration of…”
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Liquid-assisted adhesion control of graphene–copper interface for damage-free mechanical transfer by Kang, Sumin, Yoon, Taeshik, Ma, Boo Soo, Cho, Min Sun, Kim, Taek-Soo

“…[Display omitted] •Adhesion energy of the graphene–Cu interface is controlled by various liquids.•Thermodynamic work of adhesion reveals the mechanism of…”
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Flexible and Transparent Graphene Electrode Architecture with Selective Defect Decoration for Organic Light‐Emitting Diodes by Park, Ick‐Joon, Kim, Tae In, Yoon, Taeshik, Kang, Sumin, Cho, Hyunsu, Cho, Nam Sung, Lee, Jeong‐Ik, Kim, Taek‐Soo, Choi, Sung‐Yool

“…Graphene produced by chemical vapor deposition (CVD) has attracted great interest as a transparent conducting material, due to its extraordinary…”
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Penetration and lateral diffusion characteristics of polycrystalline graphene barriers by Yoon, Taeshik, Mun, Jeong Hun, Cho, Byung Jin, Kim, Taek-Soo

“…We report penetration and lateral diffusion behavior of environmental molecules on synthesized polycrystalline graphene. Penetration occurs through graphene…”
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Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene by Ko, Yong-Ho, Lee, Jong-Dae, Yoon, Taeshik, Lee, Chang-Woo, Kim, Taek-Soo

“…The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a solder metal and the substrate during soldering can degrade the mechanical…”
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Prevention of Water Permeation by Strong Adhesion Between Graphene and SiO2 Substrate by Jung, Wonsuk, Park, Joonkyu, Yoon, Taeshik, Kim, Taek-Soo, Kim, Soohyun, Han, Chang-Soo

“…To investigate the water permeation between graphene and SiO2, CVD‐grown and exfoliated graphene samples are used, and 3× strongly‐bonded samples are prepared…”
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Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes by Kang, Sumin, Yoon, Taeshik, Kim, Seunghwan, Kim, Taek-Soo

“…The rate dependence in the thin-film delamination process has been widely studied to develop advanced transfer technologies, such as selective mechanical…”
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Prevention of Water Permeation by Strong Adhesion Between Graphene and SiO 2 Substrate by Jung, Wonsuk, Park, Joonkyu, Yoon, Taeshik, Kim, Taek‐Soo, Kim, Soohyun, Han, Chang‐Soo

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Prevention of Water Permeation by Strong Adhesion Between Graphene and SiO sub(2) Substrate by Jung, Wonsuk, Park, Joonkyu, Yoon, Taeshik, Kim, Taek-Soo, Kim, Soohyun, Han, Chang-Soo

“…To investigate the water permeation between graphene and SiO sub(2), CVD-grown and exfoliated graphene samples are used, and 3 strongly-bonded samples are…”
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Superstrong encapsulated monolayer graphene by the modified anodic bonding by Jung, Wonsuk, Yoon, Taeshik, Choi, Jongho, Kim, Soohyun, Kim, Yong Hyup, Kim, Taek-Soo, Han, Chang-Soo

“…We report a superstrong adhesive of monolayer graphene by modified anodic bonding. In this bonding, graphene plays the role of a superstrong and ultra-thin…”
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Mechanical reliability of Cu/low-k interconnects and underfill by Taeshik Yoon, Inhwa Lee, Taek-Soo Kim

“…Delamination/cracking of low-k dielectrics for Cu interconnects and underfill epoxy have significantly limited the reliability of 3D packaging. We present…”
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Direct Measurement of Adhesion Energy of Monolayer Graphene AsGrown on Copper and Its Application to Renewable Transfer Process by YOON, Taeshik, WOO CHEOL SHIN, TAEK YONG KIM, JEONG HUN MUN, KIM, Taek-Soo, BYUNG JIN CHO

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